摘要:
This invention relates to semiconductor memories and includes a sense amplifier architecture in which sensed data bit lines (e.g. BL2, BL2′) are electrically isolated and shielded from their immediately adjacent active neighbors by utilization of non-selected bit lines (e.g. BL1, BL1′ and/or BL3, BL3′) as an AC ground bus. In its simplest embodiment, shielded bit line (SBL) architecture includes two pairs of opposed bit lines (BL1, BL2; BL1′, BL2′)associated with a common sense amplifier (10). One of each of the bit line pairs is multiplexed into the sense amplifier and the other unselected bit line pair is clamped to AC ground to shield the selected bit line pair from all dynamic line-to-line coupling.
摘要:
A programmable PLA circuit in which an interlaced AND/OR array (30, 32, 34) is provided which has both common input (16) and common output lines (36). Separate AND and OR functions are generated during two different timing intervals (D1, D2) such that both of the logical arrays can physically share input and output circuit elements. A binary adder is described in which pairs of array output lines are applied to the same Exclusive-NOR circuits (40) during the two time intervals to provide the Exclusive-NOR of product terms during the AND array time interval (D1) and to provide the Exclusive-NOR of sums of product terms or the sum of the Exclusive-NOR of product terms during the second time interval (D2).
摘要:
A memory system, particularly an electrically alterable read only memory system which includes a semiconductor substrate (10) having a diffusion region (12) therein defining one end of a channel region (14), a control plate (22, T1), a floating plate (20) separated from the channel region by a thin dielectric layer (16) and disposed between the control plate (22) and the channel region (14) and means (T1-T3) for transferring charge to and from the floating plate (22). A control gate (32) is coupled to the channel region (14) and is located between the diffusion region (12) and the floating plate (22). The control gate (32) may be connected to a word line and the diffusion region (12) may be connected to a bit/sense line. The channel region (14) is controlled by the word line and the presence or absence of charge on the floating plate (20). Thus, information may be read from a cell of the memory by detecting the presence or absence of charge stored in the inversion capacitor under the floating plate (20). The charge transfer means (T1-T3) includes an enhanced conduction insulator (24) and means (T1, T3) for applying appropriate voltages to the control plate (22) and to the control gate (32) to transfer charge to and from the floating plate (20) through the enhanced conduction insulator (24).
摘要:
A DRAM having on-chip ECC (30) and both bit and word redundancy that have been optimized to support the on-chip ECC. The bit line redundancy features a switching network that provides an any-for-any substitution for the bit lines in the associated memory array. The word line redundancy is provided in a separate array section (20), and has been optimized to maximize signal while reducing soft errors. The array stores data in the form of error correction words (ECWs) on each word line. A first set of data lines (formed in a zig-zag pattern to minimize unequal capacitive loading on the underlying bit lines) are coupled to read out an ECW as well as the redundant bit lines. A second set of data lines receive the ECW as corrected by bit line redundancy, and a third set of data lines receive the ECW as corrected by the word line redundancy. The third set of data lines are coupled to the ECC block, which corrects errors encountered in the ECW. The ECC circuitry (30) is optimized to reduce the access delays introduced by carrying out on-chip error correction. The ECC block (30) provides both the corrected data bits and the check bits to an SRAM (40). Thus, the check bits can be externally accessed, improving testability of the memory chip. At the same time, having a set of interrelated bits in the SRAM (40) improves access performance when using multi-bit access modes, which compensates for whatever access delays are introduced by the ECC. To maximize the efficiency of switching from mode to mode, the modes are set as a function of received address signals.
摘要:
In a memory system comprising a plurality of memory units (10) each of which possesses unit-level error correction capabilities (20) and each of which are tied to a system level error correction function (30), memory reliability is enhanced by providing means for fixing the output of one of the memory units at a fixed value in response to the occurrence of an uncorrectable error in one of the memory units. This counter-intuitive approach to the generation of forced hard errors nonetheless enhances overall memory system reliability since it enables the employment of the complement/recomplement algorithm which depends upon the presence of reproducible errors for proper operation. Thus, chip level error correction systems, which are increasingly desirable at high packaging densities, are employed in a way which does not interfere with system level error correction methods.
