公开(公告)号：EP2892077A8

公开(公告)日：2016-02-17

申请号：EP15153677.8

申请日：2011-06-28

申请人： Intel Corporation

发明人： Nalla, Ravi, K. ,  Manusharow, Mathew, J. ,  Delaney, Drew

IPC分类号： H01L23/538

CPC分类号： H01L23/481 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/25 ,  H01L24/48 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2224/82105 ,  H01L2224/82106 ,  H01L2224/83203 ,  H01L2224/92244 ,  H01L2225/1035 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package comprising: a substrate (210); a first die (220) and a second die (260), both of which are embedded in the substrate, both of which have a front side (221, 261) and an opposing back side (222, 262), and both of which have at least one through-silicon-via (223, 263) therein; a plurality of build-up layers (230) adjacent to and built up over the front sides of the first and second dies; and an electrically conductive structure (240) adjacent to and in physical contact with the back sides of the first and second dies.