公开(公告)号：EP3374994A1

公开(公告)日：2018-09-19

申请号：EP16864817.8

申请日：2016-11-07

申请人： Invensas Corporation

发明人： SUN, Zhuowen ,  CHEN, Yong ,  BANG, Kyong-Mo

IPC分类号： G11C11/408 ,  G11C5/06 ,  G11C8/18 ,  G11C11/409 ,  H01L23/02 ,  H01L23/64 ,  H01L25/065 ,  H01L25/18

CPC分类号： G11C11/4087 ,  G11C5/063 ,  G11C8/18 ,  G11C11/409 ,  H01L23/02 ,  H01L23/3128 ,  H01L23/64 ,  H01L25/0652 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00

摘要： A microelectronic assembly can include an address bus comprising a plurality of signal conductors each passing sequentially through first, second, third, and fourth connection regions, and first and second microelectronic packages. The first microelectronic package can include first and second microelectronic elements, and the second microelectronic package can include third and fourth microelectronic elements. Each microelectronic element can be electrically coupled to the address bus via the respective connection region. An electrical characteristic between the first and second connection regions can be within a same tolerance of the electrical characteristic between the second and third connection regions.

公开(公告)号：EP2803087A1

公开(公告)日：2014-11-19

申请号：EP12816397.9

申请日：2012-12-19

申请人： Invensas Corporation

发明人： HABA, Belgacem ,  BANG, Kyong-Mo

IPC分类号： H01L25/10 ,  H01L23/538 ,  H01L25/065 ,  H01L23/34

CPC分类号： H01L25/0655 ,  B81C1/00301 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/367 ,  H01L24/13 ,  H01L24/16 ,  H01L24/20 ,  H01L24/48 ,  H01L24/49 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/221 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/96 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A microelectronic assembly includes a first microelectronic package having a substrate with first and second opposed surfaces and substrate contacts thereon. The first package further includes first and second microelectronic elements, each having element contacts electrically connected with the substrate contacts and being spaced apart from one another on the first surface so as to provide an interconnect area of the first surface between the first and second microelectronic elements. A plurality of package terminals at the second surface are electrically interconnected with the substrate contacts for connecting the package with a component external thereto. A plurality of stack terminals are exposed at the first surface in the interconnect area for connecting the package with a component overlying the first surface of the substrate. The assembly further includes a second microelectronic package overlying the first microelectronic package and having terminals joined to the stack terminals of the first microelectronic package.