摘要:
Described is an apparatus which comprises: an input sensing stage for sensing an input signal relative to another signal; a decision making circuit, coupled to the input sensing stage, for determining whether the input signal is a logic low or a logic high; and a power management circuit, coupled to the input sensing stage and the decision making circuit, which is operable to monitor a state of the decision making circuit and to disable the input sensing stage according to the monitored state. Described is an apparatus which comprises: a decision making circuit integrated with an input sensing stage, wherein the decision making circuit is operable to pre-charge its internal nodes during a phase of the clock signal; and a latching circuit to latch an output of the decision making circuit.
摘要:
The present disclosure provides an integrated circuit die. The integrated circuit die comprising a hard IP (HIP) subassembly comprising a plurality of hard logic blocks, a hard logic block associated with a plurality of data lanes. The plurality of data lanes having separate per-lane enables. The integrated circuit die comprising a plurality of protocol-specific logic blocks to communicate data in accordance with a corresponding plurality of data communication protocols. The plurality of protocol-specific logic blocks including a first protocol-specific logic block to communicate data in accordance with a first data communication protocol and a second protocol-specific logic block to communicate data in accordance with a second data communication protocol. The integrated circuit die comprising a soft IP (SIP) assembly having at least one soft logic block comprising routable logic to selectively map a data lane of the plurality of data lanes to the first protocol-specific logic block and a data lane of the plurality of data lanes to the second protocol-specific logic block.
摘要:
The present disclosure provides a multi-chip package comprising a substrate, a first integrated circuit (IC) die packaged onto the substrate and a second IC die packaged onto the substrate and connected to the first IC die using a multi-chip package link (MCPL). The MCPL including an upstream channel and a downstream channel each associated with a set of lanes. The first IC die comprising a CPU and an interface to connect the CPU. The interface including a physical layer (PHY) to provide a physical connection over which data is communicated between the first IC die and the second IC die. The PHY comprising a transmitter to transmit data to the second IC die, a receiver to receive data from the second IC die and a clock recovery circuit to center a clock signal in both the time domain and the voltage domain and to receive a clock signal from the second IC die over a strobe lane. To center in the time domain, the clock recovery circuit is to determine a phase of the clock signal and to adjust the phase of the clock signal. To center in the voltage domain, the clock recovery circuit is to adjust a reference voltage. The clock recovery circuit to sample data signals in accordance with the reference voltage and the clock signal using a plurality of data samplers for each lane.
摘要:
A system-on-a-chip, such as a logical PHY, may be divided into hard IP blocks with fixed routing, and soft IP blocks with flexible routing. Each hard IP block may provide a fixed number of lanes. Using p hard IP blocks, where each block provides n data lanes, h=n*p total hard IP data lanes are provided. Where the system design calls for k total data lanes, it is possible that k≠h, so that ┌k/n┐ hard IP blocks provide h=n*p available hard IP data lanes. In that case, h−k lanes may be disabled. In cases where lane reversals occur, such as between hard IP and soft IP, bowtie routing may be avoided by the use of a multiplexer-like programmable switch within the soft IP.