公开(公告)号：EP0974249B1

公开(公告)日：2002-01-30

申请号：EP98905612.2

申请日：1998-02-16

Applicant: MAGNETEK S.p.A.

Inventor： CANOVA, Antonio

IPC: H05K3/30 ,  H05K1/02

CPC classification number: H05K3/305 ,  H05K1/0263 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/10272 ,  H05K2201/1028 ,  H05K2201/1084 ,  H05K2203/0588 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178

Abstract: There is described a process for producing printed circuits comprising a laminar support (1), at least one electrically conductive track (7) on the said laminar support, and at least one auxiliary conductive element (21) soldered to the said conductive track (7); there is provision to apply the said auxiliary conductive element by means of an apparatus for applying SMD components.

公开(公告)号：EP0974249A1

公开(公告)日：2000-01-26

申请号：EP98905612.2

申请日：1998-02-16

Applicant: MAGNETEK S.p.A.

Inventor： CANOVA, Antonio

IPC: H05K3/30 ,  H05K1/02

CPC classification number: H05K3/305 ,  H05K1/0263 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/10272 ,  H05K2201/1028 ,  H05K2201/1084 ,  H05K2203/0588 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178

Abstract: There is described a process for producing printed circuits comprising a laminar support (1), at least one electrically conductive track (7) on the said laminar support, and at least one auxiliary conductive element (21) soldered to the said conductive track (7); there is provision to apply the said auxiliary conductive element by means of an apparatus for applying SMD components.