MULTICHIP PACKAGE LINK
    2.
    发明公开

    公开(公告)号:EP3846042A1

    公开(公告)日:2021-07-07

    申请号:EP20206632.0

    申请日:2016-02-22

    申请人: INTEL Corporation

    摘要: The present disclosure provides an integrated circuit die. The integrated circuit die comprising a hard IP (HIP) subassembly comprising a plurality of hard logic blocks, a hard logic block associated with a plurality of data lanes. The plurality of data lanes having separate per-lane enables. The integrated circuit die comprising a plurality of protocol-specific logic blocks to communicate data in accordance with a corresponding plurality of data communication protocols. The plurality of protocol-specific logic blocks including a first protocol-specific logic block to communicate data in accordance with a first data communication protocol and a second protocol-specific logic block to communicate data in accordance with a second data communication protocol. The integrated circuit die comprising a soft IP (SIP) assembly having at least one soft logic block comprising routable logic to selectively map a data lane of the plurality of data lanes to the first protocol-specific logic block and a data lane of the plurality of data lanes to the second protocol-specific logic block.

    MULTICHIP PACKAGE LINK
    3.
    发明公开

    公开(公告)号:EP3796181A1

    公开(公告)日:2021-03-24

    申请号:EP20206623.9

    申请日:2016-02-22

    申请人: INTEL Corporation

    摘要: The present disclosure provides a multi-chip package comprising a substrate, a first integrated circuit (IC) die packaged onto the substrate and a second IC die packaged onto the substrate and connected to the first IC die using a multi-chip package link (MCPL). The MCPL including an upstream channel and a downstream channel each associated with a set of lanes. The first IC die comprising a CPU and an interface to connect the CPU. The interface including a physical layer (PHY) to provide a physical connection over which data is communicated between the first IC die and the second IC die. The PHY comprising a transmitter to transmit data to the second IC die, a receiver to receive data from the second IC die and a clock recovery circuit to center a clock signal in both the time domain and the voltage domain and to receive a clock signal from the second IC die over a strobe lane. To center in the time domain, the clock recovery circuit is to determine a phase of the clock signal and to adjust the phase of the clock signal. To center in the voltage domain, the clock recovery circuit is to adjust a reference voltage. The clock recovery circuit to sample data signals in accordance with the reference voltage and the clock signal using a plurality of data samplers for each lane.