公开(公告)号：EP3343600A1

公开(公告)日：2018-07-04

申请号：EP16207050.2

申请日：2016-12-28

申请人： Siemens Aktiengesellschaft

发明人： Zaiser, Georg

IPC分类号： H01L23/00 ,  H01L25/07

CPC分类号： H01L24/24 ,  H01L24/40 ,  H01L24/48 ,  H01L24/82 ,  H01L24/85 ,  H01L24/92 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/02163 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24137 ,  H01L2224/245 ,  H01L2224/40137 ,  H01L2224/45014 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/82101 ,  H01L2224/82106 ,  H01L2224/92137 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/1304 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/01079 ,  H01L2224/45099

摘要： Die Erfindung betrifft ein Halbleitermodul (1) mit einem Substrat (2), mit einem Halbleiterchip (6), welcher auf dem Substrat (2) angeordnet ist, und mit einem ersten Verbindungselement (12) zum elektrischen Verbinden des Halbleiterchips (6) mit einer Leiterbahn (7) und/oder einem weiteren Bauelement des Halbleitermoduls (1), wobei das erste Verbindungselement (12) zumindest bereichsweise flächig an dem Halbleiterchip (6) und dem Substrat (2) sowie der Leiterbahn (7) und/oder dem weiteren Bauelement anliegt, wobei das Halbleitermodul (1) ein zweites Verbindungselement (13) zum elektrischen Verbinden des Halbleiterchips (6) mit der Leiterbahn (7) und/oder dem weiteren Bauelement aufweist, wobei das zweite Verbindungselement (13) als Draht oder als Band ausgebildet ist.

公开(公告)号：EP2589077A2

公开(公告)日：2013-05-08

申请号：EP11804112.8

申请日：2011-06-28

申请人： Intel Corporation

发明人： NALLA, Ravi, K. ,  MANUSHAROW, Mathew, J. ,  DELANEY, Drew

IPC分类号： H01L23/48 ,  H05K3/46 ,  H01L21/60

CPC分类号： H01L23/481 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/25 ,  H01L24/48 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2224/82105 ,  H01L2224/82106 ,  H01L2224/83203 ,  H01L2224/92244 ,  H01L2225/1035 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package includes a substrate (110), a die (120) embedded within the substrate, the die having a front side (121) and a back side (122) and a through-silicon-via (123) therein, build-up layers (130) built up over the front side of the die, and a power plane (140) in physical contact with the back side of the die. In another embodiment, the microelectronic package comprises a substrate (210), a first die (220) and a second die (260) embedded in the substrate and having a front side (221, 261) and a back side (222, 262) and a through-silicon-via (223, 263) therein, build-up layers (230) over the front sides of the first and second dies, and an electrically conductive structure (240) in physical contact with the back sides of the first and second dies.

公开(公告)号：EP2580776A1

公开(公告)日：2013-04-17

申请号：EP11792589.1

申请日：2011-06-10

申请人： NEC Corporation ,  IMEC

发明人： FUNAYA, Takuo ,  IKER, Francois ,  BEYNE, Eric

IPC分类号： H01L23/12 ,  H01L21/3205 ,  H01L23/52

CPC分类号： H01L21/486 ,  H01L21/76802 ,  H01L21/76819 ,  H01L23/522 ,  H01L23/525 ,  H01L23/5389 ,  H01L24/02 ,  H01L24/05 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02317 ,  H01L2224/02321 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/21 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24105 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/24246 ,  H01L2224/245 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/32147 ,  H01L2224/32227 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/821 ,  H01L2224/82101 ,  H01L2224/82104 ,  H01L2224/82106 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

摘要： According to a method of redistributing a functional element of the present invention, an insulating resin layer is supplied onto a functional element wafer such as an LSI. A portion to be a via hole on an electrode pad of the functional element is filled with a sacrificial layer. The top of the sacrificial layer filled in the via hole is exposed from the insulating layer by grinding or polishing. Therefore, it is possible to prevent breakage of a brittle material such as a low-k material in the functional element, which would be caused by transmission of shearing stress when a conventional pillar or a conventional gold projecting electrode is used. The reliability, the yield, and the level of flatness can be improved by forming an interconnection conductive layer after the flattening process of grinding or polishing. Accordingly, a fine conductive interconnection can be formed.

