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12 条记录 (耗时 0.011 秒)

    Flexible finned heat exchanger
    3.
    发明公开
    Flexible finned heat exchanger 失效
    MitKühlrippenversehener flexiblerWärmetauscher。

    公开(公告)号：EP0243710A2

    公开(公告)日：1987-11-04

    申请号：EP87104809.6

    申请日：1987-04-01

    申请人： International Business Machines Corporation

    发明人： Flint, Ephraim B. ,  Gruber, Peter A. ,  Grebe, Kurt R. ,  Zingher,Arther R.

    IPC分类号： H01L23/46 ,  H01L23/42 ,  H01L23/36

    CPC分类号： H01L23/467 ,  F28F3/048 ,  F28F19/06 ,  F28F21/085 ,  F28F2255/02 ,  F28F2255/14 ,  H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat exchanger 36 for cooling an array of electric circuit chips 22 disposed on a common substrate 24 is formed as a flexible sheet 38 of thermally conducting material with upstanding fins 40 for transference of heat from the chips to a coolant flowing through the fins. The sheet may be provided with corrugations 44 set between sites of the chips for improved flexibility to accommodate individual orientations of the chips. The sheet is sufficiently large to cover an array of chips and is secured adheringly, as by use of a thermally conductive grease, to the chips. The sheet hermetically seals the chips from contamination by the coolant. The heat exchanger may be fabricated of copper with a nickel coating, wherein the copper provides the heat conduction and the nickel protects the copper from a corrosive coolant such as water. The finned sheet may be efficiently fabricated by processes analogous to those used to make printed circuits. In one embodiment of the heat exchanger, the fin thickness, the fin spacing and the sheet thickness are all approximately equal, a typical sheet thickness being approximately 0.05 mm.

    摘要翻译： 用于冷却设置在公共基板24上的电路芯片22的阵列的热交换器36形成为导热材料的柔性片38，其具有用于将热从芯片传递到流过翅片的冷却剂的直立翅片40。 片材可以设置在芯片的位置之间设置的波纹44，以提高柔性以适应芯片的各个取向。 片材足够大以覆盖芯片阵列，并且通过使用导热油脂将密封件固定到芯片上。 片材气密地密封芯片以免受冷却剂的污染。 热交换器可以由具有镍涂层的铜制成，其中铜提供热传导，并且镍保护铜免受诸如水的腐蚀性冷却剂的影响。 翅片可以通过与用于制造印刷电路的那些类似的工艺有效地制造。 在热交换器的一个实施例中，翅片厚度，翅片间距和片材厚度大致相等，典型的板厚度为约0.05mm。

    Apparatus for temperature control of electronic devices
    4.
    发明公开
    Apparatus for temperature control of electronic devices 失效
    温暖的天气变化。

    公开(公告)号：EP0403781A2

    公开(公告)日：1990-12-27

    申请号：EP90109002.7

    申请日：1990-05-12

    申请人： International Business Machines Corporation

    发明人： Grebe, Kurt R. ,  Schwall, Robert E. ,  Tong, Ho-Ming

    IPC分类号： H01L23/44

    CPC分类号： H01L23/427 ,  H01L23/445 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The superior thermal conductivity of immersion cooling combined with the service convenience of conduction cooling is provided through the use of unitary thermal transfer replaceable units (1) positioned beneath a refrigeration source (4). Each unit (1) contains electronic devices (6) in a thermal transfer fluid (8). The unit construction permits replaceability in service without exposing a central fluid reservoir or opening a refrigerator.

    摘要翻译： 通过使用位于制冷源（4）下方的单一热转印可更换单元（1），提供浸入式冷却的优良导热性以及传导冷却的便利性。 每个单元（1）在热传递流体（8）中包含电子设备（6）。 单元结构允许在不暴露中央流体储存器或打开冰箱的情况下可更换性。

    Method for conditioning an organic polymeric material
    5.
    发明公开
    Method for conditioning an organic polymeric material 失效
    Verfahren zur Vorbehandlung von Kunststoffsubstraten。

    公开(公告)号：EP0374487A2

    公开(公告)日：1990-06-27

    申请号：EP89121299.5

    申请日：1989-11-17

    申请人： International Business Machines Corporation

    发明人： Viehbeck, Alfred ,  Buchwalter, Stephen L. ,  Donson, William A. ,  Glenning, John J. ,  Goldberg, Martin J. ,  Grebe, Kurt R. ,  Kovac, Caroline A. ,  Matthew, Linda C. ,  Pawlowski, Walter P. ,  Schadt, Mark J. ,  Scheuermann, Michael R. ,  Tisdale, Stephen L.

    IPC分类号： C23C18/28

    CPC分类号： C23C18/1608 ,  C23C18/166 ,  C23C18/2086 ,  C23C18/28 ,  C23C18/30 ,  H05K3/381 ,  Y10S525/903

    摘要： Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the de­sirable characteristic of good adhesion to the poly­meric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.

