公开(公告)号：EP2708512A4

公开(公告)日：2014-10-29

申请号：EP12782858

申请日：2012-05-08

申请人： MITSUBISHI MATERIALS CORP

发明人： KATASE TAKUMA ,  MASUDA AKIHIRO ,  KUBA KANJI

IPC分类号： C01G19/02 ,  C25D3/60 ,  C25D21/14

CPC分类号： C01G19/02 ,  C01P2004/61 ,  C01P2006/11 ,  C01P2006/12 ,  C01P2006/80 ,  C25D3/30 ,  C25D21/18

摘要： An object and a problem of the present invention is to provide tin(II) oxide powder which has extremely high solubility in an acid or an acidic plating solution and excellent in storage stability in the air. The tin(II) oxide powder of the present invention is for replenishing a tin component of a tin-alloy plating solution, and comprises 100 to 5000 ppm of an antioxidant being contained in the powder with a mass ratio, and has such a dissolution rate that when 0.1 g of the tin(II) oxide powder is added to 100 ml of 100 g/L aqueous alkylsulfonic acid solution at a temperature of 25°C and stirred, then the powder dissolves therein within 180 seconds.

公开(公告)号：EP2669937A4

公开(公告)日：2016-07-27

申请号：EP12739744

申请日：2012-01-16

申请人： MITSUBISHI MATERIALS CORP

发明人： HATTA TAKESHI ,  MASUDA AKIHIRO

IPC分类号： H01L21/60 ,  C25D5/10 ,  C25D5/50 ,  C25D7/00 ,  C25D7/12 ,  H01L21/48

CPC分类号： H01L24/11 ,  C22C13/00 ,  C25D5/022 ,  C25D5/10 ,  C25D5/505 ,  C25D7/123 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/03462 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05655 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H05K3/3473 ,  H05K3/4007 ,  H05K2203/043 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552

摘要： Provided is a method for manufacturing an Sn alloy bump, wherein composition of the Sn alloy bump can be readily controlled. The method for manufacturing an Sn alloy bump formed of an alloy composed of Sn and other one or more types of metals has a step of forming an Sn layer (4a) on an electrode pad (3) in a resist opening (2a) formed on a substrate (1) by electrolytic plating; a step of laminating Sn and an alloy layer (4b) on the Sn layer (4a) by electrolytic plating; and a step of forming an Sn alloy bump (5) by melting the Sn layer (4a) and the laminated alloy layer (4b) after removal of a resist (2).

公开(公告)号：EP2708511A4

公开(公告)日：2014-10-29

申请号：EP12781588

申请日：2012-05-08

申请人： MITSUBISHI MATERIALS CORP

发明人： KATASE TAKUMA ,  MASUDA AKIHIRO ,  KUBA KANJI

IPC分类号： C01G19/02 ,  C25D3/60 ,  C25D21/14

CPC分类号： C01G19/02 ,  C01P2004/61 ,  C01P2006/11 ,  C01P2006/12 ,  C01P2006/80 ,  C25D3/30 ,  C25D21/14

摘要： An object and a problem of the present invention is to provide tin(II) oxide powder which has extremely high solubility in an acid or an acidic plating solution, excellent in storage stability in the air and can heighten oxidation-preventive effect of Sn 2+ ion in the plating solution. The method for manufacturing tin(II) oxide powder of the present invention comprises Step (11) of preparing an aqueous acidic solution containing Sn 2+ ions, Step (12) of neutralizing the aqueous acidic solution by adding an aqueous alkaline solution to prepare a slurry of tin(II) hydroxide, Step (13) of dehydrating the prepared slurry to obtain a slurry of tin(II) oxide, Step (14) of separating the slurry of tin(II) oxide into a solid and a liquid to obtain tin(II) oxide, Step (15) of treating the obtained tin(II) oxide with an aqueous antioxidant solution, and Step (16) of vacuum drying the tin(II) oxide treated with the aqueous antioxidant solution. Also, the tin(II) oxide powder of the present invention is suitable for replenishing a tin component to a tin-alloy plating solution.

公开(公告)号：EP1591563A4

公开(公告)日：2006-04-05

申请号：EP04704363

申请日：2004-01-22

申请人： ISHIHARA CHEMICAL CO LTD ,  DAIWA FINE CHEMICALS CO LTD ,  MITSUBISHI MATERIALS CORP

发明人： MASUDA AKIHIRO ,  KOHINATA MASAYOSHI ,  OBATA KEIGO ,  YOSHIMOTO MASAKAZU ,  TSUJI KIYOTAKA ,  UCHIDA EI ,  ORI KEIJI ,  EIKAWA MASAHIRO

IPC分类号： C25D3/60 ,  C25D3/32 ,  C25D3/56

CPC分类号： C25D3/32 ,  C25D3/60

摘要： The present invention provides a tin-containing plating bath comprising: (a) a soluble stannous salt, or a mixture of a soluble stannous salt and at least one soluble salt selected from the group consisting of copper salts, bismuth salts, silver salts, indium salts, zinc salts, nickel salts, cobalt salts and antimony salts; and (b) at least one aliphatic sulfonic acid selected from the group consisting of alkanesulfonic acids and alkanolsulfonic acids, the aliphatic sulfonic acid being a purified aliphatic sulfonic acid in which the total amount of sulfur-containing compounds as impurities consisting of compound(s) containing one or more sulfur atoms with an oxidation number of +4 or less in the molecule and compound(s) containing one or more sulfur atoms and one or more chlorine atoms in the molecule is a minute amount or less. A tin or tin alloy plating film with excellent reflowability, film appearance, etc. can be formed by the use of this plating bath.

摘要翻译： 本发明涉及一种含锡电镀液，其含有（a）可溶性亚锡盐或至少一种选自铜盐，铋盐，银盐，铟盐，锌盐，镍盐，钴 盐和锑盐和可溶亚锡盐，和（b）至少一种选自链烷磺酸和链烷醇磺酸的脂族磺酸，其特征在于所述脂族磺酸是纯化的，其中杂质硫化合物的量由 在其分子中具有氧化数+ IV或更小的硫原子的化合物和其分子中具有硫原子和氯原子的化合物是微量或更少的。 通过使用该镀浴，可以形成回流性，膜外观等优异的镀锡膜或锡合金镀膜。