公开(公告)号：EP1643552A1

公开(公告)日：2006-04-05

申请号：EP04731753.2

申请日：2004-05-07

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： HANDA, Hiroyuki ,  NAKATANI, Seiichi ,  HIRANO, Koichi ,  INOUE, Osamu ,  ISHIKAWA, Akihiro ,  YOSHIDA, Tsunenori

IPC: H01L25/00 ,  H05K3/46

CPC classification number: H01L25/16 ,  H01L23/5389 ,  H01L2224/73204 ,  H01L2924/16152 ,  H01L2924/19105 ,  H05K1/0204 ,  H05K1/185 ,  H05K3/4614 ,  H05K2201/0209 ,  H05K2201/10416

Abstract: In a module (51) including circuit elements, a plurality of wires (12), which are generally two-dimensionally formed, are multi-layered via electrically insulating material (11), which comprises a mixture including at least filler and electrically insulating resin. One or more circuit elements are electrically connected to the wires, and at least a part of those circuit elements is embedded in the electrically insulating material. The module (51) further includes a heat sink member (13) that has a higher thermal conductivity than the electrically insulating material, and that, when viewed from the direction of multi-layering the wires, overlaps with a circuit element (14), which is one of those circuit elements, exhibiting the highest temperature rise at least in the module.

Abstract translation: 在包括电路元件的模块（51）中，通过电绝缘材料（11），通常二维地形成多个电线（12），其包括至少包含填料和电绝缘树脂的混合物 。 一个或多个电路元件电连接到电线，并且这些电路元件的至少一部分嵌入电绝缘材料中。 模块（51）还包括具有比电绝缘材料更高的热导率的散热构件（13），并且当从多层的方向观察时，导线与电路元件（14）重叠， 这是这些电路元件之一，至少在模块中呈现最高的温度上升。