公开(公告)号：EP1471574B1

公开(公告)日：2008-01-23

申请号：EP04252265.6

申请日：2004-04-16

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Murayama, Kei ,  Sunohara, Masahiro

IPC: H01L23/498 ,  H01L23/538

CPC classification number: H01L23/49827 ,  H01L23/562 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/81206 ,  H01L2224/81801 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H05K1/113 ,  H05K3/328 ,  H05K2201/09436 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/10674 ,  H05K2203/0285 ,  H01L2924/00

公开(公告)号：EP1209736A3

公开(公告)日：2002-07-24

申请号：EP01127267.1

申请日：2001-11-16

Applicant: SONY CORPORATION

Inventor： Yoshida, Koji

IPC: H01L21/60 ,  H01L23/495 ,  H01L23/498

CPC classification number: H05K1/111 ,  H01L23/49838 ,  H01L23/5386 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/45144 ,  H01L2224/81206 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0665 ,  H05K3/328 ,  H05K2201/09418 ,  H05K2201/10674 ,  H05K2203/0285 ,  Y02P70/611 ,  H01L2924/00

Abstract: A semiconductor device includes a wiring pattern formed on a board, and a semiconductor chip bonded to the wiring pattern by ultrasonic welding. The wiring pattern is formed such that when the semiconductor chip is disposed on the wiring pattern, a range shared between the wiring pattern and positional variation regions of portions to be bonded of the semiconductor chip accompanied by the ultrasonic welding becomes as wide as possible. Such a semiconductor device makes it possible to ensure a sufficient positional deviation range of a wiring pattern with respect to a positional deviation in each bump type electrode, and hence to cope with a multipin structure for flip-chip mounting and to improve both an initial bonding characteristic and a mounting reliability.

公开(公告)号：EP0949670B1

公开(公告)日：2005-06-22

申请号：EP99106876.8

申请日：1999-04-07

Applicant: TAIYO YUDEN Co., Ltd.

Inventor： Fuji, Tomonori, c/o Taiyo Yuden Co., Ltd. ,  Suzuki, Kazutaka c/o Taiyo Yuden Co., Ltd.

IPC: G01R31/04 ,  H01L21/60 ,  H01L21/607 ,  H01L21/603 ,  H01L21/66

CPC classification number: H01L24/81 ,  B23K20/023 ,  B23K20/025 ,  B23K20/10 ,  B23K20/106 ,  B23K2201/40 ,  B29C65/08 ,  B29C66/8322 ,  H01L24/75 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81206 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00

公开(公告)号：EP1469319A1

公开(公告)日：2004-10-20

申请号：EP04017118.3

申请日：1999-04-07

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Fuji, Tomonori ,  Suzuki, Kazutaka

IPC: G01R31/04 ,  H01L21/60 ,  H01L21/607 ,  H01L21/603 ,  H01L21/66

CPC classification number: H01L24/81 ,  B23K20/023 ,  B23K20/025 ,  B23K20/10 ,  B23K20/106 ,  B23K2201/40 ,  B29C65/08 ,  B29C66/8322 ,  H01L24/75 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81206 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00

Abstract: The present invention relates to a mounting apparatus (40) for mounting an electronic part (3) utilizing ultrasonic wave and thermocompression bonding to form a flip-chip bonding system, comprising an ultrasonic vibration generating device (8), a horn (7) attached to the ultrasonic vibration generating device (8), a collet tool (6) for holding an electronic part (3) attached to the horn (7), a control unit (9) being connected to the ultrasonic vibration generating device (8), and a substrate conductor heating unit (4) connected to said control unit (9). To inspect the state of the formed joint a measuring device for monitoring a voltage, an electric current, or both to be applied to the ultrasonic vibration generating device (8) is connected with the control unit (9). Thus, it is possible to measure a voltage and/or an electric current (i) applied to the ultrasonic vibration generating device (9), to respectively compare the measured voltage and/or electric current (i) with reference wave forms to determine whether the voltage and/or electric current are applied normally to the ultrasonic vibrating generating device (9) and to judge the formed connection defective or non-defective in accordance with the results of the comparison of the measured voltage and/or electric current with reference wave forms.

