公开(公告)号：EP1643552A1

公开(公告)日：2006-04-05

申请号：EP04731753.2

申请日：2004-05-07

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： HANDA, Hiroyuki ,  NAKATANI, Seiichi ,  HIRANO, Koichi ,  INOUE, Osamu ,  ISHIKAWA, Akihiro ,  YOSHIDA, Tsunenori

IPC: H01L25/00 ,  H05K3/46

CPC classification number: H01L25/16 ,  H01L23/5389 ,  H01L2224/73204 ,  H01L2924/16152 ,  H01L2924/19105 ,  H05K1/0204 ,  H05K1/185 ,  H05K3/4614 ,  H05K2201/0209 ,  H05K2201/10416

Abstract: In a module (51) including circuit elements, a plurality of wires (12), which are generally two-dimensionally formed, are multi-layered via electrically insulating material (11), which comprises a mixture including at least filler and electrically insulating resin. One or more circuit elements are electrically connected to the wires, and at least a part of those circuit elements is embedded in the electrically insulating material. The module (51) further includes a heat sink member (13) that has a higher thermal conductivity than the electrically insulating material, and that, when viewed from the direction of multi-layering the wires, overlaps with a circuit element (14), which is one of those circuit elements, exhibiting the highest temperature rise at least in the module.

Abstract translation: 在包括电路元件的模块（51）中，通过电绝缘材料（11），通常二维地形成多个电线（12），其包括至少包含填料和电绝缘树脂的混合物 。 一个或多个电路元件电连接到电线，并且这些电路元件的至少一部分嵌入电绝缘材料中。 模块（51）还包括具有比电绝缘材料更高的热导率的散热构件（13），并且当从多层的方向观察时，导线与电路元件（14）重叠， 这是这些电路元件之一，至少在模块中呈现最高的温度上升。

公开(公告)号：EP1189272A1

公开(公告)日：2002-03-20

申请号：EP01912364.5

申请日：2001-03-14

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： NAKATANI, Seiichi ,  BESSHO, Yoshihiro ,  SUGAYA, Yasuhiro ,  ONISHI, Keiji

IPC: H01L21/56 ,  H01L23/28

CPC classification number: H01L21/568 ,  H01L21/561 ,  H01L23/3107 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/81005 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/187 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/10378 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49146 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05624 ,  H01L2924/00014

Abstract: At least two electric elements (203) such as semiconductor chips or surface acoustic wave devices are mounted on wiring patterns (201), and the electric elements (203) are sealed with a thermosetting resin composition (204). An upper surface of the at least two electric elements (203) and an upper surface of the thermosetting resin composition (204) are abraded at the same time, thereby forming surfaces substantially flush with each other. Since they are abraded while being sealed with the thermosetting resin composition (204), it is possible to reduce the thickness without damaging the electric elements (203). Also, the electric elements (203) and the wiring patterns (201) can be prevented from being contaminated by an abrasive liquid. In this manner, it is possible to obtain an electric element built-in module whose thickness can be reduced while maintaining its mechanical strength.