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19 条记录 (耗时 0.013 秒)

    CIRCUIT BOARD
    2.
    发明公开
    CIRCUIT BOARD 审中-公开

    公开(公告)号：EP4443500A1

    公开(公告)日：2024-10-09

    申请号：EP22899144.4

    申请日：2022-11-29

    申请人： LG INNOTEK CO., LTD.

    发明人： SHIN, Jong Bae ,  LEE, Soo Min ,  JEONG, Jae Hun ,  JUNG, Ji Chul

    IPC分类号： H01L23/538 ,  H01L23/50 ,  H01L23/498 ,  H01L23/66 ,  H05K1/18 ,  H05K1/11 ,  H05K3/46

    CPC分类号： H05K1/18 ,  H01L23/50 ,  H01L23/498 ,  H01L23/538 ,  H05K1/11 ,  H05K3/46 ,  H01L23/66

    摘要： A circuit board according to an embodiment includes a first insulating layer; a first pattern layer disposed on an upper surface of the first insulating layer; and a second insulating layer disposed on the upper surface of the first insulating layer and an upper surface of the first pattern layer and including a cavity, wherein the upper surface of the first insulating layer includes a first upper surface corresponding to a lower surface of the cavity, and a second upper surface having a step difference from the first upper surface and not vertically overlapping the lower surface of the cavity, wherein the first pattern layer includes a first pattern part disposed on the first upper surface, and a second pattern part disposed on the second upper surface, and wherein a thickness of the first pattern part is smaller than a thickness of the second pattern part.

    CIRCUIT BOARD
    3.
    发明公开
    CIRCUIT BOARD 审中-公开

    公开(公告)号：EP4216267A1

    公开(公告)日：2023-07-26

    申请号：EP21869788.6

    申请日：2021-09-17

    申请人： LG Innotek Co., Ltd.

    发明人： SHIN, Jong Bae ,  LEE, Soo Min ,  JEONG, Jae Hun

    IPC分类号： H01L23/13 ,  H01L23/485 ,  H01L23/48 ,  H01L23/522 ,  H01L23/528 ,  H01L23/00 ,  H01L23/50

    摘要： A circuit board according to an embodiment includes a first insulating layer; a first circuit pattern disposed on the first insulating layer; and a second insulating layer disposed on the first insulating layer and including a cavity, wherein an upper surface of the first insulating layer includes a first region that does not vertically overlap the cavity; a second region vertically overlapping the cavity; and a boundary region between the first region and the second region, the first circuit pattern includes a first-first circuit pattern disposed on the boundary region of the first insulating layer, the first-first circuit pattern includes a first portion that does not vertically overlap the cavity; and a second portion connected to the first portion and vertically overlapping the cavity, and a thickness of the first portion of the first-first circuit pattern is different from a thickness of the second portion of the first-first circuit pattern.

    CIRCUIT BOARD
    6.
    发明公开
    CIRCUIT BOARD 审中-实审

    公开(公告)号：EP4429415A1

    公开(公告)日：2024-09-11

    申请号：EP22890452.0

    申请日：2022-11-04

    申请人： LG INNOTEK CO., LTD.

    发明人： JUNG, Ji Chul ,  SHIN, Jong Bae ,  LEE, Soo Min ,  JEONG, Jae Hun

    IPC分类号： H05K1/18 ,  H05K1/11 ,  H05K3/10 ,  H05K3/46 ,  H01L23/12

    CPC分类号： H05K1/18 ,  H05K1/11 ,  H05K3/46 ,  H01L23/12 ,  H05K3/10

    摘要： A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; and a first protective layer disposed on the second insulating layer and including an open portion vertically overlapping the cavity, wherein the cavity has a first inclination whose width decreases toward the first insulating layer, the open portion includes a first region whose width changes with a second inclination different from the first inclination, and at least a portion of the first region of the open portion is equal to a width of a region adjacent to the first protective layer among an entire region of the cavity.

    HEAT CONVERSION DEVICE
    8.
    发明公开
    HEAT CONVERSION DEVICE 审中-公开
    WÄRMEUMWANDLUNGSVORRICHTUNG

    公开(公告)号：EP3009769A1

    公开(公告)日：2016-04-20

    申请号：EP15189855.8

    申请日：2015-10-14

    申请人： LG Innotek Co., Ltd.

    发明人： WON, Boone ,  SHIN, Jong Bae ,  LEE, Jong Min ,  CHO, Yong Sang

    IPC分类号： F25B21/02

    CPC分类号： H01L35/30 ,  F02G1/043 ,  F25B21/02 ,  F25B2321/025 ,  H01L35/00 ,  H01L35/32

    摘要： Provided is a heat conversion device, including: a housing (300); a thermoelectric module (100) received in the housing (300) and including a thermoelectric semiconductor (120) between substrates (140 ; 150) disposed to face each other; a first temperature conversion portion (200a) and a second temperature conversion portion (200b) disposed between the substrates (140 ; 150), respectively; and a heat reduction portion (400) adopted to guide a part of a fluid flowing in the housing (300) and passing through the first temperature conversion portion (200a) to the second temperature conversion portion (200b).

    摘要翻译： 提供一种热转换装置，包括：壳体（300）; 容纳在所述壳体（300）中并包括设置为彼此面对的衬底（140,150）之间的热电半导体（120）的热电模块（100） 设置在所述基板（140,150）之间的第一温度转换部分（200a）和第二温度转换部分（200b） 和用于引导在壳体（300）中流动的流体的一部分并通过第一温度转换部（200a）的第二温度转换部（200b）的减热部（400）。