公开(公告)号：EP3267569A1

公开(公告)日：2018-01-10

申请号：EP16761498.1

申请日：2016-02-25

Applicant: FDK Corporation

Inventor： HAMADA, Kenji ,  NAGAYOSHI, Tomoyuki ,  SATO, Tadashi ,  FUKUI, Norio

IPC: H02M3/28 ,  H01F30/10 ,  H05K1/16

CPC classification number: H01F27/2804 ,  H01F30/10 ,  H01F2027/2809 ,  H01F2027/2819 ,  H02M1/00 ,  H02M3/28 ,  H02M3/33592 ,  H02M7/003 ,  H02M2001/0054 ,  H05K1/0262 ,  H05K1/144 ,  H05K1/16 ,  H05K1/165 ,  H05K2201/042 ,  H05K2201/086 ,  H05K2201/2036 ,  Y02B70/1491

Abstract: An isolated switching power supply of the present invention includes: a first circuit board 10 provided with a pattern of a primary winding L11 constituting an isolation transformer T1; a second circuit board 20 provided with patterns of secondary windings L21 and L22 constituting the isolation transformer T1, wherein a secondary winding pattern portion 22 is arranged to face a primary winding pattern portion 12 of the first circuit board 10 at a predetermined interval G; and a core 30 inserted into the primary winding L11 of the first circuit board 10 and the secondary windings L21 and L22 of the second circuit board 20 and made of a magnetic body constituting the isolation transformer T1.

Abstract translation: 本发明的隔离开关电源包括：第一电路板10，其设置有构成隔离变压器T1的初级绕组L11的图案; 设置有构成隔离变压器T1的次级绕组L21和L22的图案的第二电路板20，其中次级绕组图案部分22布置为以预定间隔G与第一电路板10的初级绕组图案部分12相对; 以及插入第一电路板10的初级绕组L11和第二电路板20的次级绕组L21和L22并由构成隔离变压器T1的磁体构成的芯30。

公开(公告)号：EP3007187A4

公开(公告)日：2017-03-22

申请号：EP14803615

申请日：2014-04-08

Applicant: NITTO DENKO CORP

Inventor： HABU TAKASHI ,  EBE HIROFUMI

IPC: H01F1/26

CPC classification number: H01F1/12 ,  C09J7/026 ,  C09J7/22 ,  C09J2203/326 ,  C09J2400/16 ,  C09J2400/20 ,  C09J2433/00 ,  G06F3/041 ,  H01F1/26 ,  H01F1/37 ,  H01F41/16 ,  H05K1/165 ,  H05K3/28 ,  H05K2201/0245 ,  H05K2201/086

Abstract: A soft magnetic resin composition contains soft magnetic particles shaped flat, a resin component, and polyether phosphate ester. The soft magnetic particles content is 60% by volume or more and the polyether phosphate ester content relative to 100 parts by mass of the soft magnetic particles is 0.1 to 5 parts by mass.

公开(公告)号：EP2980174A1

公开(公告)日：2016-02-03

申请号：EP14775004.6

申请日：2014-01-23

Applicant: Nitto Denko Corporation

Inventor： EBE, Hirofumi ,  HABU, Takashi

IPC: C09J7/00 ,  B32B27/00 ,  B32B27/18 ,  H01F1/26 ,  H01F1/375 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0313 ,  B32B7/12 ,  B32B27/00 ,  B32B27/08 ,  B32B27/18 ,  B32B27/308 ,  B32B27/38 ,  B32B2307/208 ,  B32B2405/00 ,  B32B2457/08 ,  C08K3/08 ,  C08K2201/01 ,  C09J7/245 ,  C09J7/25 ,  C09J7/35 ,  C09J9/00 ,  C09J133/00 ,  C09J163/00 ,  C09J165/02 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  G01D5/20 ,  G06F3/046 ,  G06F2203/04103 ,  H01F1/26 ,  H01F1/37 ,  H05K1/0373 ,  H05K3/281 ,  H05K2201/0195 ,  H05K2201/086

Abstract: A soft magnetic thermosetting adhesive film includes a magnetic layer and a surface layer laminated on one side of the magnetic layer. The magnetic layer is formed from a magnetic composition containing acrylic resin, epoxy resin, phenol resin, and soft magnetic particles. The surface layer is formed from a surface layer composition containing acrylic resin, epoxy resin, and phenol resin and not substantially containing soft magnetic particles.

