Composition for increasing the adhesion of polymeric materials to metal surfaces
    1.
    发明公开
    Composition for increasing the adhesion of polymeric materials to metal surfaces 有权
    Zusammensetzung zur Verbesserung derHaftfähigkeitvon Polymeren an derMetalloberflächen

    公开(公告)号:EP1681373A1

    公开(公告)日:2006-07-19

    申请号:EP06075567.5

    申请日:2001-05-01

    发明人: Ferrier, Donald

    摘要: A composition and process are described which are useful in treating metal surfaces, which composition comprises an oxidizer, an acid, a corrosion inhibitor, an organic nitro compound and, optionally, a benzotriazole with an electron withdrawing group in the 1-position which electron withdrawing group is a stronger electron withdrawer than a hydrogen group, optionally, a source of adhesion enhancing species selected from the group consisting of molybdates, tungstates, tantalates, niobates, vanadates, isopoly or heteropoly acids of molybdenum, tungsten, tantalum, niobium, vanadium, and combinations of any of the foregoing and optionally by preferably a source of halide ions. The composition and process are useful in increasing the adhesion of metal surfaces to polymeric substances and in preserving said adhesion through temperature variation.

    摘要翻译: 描述了可用于处理金属表面的组合物和方法,该组合物包含氧化剂,酸,腐蚀抑制剂,有机硝基化合物和任选地在1-位具有吸电子基团的苯并三唑,该吸电子 基团是比氢基更强的吸电子,任选地,选自钼,钨,钽,铌,钒等的钼酸盐,钨酸盐,钽酸盐,铌酸盐,钒酸盐,异多或杂多酸的粘附增强物质的来源, 以及任何上述的任何组合,并且任选地优选地是卤素离子源。 组合物和方法可用于增加金属表面对聚合物质的粘附性,并且通过温度变化保持所述粘合。

    Composition and process for plating silver onto a metallic substrate
    3.
    发明公开
    Composition and process for plating silver onto a metallic substrate 失效
    组合物和方法用于在金属基材上电镀银

    公开(公告)号:EP1391536A2

    公开(公告)日:2004-02-25

    申请号:EP03078107.4

    申请日:1997-02-20

    IPC分类号: C23C18/42 H05K3/24

    摘要: The present invention provides a composition useful in plating silver onto a metallic substrate, which composition comprises: a) a soluble source of silver irons; b) an acid; and c) an oxidant comprising a nitro aromatic compound.
    The present invention also provides a process for plating silver onto a surface from the composition of the invention.

    摘要翻译: 本发明提供了在电镀银到金属基材中有用的组合物,其包含组合物:a)银铁杆的可溶性源; b)至酸; 和c)与氧化剂包含硝基芳族化合物。 本发明因此提供了用于从本发明的组合物中的银镀敷到表面上的方法。

    Process for improving adhesion of polymeric materials to metal surfaces.
    7.
    发明公开
    Process for improving adhesion of polymeric materials to metal surfaces. 有权
    Verfahren zur Verbesserung derAdhäsionvon Polymermaterialien aMetalloberflächen

    公开(公告)号:EP1158843A1

    公开(公告)日:2001-11-28

    申请号:EP00304292.6

    申请日:2000-05-22

    发明人: Ferrier, Donald

    IPC分类号: H05K3/38 C23F1/18 C23C22/52

    摘要: A process is described for treating metal surfaces with a composition comprising an oxidizer, an acid, a corrosion inhibitor, a benzotriazole with an electron withdrawing group in the 1-position which electron withdrawing group is a stronger electron withdrawer than a hydrogen group, and optionally, a source of adhesion enhancing species selected from the group consisting of molybdates, tungstates, tantalates, niobates, vanadates, isopoly or heteropoly acids of molybdenum, tungsten, tantalum, niobium, vanadium, and combinations of any of the foregoing in order to increase the adhesion of polymeric materials to the metal surface.

    摘要翻译: 描述了一种用于处理金属表面的方法,该组合物包括在1-位上具有吸电子基团的氧化剂,酸,腐蚀抑制剂,苯并三唑的组合,该吸电子基是比氢基更强的吸电子,以及任选地 ,选自钼酸盐,钨酸盐,钽酸盐,铌酸盐,钒酸盐,钼,钨,钽,铌,钒的多元或杂多酸的粘附增强物质的来源,以及上述任何一种的组合,以增加 聚合材料粘附到金属表面。