Abstract translation: 本发明涉及一种用于安装利用超声波和热压接的电子部件（3）以形成倒装芯片接合系统的安装装置（40），其包括超声波振动发生装置（8），附接的喇叭（7） 与超声波振动发生装置（8）相连，用于保持安装在喇叭（7）上的电子部件（3）的夹头（6），与超声波振动发生装置（8）连接的控制单元（9） 以及连接到所述控制单元（9）的基板导体加热单元（4）。 为了检查形成的接头的状态，用于监视施加到超声波振动发生装置（8）的电压，电流或两者的测量装置与控制单元（9）连接。 因此，可以测量施加到超声波振动发生装置（9）的电压和/或电流（i），以分别比较测量的电压和/或电流（i）与参考波形，以确定是否 电压和/或电流通常施加到超声波振动发生装置（9），并根据测量的电压和/或电流与参考波的比较结果来判断形成的连接有缺陷或无缺陷 形式。

公开(公告)号：EP1486790A1

公开(公告)日：2004-12-15

申请号：EP04017117.5

申请日：1999-04-07

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Fuji, Tomonori ,  Suzuki, Kazutaka

IPC: G01R31/04 ,  H01L21/60 ,  H01L21/607 ,  H01L21/603 ,  H01L21/66

CPC classification number: H01L24/81 ,  B23K20/023 ,  B23K20/025 ,  B23K20/10 ,  B23K20/106 ,  B23K2201/40 ,  B29C65/08 ,  B29C66/8322 ,  H01L24/75 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81206 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00

Abstract: The present invention relates to a mounting apparatus (30) for mounting an electronic part (3) utilizing ultrasonic wave and thermocompression bonding to form a flip-chip bonding system, comprising an ultrasonic vibration generating device (8), a horn (7) attached to the ultrasonic vibration generating device (8), a collet tool (6) for holding an electronic part (3) attached to the horn (7), a control unit (9) being connected to the ultrasonic vibration generating device (8), and a substrate conductor heating unit (4) connected to said control unit (9). To inspect the state of the formed joint, a vibrating measuring device (21) for monitoring a vibrating state of the electronic part (3) or the bump (5) is connected with the control unit (9). Thus, it is possible to measure a vibrating state of the electronic part (3) at the time of mounting is and to compare it with a reference wave form, to make a judgment as to whether or not an ultrasonic vibration is applied normally, and to judge the connection as defective or non-defective in accordance with the judgment on the ultrasonic vibration application.

Abstract translation: 本发明涉及一种利用超声波和热压接合来安装电子部件（3）以形成倒装芯片接合系统的安装设备（30），该倒装芯片接合系统包括超声振动产生装置（8），附接的喇叭（7） 在超声波振动发生装置（8）上安装有用于保持安装在喇叭（7）上的电子部件（3）的夹头工具（6），与超声波振动发生装置（8）连接的控制部（9） 和连接到所述控制单元（9）的基板导体加热单元（4）。 为了检查成形接头的状态，用于监测电子部件（3）或凸块（5）的振动状态的振动测量装置（21）与控制单元（9）连接。 因此，可以测量安装时电子部件（3）的振动状态并将其与参考波形进行比较，以判断是否正常施加超声波振动，以及 根据对超声波振动施加的判断来判断连接是否有缺陷或无缺陷。

公开(公告)号：EP1209736A2

公开(公告)日：2002-05-29

申请号：EP01127267.1

申请日：2001-11-16

Applicant: SONY CORPORATION

Inventor： Yoshida, Koji

IPC: H01L21/60 ,  H01L23/495

CPC classification number: H05K1/111 ,  H01L23/49838 ,  H01L23/5386 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/45144 ,  H01L2224/81206 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0665 ,  H05K3/328 ,  H05K2201/09418 ,  H05K2201/10674 ,  H05K2203/0285 ,  Y02P70/611 ,  H01L2924/00