摘要:
Low power addressing systems are provided which include a given number of memory segments (26, 28, 30, 32, 34, 38), each having word and bit/sense lines, a given number of decoders (42, 44, 46, 48, 50, 52, 54, 56) coupled to the given number of memory segments (26, 28, 30, 32, 34, 36, 38) for selecting one word line in each of the memory segments (26, 28, 30, 32, 34, 36, 38), a first plurality of transmission gate systems (58, 60, 62, 64), each having first (92) and second (94) transmission gates, with each of the gates being coupled to a different one of the decoders (42, 44, 46, 48, 50, 52, 56), a second decoder (66) having the first plurality of outputs, each of the outputs being coupled to a respective one of the transmission gate systems (58, 60, 62, 64), first control circuits for selectively activating the first (92) and second (94) gates in each of the first plurality of transmission gate systems (58, 60, 62, 64), a third given number of decoders (68, 70, 72, 74, 76, 80, 82) coupled to the given number of memory segments (26, 28, 30, 32, 34, 36, 38) for selecting one bit/sense line in each of the memory segments (26, 28, 30, 32, 34, 36, 38), a second plurality of transmission gate systems (84, 86, 88, 90), each having first (102) and second (104) transmission gates, with each of the gates of the second plurality of transmission gate systems (84, 86, 88, 90) being coupled to a different one of the third given number of decoders (26, 28, 30, 32, 34, 36, 38), and second control circuits for selectively activating the first (102) and second (104) gates of each of the third plurality of transmission gate systems (26, 28, 30, 32, 34, 36, 38).
摘要:
A DRAM having on-chip ECC (30) and both bit and word redundancy that have been optimized to support the on-chip ECC. The bit line redundancy features a switching network that provides an any-for-any substitution for the bit lines in the associated memory array. The word line redundancy is provided in a separate array section (20), and has been optimized to maximize signal while reducing soft errors. The array stores data in the form of error correction words (ECWs) on each word line. A first set of data lines (formed in a zig-zag pattern to minimize unequal capacitive loading on the underlying bit lines) are coupled to read out an ECW as well as the redundant bit lines. A second set of data lines receive the ECW as corrected by bit line redundancy, and a third set of data lines receive the ECW as corrected by the word line redundancy. The third set of data lines are coupled to the ECC block, which corrects errors encountered in the ECW. The ECC circuitry (30) is optimized to reduce the access delays introduced by carrying out on-chip error correction. The ECC block (30) provides both the corrected data bits and the check bits to an SRAM (40). Thus, the check bits can be externally accessed, improving testability of the memory chip. At the same time, having a set of interrelated bits in the SRAM (40) improves access performance when using multi-bit access modes, which compensates for whatever access delays are introduced by the ECC. To maximize the efficiency of switching from mode to mode, the modes are set as a function of received address signals.
摘要:
In a memory system comprising a plurality of memory units (10) each of which possesses unit-level error correction capabilities (20) and each of which are tied to a system level error correction function (30), memory reliability is enhanced by providing means (Fig. 2) for disabling the unit-level error correction capability, for example, in response to the occurrence of an uncorrectable error in one of the memory units. This counter-intuitive approach which disables an error correction function nonetheless enhances overall memory system reliability since it enables the employment of the complement/recomplement algorithm which depends upon the presence of reproducible errors for proper operation. Thus, chip level error correction systems, which are increasingly desirable at high packaging densities, are employed in a way which does not interfere with system level error correction methods.
摘要:
A programmable PLA circuit in which an interlaced AND/OR array (30, 32, 34) is provided which has both common input (16) and common output lines (36). Separate AND and OR functions are generated during two different timing intervals (D1, D2) such that both of the logical arrays can physically share input and output circuit elements. A binary adder is described in which pairs of array output lines are applied to the same Exclusive-NOR circuits (40) during the two time intervals to provide the Exclusive-NOR of product terms during the AND array time interval (D1) and to provide the Exclusive-NOR of sums of product terms or the sum of the Exclusive-NOR of product terms during the second time interval (D2).
摘要:
In a memory system comprising a plurality of memory units (10) each of which possesses unit-level error correction capabilities (20) and each of which are tied to a system level error correction function (30), memory reliability is enhanced by providing means (Fig. 2) for disabling the unit-level error correction capability, for example, in response to the occurrence of an uncorrectable error in one of the memory units. This counter-intuitive approach which disables an error correction function nonetheless enhances overall memory system reliability since it enables the employment of the complement/recomplement algorithm which depends upon the presence of reproducible errors for proper operation. Thus, chip level error correction systems, which are increasingly desirable at high packaging densities, are employed in a way which does not interfere with system level error correction methods.