公开(公告)号：EP1458018B1

公开(公告)日：2006-04-19

申请号：EP04001572.9

申请日：2004-01-26

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Maeda, Takenobu, Murata Manufacturing Co., Ltd.

IPC: H01L21/607 ,  H01L21/60

CPC classification number: H05K1/0271 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/81206 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K3/328 ,  H05K2201/10416 ,  H05K2201/10674 ,  H05K2201/2009 ,  H05K2201/2045 ,  H05K2203/0285 ,  H01L2924/00 ,  H01L2224/05624 ,  H01L2924/00014

公开(公告)号：EP1458018A1

公开(公告)日：2004-09-15

申请号：EP04001572.9

申请日：2004-01-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Maeda, Takenobu, Murata Manufacturing Co., Ltd.

IPC: H01L21/607 ,  H01L21/60

CPC classification number: H05K1/0271 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/81206 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K3/328 ,  H05K2201/10416 ,  H05K2201/10674 ,  H05K2201/2009 ,  H05K2201/2045 ,  H05K2203/0285 ,  H01L2924/00 ,  H01L2224/05624 ,  H01L2924/00014

Abstract: In an electronic component device, electrodes of an electric component and respective wiring lines(11,12) on a board(10A) are collectively bonded together via bumps(22) using ultrasonic vibration. The wiring lines(12) include wiring lines that are substantially parallel to the direction of ultrasonic vibration and wiring lines(11) that are substantially perpendicularly to the direction of ultrasonic vibration. A displacement inhibiting layer(13) is provided inside the board(10A) in a portion below the wiring lines(11) that are substantially perpendicular to the direction of ultrasonic vibration.

Abstract translation: 在电子部件装置中，电子部件的电极和板（10A）上的各布线（11,12）通过使用超声波振动的凸块（22）共同地接合在一起。 布线（12）包括基本上平行于超声波振动方向的布线和基本上垂直于超声波振动方向的布线（11）。 在布线（11）的下方与超声波振动方向大致垂直的部分，在基板（10A）的内部设置有位移抑制层（13）。