公开(公告)号：EP3083248A4

公开(公告)日：2017-08-30

申请号：EP14871982

申请日：2014-12-19

申请人： UNIV CALIFORNIA

发明人： COLEMAN TODD PRENTICE ,  KIM YUN SOUNG ,  BAJEMA MICHAEL ,  WEINREB ROBERT N

IPC分类号： B32B37/00 ,  H01K1/18 ,  H01L21/67 ,  H01L21/68 ,  H01L23/00 ,  H01L33/62 ,  H05K1/02 ,  H05K3/46

CPC分类号： H05K1/118 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/145 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L33/62 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/25175 ,  H01L2224/82005 ,  H01L2224/82051 ,  H01L2224/82106 ,  H01L2224/82951 ,  H01L2224/97 ,  H01L2933/0066 ,  H05K1/025 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/303 ,  H05K3/4644 ,  H05K3/465 ,  H05K3/4682 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/10037 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10522 ,  H05K2203/0173 ,  H05K2203/1316 ,  H05K2203/1469 ,  H05K3/467 ,  H01L2224/82

公开(公告)号：EP2892077A8

公开(公告)日：2016-02-17

申请号：EP15153677.8

申请日：2011-06-28

申请人： Intel Corporation

发明人： Nalla, Ravi, K. ,  Manusharow, Mathew, J. ,  Delaney, Drew

IPC分类号： H01L23/538

CPC分类号： H01L23/481 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/25 ,  H01L24/48 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2224/82105 ,  H01L2224/82106 ,  H01L2224/83203 ,  H01L2224/92244 ,  H01L2225/1035 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package comprising: a substrate (210); a first die (220) and a second die (260), both of which are embedded in the substrate, both of which have a front side (221, 261) and an opposing back side (222, 262), and both of which have at least one through-silicon-via (223, 263) therein; a plurality of build-up layers (230) adjacent to and built up over the front sides of the first and second dies; and an electrically conductive structure (240) adjacent to and in physical contact with the back sides of the first and second dies.

公开(公告)号：EP2647269B1

公开(公告)日：2015-03-04

申请号：EP11794257.3

申请日：2011-12-02

申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO

发明人： VAN DEN BRAND, Jeroen ,  KUSTERS, Roel Henry Louis ,  DIETZEL, Andreas Heinrich

IPC分类号： H05K3/32 ,  H01L23/49 ,  H05K1/02 ,  H05K1/18 ,  H01L23/00 ,  H01L23/498 ,  H05K3/30 ,  H05K3/12

CPC分类号： H05K3/32 ,  H01L23/4985 ,  H01L24/24 ,  H01L24/76 ,  H01L24/82 ,  H01L2224/2405 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/25171 ,  H01L2224/25175 ,  H01L2224/76155 ,  H01L2224/76261 ,  H01L2224/766 ,  H01L2224/767 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2224/82106 ,  H01L2224/82874 ,  H01L2224/9202 ,  H01L2224/92144 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0283 ,  H05K1/189 ,  H05K3/12 ,  H05K3/305 ,  H05K2201/10674 ,  H05K2203/107 ,  H05K2203/1469 ,  H05K2203/1545 ,  H05K2203/175 ,  Y10T29/49133 ,  Y10T29/53178 ,  H01L2924/00

公开(公告)号：EP2461658A1

公开(公告)日：2012-06-06

申请号：EP10193724.1

申请日：2010-12-03

申请人： Nederlandse Organisatie voor Toegepast -Natuurwetenschappelijk Onderzoek TNO

发明人： van den Brand, Jeroen ,  Kusters, Roel Henry Louis ,  Dietzel, Andreas Heinrich

IPC分类号： H05K3/32 ,  H01L23/00

CPC分类号： H05K3/32 ,  H01L23/4985 ,  H01L24/24 ,  H01L24/76 ,  H01L24/82 ,  H01L2224/2405 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/25171 ,  H01L2224/25175 ,  H01L2224/76155 ,  H01L2224/76261 ,  H01L2224/766 ,  H01L2224/767 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2224/82106 ,  H01L2224/82874 ,  H01L2224/9202 ,  H01L2224/92144 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0283 ,  H05K1/189 ,  H05K3/12 ,  H05K3/305 ,  H05K2201/10674 ,  H05K2203/107 ,  H05K2203/1469 ,  H05K2203/1545 ,  H05K2203/175 ,  Y10T29/49133 ,  Y10T29/53178 ,  H01L2924/00

摘要： A method is presented for assembling a component (30) with a flexible substrate (10), the component having electric contacts (31). The method comprises the steps of
- placing the component (30) on a first main side (11) of the substrate,
- applying a machine vision step to estimate a position of the electric contacts,
- depositing one or more layers (32) of an electrically conductive material or a precursor thereof, said layer extending over an area of the substrate defined by the component to laterally beyond said area,
- calculating partitioning lines depending on the estimated position of the electric contacts,
- partitioning the layer into mutually insulated areas (32d) by locally removing material from said layer along said partitioning lines.
Also an apparatus is presented that is suitable for carrying out the method. In addition an assembly is present that can be obtained by the method and the apparatus according to the invention.