    摘要翻译： 某些有机聚合材料能够可逆地接受或捐赠来自还原剂的电子。 聚合物中的氧化还原位点接受电子，结果发生聚合物的性质变化。 该改变可用于改性或蚀刻聚合物材料。 可以通过在受控的深度将金属种子并入材料中来修饰材料。 种子通过金属阳离子与聚合物中的氧化还原位点的相互作用而引入，这导致阳离子的还原形成中性金属种子。 随后将包含种子的聚合材料暴露于无电镀浴中导致具有对聚合材料具有良好粘附性的所需特性的金属的进一步沉积。 当聚合物的氧化还原位点已经接受电子时，聚合物材料的蚀刻可以作为聚合物在非质子传递溶剂中的溶解度增加的结果来进行。 增加的溶解度允许在已经还原的聚合材料的某些区域中蚀刻开口，留下其它区域不变。

    Methods and apparatus for precise alignment of objects
    7.
    发明公开
    Methods and apparatus for precise alignment of objects 失效
    对象精确对齐的方法和设备

    公开(公告)号：EP0463457A3

    公开(公告)日：1992-04-08

    申请号：EP91109553.7

    申请日：1991-06-11

    申请人： International Business Machines Corporation

    发明人： Cina, Michael F. ,  Cohen, Mitchell S. ,  Flint, Ephraim B. ,  Grebe, Kurt R. ,  Hall, Douglas J. ,  Jackdon, Kenneth P. ,  Oprysko, Modest M.

    IPC分类号： H05K13/00 ,  G03B41/00 ,  H05K13/04

    CPC分类号： H01L21/681 ,  G02B6/4224 ,  G02B6/4226 ,  G02B6/4236 ,  G02B6/4249 ,  Y10T29/49131 ,  Y10T29/49133

    摘要： Methods and apparatus are set forth for passively and precisely aligning pairs of objects, in particular, microelectronic components such as semiconductor lasers and fibers, utilizing fiducial marks. Additionally, methods and apparatus are set forth for combining passive and active alignment techniques where high degrees of alignment precision are required. Still further, techniques are described for fixing prealigned objects, independent of how the objects are prealigned, to a mounting surface in a manner that maintains the relative (aligned) position of the objects. Further yet, in order to help minimize manufacturing costs with respect to production of, for example, microelectronic assemblies, batch processing techniques are described which utilize the novel alignment procedures contemplated by the invention. In principle a transparent alignment plate (500) is used having a plurality of fiducial marks (516, 518) imprinted thereon at least one pair of objects (412, 510, 511) is provided, each having a fiducial mark (515, 517) imprint corresponding to one of said plurality of fiducial marks (516, 518) located on said transparent alignment plate (500), means are provided for optically aligning the fiducial mark (515, 517) located on each object (412, 510, 511) of said at least one pair of objects with the corresponding fiducial marks (516, 518) on said transparent alignment plate (500), thereby yielding at least one pair of passively aligned objects (412, 510, 511).

    Apparatus for temperature control of electronic devices
    8.
    发明公开
    Apparatus for temperature control of electronic devices 失效
    电子设备温度控制装置

    公开(公告)号：EP0403781A3

    公开(公告)日：1991-11-13

    申请号：EP90109002.7

    申请日：1990-05-12

    申请人： International Business Machines Corporation

    发明人： Grebe, Kurt R. ,  Schwall, Robert E. ,  Tong, Ho-Ming

    IPC分类号： H01L23/44

    CPC分类号： H01L23/427 ,  H01L23/445 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The superior thermal conductivity of immersion cooling combined with the service convenience of conduction cooling is provided through the use of unitary thermal transfer replaceable units (1) positioned beneath a refrigeration source (4). Each unit (1) contains electronic devices (6) in a thermal transfer fluid (8). The unit construction permits replaceability in service without exposing a central fluid reservoir or opening a refrigerator.

    摘要翻译： 通过使用位于制冷源（4）下方的单一热转印可更换单元（1），提供浸入式冷却的优良导热性以及传导冷却的便利性。 每个单元（1）在热传递流体（8）中包含电子设备（6）。 单元结构允许在不暴露中央流体储存器或打开冰箱的情况下可更换性。

    Flexible finned heat exchanger
    9.
    发明公开
    Flexible finned heat exchanger 失效
    柔性热交换器

    公开(公告)号：EP0243710A3

    公开(公告)日：1989-11-29

    申请号：EP87104809.6

    申请日：1987-04-01

    申请人： International Business Machines Corporation

    发明人： Flint, Ephraim B. ,  Gruber, Peter A. ,  Grebe, Kurt R. ,  Zingher,Arther R.

    IPC分类号： H01L23/46 ,  H01L23/42 ,  H01L23/36

    CPC分类号： H01L23/467 ,  F28F3/048 ,  F28F19/06 ,  F28F21/085 ,  F28F2255/02 ,  F28F2255/14 ,  H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat exchanger 36 for cooling an array of electric circuit chips 22 disposed on a common substrate 24 is formed as a flexible sheet 38 of thermally conducting material with upstanding fins 40 for transference of heat from the chips to a coolant flowing through the fins. The sheet may be provided with corrugations 44 set between sites of the chips for improved flexibility to accommodate individual orientations of the chips. The sheet is sufficiently large to cover an array of chips and is secured adheringly, as by use of a thermally conductive grease, to the chips. The sheet hermetically seals the chips from contamination by the coolant. The heat exchanger may be fabricated of copper with a nickel coating, wherein the copper provides the heat conduction and the nickel protects the copper from a corrosive coolant such as water. The finned sheet may be efficiently fabricated by processes analogous to those used to make printed circuits. In one embodiment of the heat exchanger, the fin thickness, the fin spacing and the sheet thickness are all approximately equal, a typical sheet thickness being approximately 0.05 mm.