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1.发明公开Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus 审中-公开层叠印刷电路板及其制造方法，以及使用该lamierten电路板和制造装置用于其的模块的制造方法
公开(公告)号：EP1534054A2
公开(公告)日：2005-05-25
申请号：EP04027251.0
申请日：2004-11-17
发明人： Kimura, Junichi , Nishii, Toshihiro , Ochi, Akio , Harada, Shinji
IPC分类号： H05K1/18 , H05K3/46 , H01L23/538
CPC分类号： H05K1/165 , H01L21/50 , H01L24/97 , H01L25/165 , H01L2224/16225 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/12034 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/16152 , H01L2924/16195 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/024 , H05K1/186 , H05K3/0052 , H05K3/3405 , H05K3/403 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K2201/0187 , H05K2201/086 , H05K2201/09181 , H05K2201/10371 , H05K2203/0169 , H05K2203/0191 , H05K2203/0568 , H05K2203/063 , Y10T156/1052 , Y10T156/1057 , Y10T156/12 , H01L2924/00
摘要： The object of the present invention is to provide a laminated circuit board with electronic components buried therein wherein the laminated circuit board may assure excellent reliability of electrical connections and high mechanical strength even with electronic components mounted in high density. It comprises a substrate (1001) on which a land disposed on one main surface thereof is connected and fixed by solder (1007) to integrated circuit (1005) or the like, and a sheet (1011) laminated on the upper surface of the substrate (1001) and also provided with a filling portion by fluid resin formed by clearance (1008) at the outer periphery of integrated circuit (1005) or the like, wherein the sheet (1011) maintains its shape by woven or non-woven cloth having a hole (1012) in which integrated circuit (1005) or the like is buried, and the woven or non-woven cloth is impregnated with resin (1016) having heat fluidity and is thermally compressed. Thus, the electrical and mechanical connections between the laminated circuit board and electronic component can be enhanced in reliability.
摘要翻译： 本发明的目的是提供一种层压电路板在其中具有埋worin层压电路板可以保证电连接，甚至与安装在高密度电子元件高的机械强度的可靠性优异的电子部件。 它包括其上一个国家设置在一个主表面上被连接，并通过焊接（1007）固定在基板（1001），以层叠在基片的上表面上的集成电路（1005）等，以及片材（1011） （1001），并因此提供有通过在集成电路（1005）或类似的外周通过的间隙（1008）形成的流体树脂的填充部，worin片（1011）由具有纺织或无纺布保持其形状 其中空穴（1012）集成电路（1005）等被埋入和织造或非织造布中含浸有树脂（1016），其具有热流动性和热压缩。 因此，层叠电路板和电子元件之间的电气和机械连接可在可靠性被增强。
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2.发明公开Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus 审中-公开层叠印刷电路板及其制造方法，以及使用该lamierten电路板和制造装置用于其的模块的制造方法
公开(公告)号：EP1534054A3
公开(公告)日：2008-07-30
申请号：EP04027251.0
申请日：2004-11-17
发明人： Kimura, Junichi , Nishii, Toshihiro , Ochi, Akio , Harada, Shinji
IPC分类号： H05K1/18 , H05K3/46 , H01L23/538
CPC分类号： H05K1/165 , H01L21/50 , H01L24/97 , H01L25/165 , H01L2224/16225 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/12034 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/16152 , H01L2924/16195 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/024 , H05K1/186 , H05K3/0052 , H05K3/3405 , H05K3/403 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K2201/0187 , H05K2201/086 , H05K2201/09181 , H05K2201/10371 , H05K2203/0169 , H05K2203/0191 , H05K2203/0568 , H05K2203/063 , Y10T156/1052 , Y10T156/1057 , Y10T156/12 , H01L2924/00
摘要： The object of the present invention is to provide a laminated circuit board with electronic components buried therein wherein the laminated circuit board may assure excellent reliability of electrical connections and high mechanical strength even with electronic components mounted in high density. It comprises a substrate (1001) on which a land disposed on one main surface thereof is connected and fixed by solder (1007) to integrated circuit (1005) or the like, and a sheet (1011) laminated on the upper surface of the substrate (1001) and also provided with a filling portion by fluid resin formed by clearance (1008) at the outer periphery of integrated circuit (1005) or the like, wherein the sheet (1011) maintains its shape by woven or non-woven cloth having a hole (1012) in which integrated circuit (1005) or the like is buried, and the woven or non-woven cloth is impregnated with resin (1016) having heat fluidity and is thermally compressed. Thus, the electrical and mechanical connections between the laminated circuit board and electronic component can be enhanced in reliability.
