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    METAL LAYER STRUCTURE OF MULTILAYER FLEXIBLE BORAD AND MAKING METHOD THEREOF
    4.
    发明公开
    METAL LAYER STRUCTURE OF MULTILAYER FLEXIBLE BORAD AND MAKING METHOD THEREOF 审中-公开
    METALLSCHICHTSTRUKTURFÜREINE MEHRSCHICHTIGE柔性平台在HERSTELLUNGSVERFAHRENDAFÜR

    公开(公告)号：EP2493274A1

    公开(公告)日：2012-08-29

    申请号：EP10824385.8

    申请日：2010-01-25

    申请人： Princo Corp.

    发明人： YANG, Chih-kuang

    IPC分类号： H05K3/38 ,  H05K3/04

    CPC分类号： H05K3/4007 ,  H01L2224/11 ,  H05K1/111 ,  H05K1/118 ,  H05K3/048 ,  H05K2201/0367 ,  H05K2201/098 ,  H05K2201/09845 ,  H05K2201/099 ,  H05K2203/0588 ,  H05K2203/0594

    摘要： Disclosed is a metal structure of a multi-layer substrate, comprising a first metal layer and a dielectric layer. The first metal layer has an embedded base and a main body positioned on the embedded base. The base area of the embedded base is larger than the base area of the main body. After the dielectric layer covers the main body and the embedded base, the dielectric layer is opened at the specific position of the first metal layer for connecting the first metal layer with a second metal layer above the dielectric layer. When the metal structure is employed as a pad or a metal line of the flexible multi-layer substrate according to the present invention, the metal structure cannot easily be delaminated or separated from the contacted dielectric layer. Therefore, a higher reliability for the flexible multi-layer substrate can be achieved.

    摘要翻译： 公开了包括第一金属层和电介质层的多层基板的金属结构。 第一金属层具有嵌入式基座和位于嵌入式基座上的主体。 嵌入式基座的基座面积大于主体的基座面积。 在电介质层覆盖主体和嵌入式基底之后，电介质层在第一金属层的特定位置处打开，用于将第一金属层与电介质层上方的第二金属层连接。 当金属结构用作根据本发明的柔性多层基板的焊盘或金属线时，金属结构不容易从接触的介电层分层或分离。 因此，可以实现柔性多层基板的更高的可靠性。

    Method for forming solder bump in IC mounting board
    7.
    发明公开
    Method for forming solder bump in IC mounting board 失效
    Herstellungsmethode vonLothöckernauf IC-Montageplatte。

    公开(公告)号：EP0675532A2

    公开(公告)日：1995-10-04

    申请号：EP95104788.5

    申请日：1995-03-31

    申请人： Du Pont Kabushiki Kaisha ,  NGK Insulators Ltd.

    发明人： Fuwa, Toro ,  Nakahashi, Mitsuo ,  Kojo, Hiroki ,  Nemoto, Kazumasa

    IPC分类号： H01L21/60 ,  H01L23/498 ,  H01L21/48

    CPC分类号： H01L24/12 ,  H01L21/4853 ,  H01L24/11 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K1/111 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/09709 ,  H05K2203/043 ,  H05K2203/0577 ,  H05K2203/0588

    摘要： [Objective] To provide a method of forming solder bumps whereby solder bumps of a sufficient amount of solder can be formed even if miniaturized.
    [Constitution] The method of forming solder bumps of this invention is a method of forming solder bumps on a board (1) for mounting IC chips on which conductor wiring has been formed, which method is characterized by
       forming a photosensitive first solder resist (3) on the surface of the board on which the conductor wiring (2) has been formed,
       forming first openings (3a) by photoetching at the sites of the first solder resist (3) where the solder bumps are to be formed,
       forming a second solder resist (4) on the first solder resist,
       forming second openings (4a) that connect with the first openings by photoetching at the sites of the second solder resist that correspond to the first openings,
       filling the first and second openings with solder (5),
       carrying out reflow treatment,
       and then etching in such a way that at least part of the first solder resist remains.

    摘要翻译： [目的]提供一种形成焊料凸块的方法，由此即使小型化也能够形成足够量的焊料的焊料凸点。 [结构]本发明的形成焊料凸块的方法是在用于安装形成有导体布线的IC芯片的基板（1）上形成焊料凸块的方法，该方法的特征在于形成光敏第一阻焊剂（3 ），在其上形成有导体布线（2）的板的表面上，通过在要形成焊料凸块的第一阻焊剂（3）的位置处光刻来形成第一开口（3a），形成第二开口 在第一阻焊剂上形成阻焊剂（4），通过在与第一开口对应的第二阻焊剂的位置处光刻，形成与第一开口连接的第二开口（4a），用焊料（5）填充第一和第二开口 ），进行回流处理，然后以至少部分第一阻焊剂残留的方式蚀刻。