摘要翻译： 一种方法，提出了一种用于组装具有柔性基板（10），具有电触头（31）中的组件的组件（30）。 该方法包括以下步骤： - 将在基片上的第一主侧（11）的部件（30）， - 将机器视觉步骤来估计电触点的位置， - 沉积的一层或多层（32） 的导电材料或其前体，所述层由所述部件界定的衬底的区域之上延伸到超出所述区域尾盘反弹， - 计算分割线取决于电触点的估计位置， - 所述层划分成相互绝缘的区域 （32D）通过局部地从沿着所述分割线所述层去除材料。 等呈现装置所做的是适合于执行该方法。 除了组件的存在并可以通过该方法和装置gemäß发明来获得。

公开(公告)号：EP3083248A2

公开(公告)日：2016-10-26

申请号：EP14871982.6

申请日：2014-12-19

申请人： The Regents of the University of California

发明人： COLEMAN, Todd, Prentice ,  KIM, Yun, Soung ,  BAJEMA, Michael ,  WEINREB, Robert, N.

IPC分类号： B32B37/00 ,  H01L21/67 ,  H01L21/68

CPC分类号： H05K1/118 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/145 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L33/62 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/25175 ,  H01L2224/82005 ,  H01L2224/82051 ,  H01L2224/82106 ,  H01L2224/82951 ,  H01L2224/97 ,  H01L2933/0066 ,  H05K1/025 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/303 ,  H05K3/4644 ,  H05K3/465 ,  H05K3/4682 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/10037 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10522 ,  H05K2203/0173 ,  H05K2203/1316 ,  H05K2203/1469 ,  H05K3/467 ,  H01L2224/82

摘要： Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased in the template.

摘要翻译： 公开的是用于制造电子电路，设备，和系统的高度可伸缩的制造方法。 在一个方面中，一种制造方法包括：在上的基材，包括柔性和电绝缘材料的位置处附连到电子元件; 形成模板，通过在一个相沉积材料到电子部件的表面和所述基板上符合，并且使改变到固体形式的材料来包住电子元件; 和通过在该衬底上形成开口部的制造电路或电子装置，以暴露所述电子部件的导电部分，产生耦合到至少一些所述导电部的在所选择的排列在基片上的电互连，并沉积电绝缘层 并在基板上的电互连的柔性材料，以形成电路，其中，所述产生电路或电子设备被封装的柔性基底。

公开(公告)号：EP2763196A3

公开(公告)日：2016-02-17

申请号：EP13160132.0

申请日：2013-03-20

申请人： Kabushiki Kaisha Toshiba

发明人： Tomizawa, Hideyuki ,  Kojima, Akihiro ,  Shimada, Miyoko ,  Akimoto, Yosuke ,  Sugizaki, Yoshiaki ,  Furuyama, Hideto

IPC分类号： H01L33/48 ,  H01L33/62 ,  H01L33/00 ,  H01L23/00

CPC分类号： H01L33/62 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L33/0079 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/13 ,  H01L2224/24225 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/9202 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2224/82

摘要： According to one embodiment, a semiconductor light emitting device includes: a semiconductor layer (15); a first electrode (16); a first interconnection layer (21); a second electrode (17); a second interconnection layer (22); a support substrate (25); a bonding layer (27); a first terminal (23a); and a second terminal (24a). The support substrate (25) has a third face (25a) facing the semiconductor layer (15), the first interconnection layer (21), and the second interconnection layer (22) and a fourth face (25b) opposite to the third face (25a). The support substrate (25) has a first opening (92a) extending from the fourth face (25b) to the first interconnection layer (21) and a second opening (92b) extending from the fourth face (25b) to the second interconnection layer (22). The bonding layer (27) is provided between the support substrate (25) and each of the semiconductor layer (15), the first interconnection layer (21), and the second interconnection layer (22).

公开(公告)号：EP2589077A4

公开(公告)日：2014-09-03

申请号：EP11804112

申请日：2011-06-28

申请人： INTEL CORP

发明人： NALLA RAVI K ,  MANUSHAROW MATHEW J ,  DELANEY DREW

IPC分类号： H01L23/538

CPC分类号： H01L23/481 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/25 ,  H01L24/48 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2224/82105 ,  H01L2224/82106 ,  H01L2224/83203 ,  H01L2224/92244 ,  H01L2225/1035 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207