Abstract translation: 软磁性热固性粘合剂膜包括磁性层和层叠在磁性层一侧的表面层。 磁性层由包含丙烯酸树脂，环氧树脂，酚醛树脂和软磁性颗粒的磁性组合物形成。 表面层由含有丙烯酸树脂，环氧树脂和酚醛树脂的表面层组合物形成，基本上不含软磁性颗粒。

公开(公告)号：EP2896279A1

公开(公告)日：2015-07-22

申请号：EP13771409.3

申请日：2013-09-12

Applicant: Würth Elektronik GmbH & Co. KG ,  Festo AG & Co. KG

Inventor： KOSTELNICK, Jan ,  SCHREIVOGEL, Alina ,  KIESSLING, Albert ,  GIOUSOUF, Metin

IPC: H05K1/16 ,  H01F5/00 ,  H05K3/46 ,  H03K17/95

CPC classification number: H01F27/2804 ,  H01F17/0006 ,  H01F27/2823 ,  H01F27/324 ,  H01F41/046 ,  H01F41/06 ,  H01F2017/002 ,  H01F2017/0066 ,  H01F2027/406 ,  H03K17/9505 ,  H05K1/165 ,  H05K3/4623 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2203/061 ,  Y10T29/49073

Abstract: The invention relates to a method for producing a coil (140) integrated in a substrate (100), comprising the following steps: producing a cavity in the substrate, which cavity has an open side, which interrupts a surface of the substrate, introducing a paste having ferromagnetic particles into the cavity in order to produce a coil core, closing the cavity by applying a cover layer in order to bridge the interruption of the surface of the substrate, introducing first winding segments of the coil which are perpendicular to the surface, wherein several or all of the first winding segments extend through the coil core located in the cavity, and applying second winding segments to the surfaces of the substrate, wherein the second winding segments contact the first winding segments in order to realize the windings of the coil.

公开(公告)号：EP2750148A4

公开(公告)日：2015-06-03

申请号：EP12828321

申请日：2012-08-24

Applicant: ROHM CO LTD

Inventor： TSURUMI NAOAKI ,  FUKAE KEISUKE

IPC: H01F17/00 ,  H01F5/00 ,  H01F17/04 ,  H05K1/05

CPC classification number: H01F27/2804 ,  H01F17/0006 ,  H01F27/24 ,  H01F27/2871 ,  H01F2017/0066 ,  H01F2017/0073 ,  H05K1/053 ,  H05K1/165 ,  H05K3/107 ,  H05K2201/086

Abstract: The inductance device (4) includes: a magnetic metal substrate (2) comprising a metallic substrate (10) having first permeability, a first insulating layer (16a) disposed in the metallic substrate (10), and a first metallic wiring layer (22) having second permeability and disposed on the first insulating layer (16a); a first gap layer (24) disposed on the front side surface of the magnetic metal substrate (2); and a first magnetic flux generation layer (26) disposed on the first gap layer (24). There are provide a thin magnetic metal substrate adaptable to the large current use and advantageous in the high frequency characteristics; and an inductance device to which such a magnetic metal substrate are applied, wherein the inductance device is adaptable to smaller mounting area, larger inductance values, and large current use and advantageous in high frequency characteristics.

公开(公告)号：EP2779810A2

公开(公告)日：2014-09-17

申请号：EP14158757.6

申请日：2014-03-11

Applicant: Tripod Technology Corporation

Inventor： Huang, Bo-Shiung ,  Yang, Wei-Hsiung ,  Shih, Han-Ching ,  Lin, Cheng-Feng

IPC: H05K1/16 ,  H05K3/46 ,  H01F17/06

CPC classification number: H05K1/0271 ,  H01F17/0033 ,  H01F17/062 ,  H01F27/2804 ,  H05K1/165 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/029 ,  H05K2201/086 ,  H05K2201/09636 ,  H05K2203/1178 ,  Y10T29/49165

Abstract: A printed circuit board package structure includes a substrate (110) having a first surface (111) and a second surface (113), a ring-shaped magnetic element (120), an adhesive layer (130), conductive portions (140) and conductive channels (150). The first and second surfaces respectively have first (114) and second (116) metal portions. A ring-shaped concave portion (112) is formed on a position not covered by the first metal portions of the first surface. The ring-shaped magnetic element is placed in the ring-shaped concave portion. The adhesive layer covers the first metal portions and the ring-shaped magnetic element. The conductive portions are formed on the adhesive layer. The conductive channels penetrate the conductive portions, the adhesive layer, and the substrate, and are respectively located in an inner wall (122) and outside an outer wall (124) of the ring-shaped concave portion. Each of the conductive channels includes a conductive film (152) electrically connects to the aligned conductive portion and second metal portion.

