公开(公告)号：EP3314648A1

公开(公告)日：2018-05-02

申请号：EP15896530.1

申请日：2015-06-25

申请人： Intel Corporation

发明人： LEE, Kyu-Oh ,  SALAMA, Islam, A.

IPC分类号： H01L25/065 ,  H01L23/48

CPC分类号： H01L23/49838 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/48 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/50 ,  H01L23/5385 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2223/6666 ,  H01L2224/16157 ,  H01L2224/16197 ,  H01L2224/16225 ,  H01L2924/1205 ,  H01L2924/15311

摘要： Disclosed herein are integrated circuit (IC) structures having interposers with recesses. For example, an IC structure may include: an interposer having a resist surface; a recess disposed in the resist surface, wherein a bottom of the recess is surface-finished; and a plurality of conductive contacts located at the resist surface. Other embodiments may be disclosed and/or claimed.

公开(公告)号：EP3314649A1

公开(公告)日：2018-05-02

申请号：EP15896531.9

申请日：2015-06-25

申请人： Intel Corporation

发明人： LEE, Kyu-Oh ,  SALAMA, Islam A. ,  VISWANATH, Ram S. ,  SANKMAN, Robert L. ,  SABI, Babak ,  CHAVALI, Sri Chaitra Jyotsna

IPC分类号： H01L25/065 ,  H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/13 ,  H01L23/48 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/11 ,  H01L24/17 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/15311

摘要： Disclosed herein are integrated circuit (IC) structures having recessed conductive contacts for package on package (PoP). For example, an IC structure may include: an IC package having a first resist surface; a recess disposed in the first resist surface, wherein a bottom of the recess includes a second resist surface; a first plurality of conductive contacts located at the first resist surface; and a second plurality of conductive contacts located at the second resist surface. Other embodiments may be disclosed and/or claimed.

公开(公告)号：EP3195355A1

公开(公告)日：2017-07-26

申请号：EP14902138.8

申请日：2014-09-19

申请人： Intel Corporation

发明人： LEE, Kyu-Oh

IPC分类号： H01L23/48

CPC分类号： H01L23/5386 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0655 ,  H01L2221/68359 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/75743 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/97 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15313 ,  H05K3/4682 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2924/014

摘要： Semiconductor packages with embedded bridge interconnects, and related assemblies and methods, are disclosed herein. In some embodiments, a semiconductor package may have a first side and a second side, and may include a bridge interconnect, embedded in a build-up material, having a first side with a plurality of conductive pads. The semiconductor package may also include a via having a first end that is narrower than a second end. The bridge interconnect and via may be arranged so that the first side of the semiconductor package is closer to the first side of the bridge interconnect than to the second side of the bridge interconnect, and so that the first side of the semiconductor package is closer to the first end of the via than to the second end of the via. Other embodiments may be disclosed and/or claimed.

摘要翻译： 本文公开了具有嵌入式桥接互连的半导体封装以及相关的组件和方法。 在一些实施例中，半导体封装可以具有第一侧和第二侧，并且可以包括嵌入在积层材料中的桥接互连，该桥接互连具有带有多个导电焊盘的第一侧。 半导体封装还可以包括具有比第二端更窄的第一端的通孔。 桥接互连和通孔可以被布置为使得半导体封装的第一侧更靠近桥接互连的第一侧而不是桥接互连的第二侧，并且使得半导体封装的第一侧更接近于 通孔的第一端而不是通孔的第二端。 其他实施例可以被公开和/或要求保护。

公开(公告)号：EP3195355B1

公开(公告)日：2020-11-25

申请号：EP14902138.8

申请日：2014-09-19

申请人： Intel Corporation

发明人： LEE, Kyu-Oh

IPC分类号： H01L23/48 ,  H01L23/498 ,  H01L21/48