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3.发明公开Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein 审中-公开的层叠基板的制造方法，以及用于模块施加和层叠基板的半导体器件制造设备
公开(公告)号：EP1589797A3
公开(公告)日：2008-07-30
申请号：EP05008401.1
申请日：2005-04-18
发明人： Nishimura, Mikio , Mori, Toshihiko , Honjou, Kazuhiko , Kimura, Junichi , Nishii, Toshihiro , Harada, Shinji , Kitagawa, Motoyoshi
IPC分类号： H05K3/28 , H05K1/18 , H01L23/538
CPC分类号： H05K1/186 , H01L21/56 , H01L23/3121 , H01L2224/16225 , H01L2224/73204 , H01L2924/01078 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K3/284 , H05K3/4652 , H05K2203/063 , Y10T428/24917
摘要： The invention presents a manufacturing method of laminated substrate capable of realizing small size of portable electronic appliances. Prepreg 141 is a thermosetting resin which holds a plate form in first temperature range, has a thermal fluidity in second temperature range, and is cured in third temperature range, and integrating process (118) includes softening (120) of heating prepreg (141) to second temperature range, and softening the resin impregnated in prepreg (141), forced flowing (122) of compressing prepreg (141) before prepreg (141) comes to third temperature range, and forcing the resin to flow into space and gap formed among semiconductor (105), resistor (106), and substrate (101), and hardening (123) of heating prepreg (141) to third temperature range. As a result, without using intermediate material, space and gap formed among semiconductor (105), resistor (106), and substrate (101) can be securely filled with resin.
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公开(公告)号：EP0376319B1
公开(公告)日：1995-03-29
申请号：EP89124090.5
申请日：1989-12-28
发明人： Harada, Shinji , Kawamata, Tadashi
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5.发明公开Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein 审中-公开的层叠基板的制造方法，以及用于模块施加和层叠基板的半导体器件制造设备
公开(公告)号：EP1589797A2
公开(公告)日：2005-10-26
申请号：EP05008401.1
申请日：2005-04-18
发明人： Nishimura, Mikio , Mori, Toshihiko , Honjou, Kazuhiko , Kimura, Junichi , Nishii, Toshihiro , Harada, Shinji , Kitagawa, Motoyoshi
IPC分类号： H05K3/28 , H05K1/18 , H01L23/538
CPC分类号： H05K1/186 , H01L21/56 , H01L23/3121 , H01L2224/16225 , H01L2224/73204 , H01L2924/01078 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K3/284 , H05K3/4652 , H05K2203/063 , Y10T428/24917
摘要： The invention presents a manufacturing method of laminated substrate capable of realizing small size of portable electronic appliances. Prepreg 141 is a thermosetting resin which holds a plate form in first temperature range, has a thermal fluidity in second temperature range, and is cured in third temperature range, and integrating process (118) includes softening (120) of heating prepreg (141) to second temperature range, and softening the resin impregnated in prepreg (141), forced flowing (122) of compressing prepreg (141) before prepreg (141) comes to third temperature range, and forcing the resin to flow into space and gap formed among semiconductor (105), resistor (106), and substrate (101), and hardening (123) of heating prepreg (141) to third temperature range. As a result, without using intermediate material, space and gap formed among semiconductor (105), resistor (106), and substrate (101) can be securely filled with resin.