Abstract translation: 印刷电路板封装结构包括具有第一表面（111）和第二表面（113），环形磁性元件（120），粘合剂层（130），导电部分（140）和 导电通道（150）。 第一和第二表面分别具有第一（114）和第二（116）金属部分。 环形凹部（112）形成在未被第一表面的第一金属部分覆盖的位置上。 环形磁性元件放置在环形凹部中。 粘合层覆盖第一金属部分和环形磁性元件。 导电部分形成在粘合剂层上。 导电通道贯穿导电部分，粘合剂层和基板，并且分别位于环形凹入部分的内壁（122）和外壁（124）的外侧。 每个导电沟道包括导电膜（152），其电连接到对齐的导电部分和第二金属部分。

公开(公告)号：EP2774211A1

公开(公告)日：2014-09-10

申请号：EP12780491.2

申请日：2012-10-30

Applicant: European Aeronautic Defence And Space Company Eads France

Inventor： MEYER, Marc

IPC: H01P1/23 ,  H01P1/203 ,  H01F17/00 ,  H01F17/04 ,  H01F19/04 ,  H01F27/28 ,  H01F41/04 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  H05K3/14

CPC classification number: H03H7/09 ,  H01F3/14 ,  H01F19/04 ,  H01F27/24 ,  H01F27/28 ,  H01F27/2804 ,  H01P1/20345 ,  H01P1/23 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/036 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/0195 ,  H05K2201/086

Abstract: The invention essentially relates to an EMC filtering device (1), characterized in that said filtering device comprises a printed circuit (5) comprising at least two parallel layers (25, 26) of a high-permittivity material, which are positioned between two layers (20-22) of an insulating material that are parallel to one another and to the layers (25, 26) of a high-permittivity material, a core (10) made of a magnetic material comprising three cylindrical arms (13-15) passing perpendicularly through the layers (20-22, 25, 26), at least two windings (35, 36) winding around the first arm (13) of the magnetic material core (10), said windings (35, 36) and the first arm (13) forming a first coil (30), at least two windings (37, 38) winding around the second arm (15) of the magnetic material core (10), said windings (37, 38) and the second arm (15) forming a second coil (31), the two coils (30, 31) being coupled coils (30, 31).

公开(公告)号：EP2716143A1

公开(公告)日：2014-04-09

申请号：EP12728963.5

申请日：2012-05-23

Applicant: JUMATECH GmbH

Inventor： WÖLFEL, Markus

IPC: H05K1/02

CPC classification number: H05K1/0296 ,  H01F27/2804 ,  H01F27/2847 ,  H05K1/0263 ,  H05K1/165 ,  H05K3/202 ,  H05K2201/086 ,  H05K2201/0969 ,  Y10T29/49155

Abstract: The invention relates to a printed circuit board for use in the field of power electronics, which printed circuit board has a molded part, and to a method for the production thereof. In order to provide a printed circuit board for use in the field of power electronics, which printed circuit board can be produced in a comparatively simple manner and which can manage the currents and heat volumes that occur in the field of power electronics, according to the invention the printed circuit board comprises at least one plate-shaped molded part that extends on and/or in the printed circuit board and is made of an electrically conducting material. Further, the invention relates to a corresponding method.

Abstract translation: 印刷电路板及其制造方法。 印刷电路板可以包括由导电材料制成的成形部件，并且可以用于管理在电力电子领域中发生的电流和热量。

公开(公告)号：EP2716142A1

公开(公告)日：2014-04-09

申请号：EP11729191.4

申请日：2011-06-01

Applicant: Telefonaktiebolaget LM Ericsson (PUBL)

Inventor： PEREZ-URIA, Igor ,  FERM, Per

IPC: H05K1/02 ,  H05K3/40

CPC classification number: H05K1/0206 ,  H01F5/00 ,  H01L2224/16225 ,  H05K1/0207 ,  H05K3/4046 ,  H05K2201/086 ,  H05K2201/10295 ,  H05K2201/10303

Abstract: The present invention relates to a thermo/electrical conductor arrangement for multilayer PCBs (120). Using vias for the transport of heat from the interior of the PCB (120) and for conducting high currents between the conducting layers (121-125) have limitations. Via platings are very thin and vias filled with solder is an unreliable method as there is always a risk that the vias are not properly filled during the soldering process. The present invention overcomes this by inserting a pin (112) of a current conductive material (such as copper) into the via (160) so that the pin (112) is brought into galvanic contact with the conducting layers (121-125) in the PCB (120) and where at least one end of the pin (112) is freely protruding from the PCB (120) thereby allowing the pin (112) to conduct heat from the interior of the PCB (120) to the protruding end of the pin (112) for external cooling.

公开(公告)号：EP2568301B1

公开(公告)日：2014-04-09

申请号：EP12183231.5

申请日：2012-09-05

Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Inventor： Klein, Philippe

IPC: G01R19/00 ,  H05K1/16 ,  H01F17/00 ,  H01F27/28 ,  H02K3/26 ,  G01R15/18 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/165 ,  G01R15/185 ,  H05K1/0239 ,  H05K3/46 ,  H05K2201/086 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/097