摘要:
To provide a silicone resin-based thermosetting resin composition that can obtain a hardened material having a high refractive index and a good heat resistance. A solution is a liquid organosilicon compound represented by general formula (1) as described below: (1) wherein, X is each independently a group represented by formula (I), formula (II) or formula (III) as described below, and when the number of the group represented by formula (I) per one molecule of the liquid organosilicon compound represented by general formula (1) (or the number of groups per one mean molecule of the compound when the compound is a mixture having a different ratio for the group represented by formula (I), the group represented by formula (II) and the group represented by formula (III) ) is defined as a, the number of the group represented by formula (II) per one molecule thereof is defined as b, and the number of the group represented by formula (III) per one molecule thereof is defined as c, 0 ‰¤ a ‰¤ 3.5, 0 ‰¤ b ‰¤ 3.5, and 0 ‰¤ c ‰¤ 1 are obtained, and also a + b + 2c = 4 is obtained: wherein, R 1 is each independently a group selected from alkyl having 1 to 4 carbons, cyclopentyl and cyclohexyl, R 2 and R 3 are each independently a group selected from alkyl having 1 to 4 carbons, cyclopentyl, cyclohexyl and phenyl, m and n are the number of repetitions of -OSi(R 3 ) 2 -, and a mean value satisfying 1 to 50.
摘要:
The present invention is contemplated for providing a thermosetting resin composition having all of heat resistance, UV resistance and a high refractive index, and the thermosetting resin composition having high adhesion and improved moisture-absorption reflow resistance, heat cycle resistance and sulfur resistance and being excellent in reliability as an LED sealing agent. The invention relates to the thermosetting resin composition containing (A) to (D): (A) a thermosetting resin containing an SiH group and an alkenyl group, being a reaction product between silsesquioxane having an SiH group and an organopolysiloxane having two alkenyl groups; (B) a thermosetting resin having an SiH group as obtained by allowing reaction among silsesquioxane having an SiH group, organopolysiloxane having two alkenyl groups, an epoxy compound having an alkenyl group and a silyl compound having an alkenyl group; (C) a linear organopolysiloxane compound having an SiH group only at one terminal; and (D) a Pt catalyst.
摘要:
The invention relates to a thermosetting resin composition containing (A) to (D) below. (A) A thermosetting resin containing an SiH group and an alkenyl group, wherein the thermosetting resin is a reaction product between silsesquioxane having the SiH group and organopolysiloxane having two alkenyl groups; (B) a linear organopolysiloxane compound having an SiH group only at one terminal; (C) a silane coupling agent having an epoxy group; and (D) a Pt catalyst.
摘要:
The invention provides an adhesion-imparting agent having heat-resistant transparency and a high refractive index best suited for an addition hardening type composition including a reaction product of silsesquioxane and organopolysiloxane. The invention relates to a compound obtained by allowing a hydrosilylation addition reaction of (A), (B), and when necessary, (C) as described below, and a compound including an organopolysiloxane or silsesquioxane skeleton including as an essential component an isocyanuric ring skeleton and an epoxy group, and having an SiH group residue: (A) a compound including an organopolysiloxane or silsesquioxane skeleton and having three or more SiH groups in one molecule; (B) an epoxy derivative having one aliphatic unsaturation-containing group in one molecule; and (C) polyorganosiloxane having two alkenyl groups in one molecule, and having a number average molecular weight of 100 to 500,000, or an isocyanurate compound having two alkenyl groups in one molecule.
摘要:
To provide a silicone resin-based thermosetting resin composition that can obtain a hardened material having a high refractive index and a good heat resistance. A solution is a liquid organosilicon compound represented by general formula (1) as described below: (1)
wherein, X is each independently a group represented by formula (I), formula (II) or formula (III) as described below, and when the number of the group represented by formula (I) per one molecule of the liquid organosilicon compound represented by general formula (1) (or the number of groups per one mean molecule of the compound when the compound is a mixture having a different ratio for the group represented by formula (I), the group represented by formula (II) and the group represented by formula (III) ) is defined as a, the number of the group represented by formula (II) per one molecule thereof is defined as b, and the number of the group represented by formula (III) per one molecule thereof is defined as c, 0 ≤ a ≤ 3.5, 0 ≤ b ≤ 3.5, and 0 ≤ c ≤ 1 are obtained, and also a + b + 2c = 4 is obtained:
wherein, R 1 is each independently a group selected from alkyl having 1 to 4 carbons, cyclopentyl and cyclohexyl, R 2 and R 3 are each independently a group selected from alkyl having 1 to 4 carbons, cyclopentyl, cyclohexyl and phenyl, m and n are the number of repetitions of -OSi(R 3 ) 2 -, and a mean value satisfying 1 to 50.