Abstract: A semiconductor device includes a wiring pattern formed on a board, and a semiconductor chip bonded to the wiring pattern by ultrasonic welding. The wiring pattern is formed such that when the semiconductor chip is disposed on the wiring pattern, a range shared between the wiring pattern and positional variation regions of portions to be bonded of the semiconductor chip accompanied by the ultrasonic welding becomes as wide as possible. Such a semiconductor device makes it possible to ensure a sufficient positional deviation range of a wiring pattern with respect to a positional deviation in each bump type electrode, and hence to cope with a multipin structure for flip-chip mounting and to improve both an initial bonding characteristic and a mounting reliability.

Abstract translation: 一种半导体器件包括形成在板上的布线图案和通过超声波焊接接合到布线图案的半导体芯片。 布线图形形成为使得当布线图案上布置半导体芯片时，布线图案和伴随着超声波焊接的半导体芯片的待接合部分的位置变化区域之间共享的范围尽可能宽。 这样的半导体器件使得可以确保布线图案相对于每个凸块型电极中的位置偏差的足够的位置偏差范围，并且因此能够应对用于倒装芯片安装的多芯结构并且改善初始接合 特性和安装可靠性。

公开(公告)号：EP1469319B1

公开(公告)日：2006-03-22

申请号：EP04017118.3

申请日：1999-04-07

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Fuji, Tomonori ,  Suzuki, Kazutaka

IPC: G01R31/04 ,  H01L21/60 ,  H01L21/607 ,  H01L21/603 ,  H01L21/66

CPC classification number: H01L24/81 ,  B23K20/023 ,  B23K20/025 ,  B23K20/10 ,  B23K20/106 ,  B23K2201/40 ,  B29C65/08 ,  B29C66/8322 ,  H01L24/75 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81206 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00

公开(公告)号：EP1458018A1

公开(公告)日：2004-09-15

申请号：EP04001572.9

申请日：2004-01-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Maeda, Takenobu, Murata Manufacturing Co., Ltd.

IPC: H01L21/607 ,  H01L21/60

CPC classification number: H05K1/0271 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/81206 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K3/328 ,  H05K2201/10416 ,  H05K2201/10674 ,  H05K2201/2009 ,  H05K2201/2045 ,  H05K2203/0285 ,  H01L2924/00 ,  H01L2224/05624 ,  H01L2924/00014

Abstract: In an electronic component device, electrodes of an electric component and respective wiring lines(11,12) on a board(10A) are collectively bonded together via bumps(22) using ultrasonic vibration. The wiring lines(12) include wiring lines that are substantially parallel to the direction of ultrasonic vibration and wiring lines(11) that are substantially perpendicularly to the direction of ultrasonic vibration. A displacement inhibiting layer(13) is provided inside the board(10A) in a portion below the wiring lines(11) that are substantially perpendicular to the direction of ultrasonic vibration.

Abstract translation: 在电子部件装置中，电子部件的电极和板（10A）上的各布线（11,12）通过使用超声波振动的凸块（22）共同地接合在一起。 布线（12）包括基本上平行于超声波振动方向的布线和基本上垂直于超声波振动方向的布线（11）。 在布线（11）的下方与超声波振动方向大致垂直的部分，在基板（10A）的内部设置有位移抑制层（13）。

公开(公告)号：EP0949670A3

公开(公告)日：1999-11-17

申请号：EP99106876.8

申请日：1999-04-07

Applicant: TAIYO YUDEN Co., Ltd.

Inventor： Fuji, Tomonori, c/o Taiyo Yuden Co., Ltd. ,  Suzuki, Kazutaka c/o Taiyo Yuden Co., Ltd.