摘要翻译： 本发明提出一种能够实现便携式电子设备的小尺寸的叠层基片的制造方法。 预浸料坯141是热固性树脂，其保持在第一温度范围内的板的形式，具有在第二温度范围内的热流动性，并在第三温度范围内固化，并且INTEGRA廷过程（118）包括软化加热预浸料坯（120）（141） 到第二温度范围内，并软化（122）压缩的预浸料坯之前预浸料（141）（141）来的第三温度范围内，并迫使树脂在预浸料坯（141）浸渍的树脂，被迫流到流入空间和间隙间形成 加热的预浸料坯（141）至第三温度范围内半导体（105），电阻器（106）和底物（101）和硬化（123）。 其结果是，不使用中间材料，空间和间隙半导体（105）之间形成的，电阻器（106）和底物（101）可以可靠地填充有树脂。
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公开(公告)号：EP0667325A1
公开(公告)日：1995-08-16
申请号：EP95101787.0
申请日：1995-02-09
IPC分类号： C04B35/65
CPC分类号： C04B35/65 , C04B35/117 , C04B35/18
摘要： This invention relates to a ceramics and its manufacturing method, and this is to offer a ceramics showing very little dimensional change after sintering and high dimensional accuracies, so that the characteristics of inorganic functional material can be fully maintained and utilized. The invented ceramics comprises of grains of inorganic functional material and grains of complex oxide, and the pores exisiting between said grains of inorganic functional material is filled with said grains of complex oxide produced by a sintering reaction between the oxidized metal and the inorganic compound.
摘要翻译： 陶瓷及其制造方法技术领域本发明涉及一种陶瓷及其制造方法，其特征在于提供一种陶瓷烧结后尺寸变化很小，尺寸精度高的陶瓷，可以充分保持和利用无机功能材料的特性。 本发明的陶瓷由无机功能材料颗粒和复合氧化物颗粒组成，并且在无机功能材料颗粒之间存在的孔被填充有由氧化金属和无机化合物之间的烧结反应产生的复合氧化物晶粒。
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公开(公告)号：EP0376319A3
公开(公告)日：1991-06-12
申请号：EP89124090.5
申请日：1989-12-28
发明人： Harada, Shinji , Kawamata, Tadashi
摘要： A composite ferrite material is provided. The composite ferrite material obtained from a mixture of a magnetic ferrite powder with high crystallinity, prepared by firing at a prescribed temperature, and a glass powder, having a softening temperature lower than said firing temperature, by heat treatment of said mixture at a temperature which is higher than, or equal to said softening temperature of said glass powder and lower than, or equal to said firing temperature, to effect the binding of said magnetic ferrite powder by said glass material. The composite ferrite material has excellent magnetic characteristics and can be obtained in a form of the desired dimensions with high accuracy.
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公开(公告)号：EP0376319A2
公开(公告)日：1990-07-04
申请号：EP89124090.5
申请日：1989-12-28
发明人： Harada, Shinji , Kawamata, Tadashi
摘要： A composite ferrite material is provided. The composite ferrite material obtained from a mixture of a magnetic ferrite powder with high crystallinity, prepared by firing at a prescribed temperature, and a glass powder, having a softening temperature lower than said firing temperature, by heat treatment of said mixture at a temperature which is higher than, or equal to said softening temperature of said glass powder and lower than, or equal to said firing temperature, to effect the binding of said magnetic ferrite powder by said glass material. The composite ferrite material has excellent magnetic characteristics and can be obtained in a form of the desired dimensions with high accuracy.
摘要翻译： 提供复合铁氧体材料。 通过在规定温度下焙烧制备的具有高结晶度的磁性铁氧体粉末和软化温度低于所述焙烧温度的玻璃粉末的混合物，通过在所述混合物的温度 高于或等于所述玻璃粉末的所述软化温度并低于或等于所述烧制温度，以实现所述磁性铁氧体粉末与所述玻璃材料的结合。 复合铁氧体材料具有优异的磁特性，并且可以以高精度以所需尺寸的形式获得。
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