IPC: H01L21/60 ,  H01L21/607 ,  H01L21/603 ,  H01L21/66

CPC classification number: H01L24/81 ,  B23K20/023 ,  B23K20/025 ,  B23K20/10 ,  B23K20/106 ,  B23K2201/40 ,  B29C65/08 ,  B29C66/8322 ,  H01L24/75 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81206 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00

Abstract: A mounting method and a mounting apparatus of an electronic part onto a substrate are provided, which enable inspection of a bond formed between an electronic part and a substrate when flip-chip bonding is executed by an ultrasonic wave and thermocompression bonding connecting method. A mounting apparatus of an electronic part, such as a semiconductor chip, comprises a control unit, an ultrasonic vibration generating device connected to the control unit, a horn attached to the ultrasonic vibration generating device, a collet tool to hold the semiconductor chip connected to the control unit, a substrate conductor heating unit, and a laser displacement meter as a height measuring device for monitoring the height of the head of the collet tool (which holds the semiconductor chip) with respect to a substrate conductor which is connected with the control unit 9. The semiconductor chip has bumps which, when are compressed and subjected to ultrasonic vibration, enable formation of a connection between the semiconductor chip and a substrate conductor. The mounting apparatus is constructed so that the amount of compression of the bumps (sinking amounts of bumps) when a predetermined weight R and an ultrasonic vibration US are applied to the bumps for a predetermined time are monitored by the laser displacement meter, a judgment is made as to whether or not the sinking amounts respectively fall within desired ranges, and then a judgment is made as to whether the joint formed by the ultrasonic wave and thermocompression bonding connection utilizing the flip-chip bonding system is defective or non-defective.

Abstract translation: 提供了一种将电子部件安装到基板上的安装方法和安装设备，其能够在利用超声波和热压接合连接方法执行倒装芯片接合时检查在电子部件和基板之间形成的接合。 诸如半导体芯片之类的电子部件的安装装置包括控制单元，连接到控制单元的超声波振动产生装置，连接到超声波振动产生装置的焊头，夹持工具以夹持连接到半导体芯片的半导体芯片 控制单元，基板导体加热单元和作为高度测量装置的激光位移计，用于相对于与控制器连接的基板导体监控夹头工具（其保持半导体芯片）的头部的高度 单元9.半导体芯片具有凸块，当其被压缩并受到超声波振动时，能够在半导体芯片和衬底导体之间形成连接。 安装装置被构造成使得当预定重量R和超声波振动US被施加到凸块预定时间时的凸块的压缩量（下沉量）被激光位移计监视，判断是 对下沉量是否分别落在期望的范围内进行判断，然后判断由超声波和利用倒装接合系统的热压接合连接形成的接缝是否有缺陷或无缺陷。

公开(公告)号：EP0949670A2

公开(公告)日：1999-10-13

申请号：EP99106876.8

申请日：1999-04-07

Applicant: TAIYO YUDEN Co., Ltd.

Inventor： Fuji, Tomonori, c/o Taiyo Yuden Co., Ltd. ,  Suzuki, Kazutaka c/o Taiyo Yuden Co., Ltd.

IPC: H01L21/60 ,  H01L21/607 ,  H01L21/603 ,  H01L21/66

CPC classification number: H01L24/81 ,  B23K20/023 ,  B23K20/025 ,  B23K20/10 ,  B23K20/106 ,  B23K2201/40 ,  B29C65/08 ,  B29C66/8322 ,  H01L24/75 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81206 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00

Abstract: A mounting method and a mounting apparatus of an electronic part onto a substrate are provided, which enable inspection of a bond formed between an electronic part and a substrate when flip-chip bonding is executed by an ultrasonic wave and thermocompression bonding connecting method. A mounting apparatus of an electronic part, such as a semiconductor chip, comprises a control unit, an ultrasonic vibration generating device connected to the control unit, a horn attached to the ultrasonic vibration generating device, a collet tool to hold the semiconductor chip connected to the control unit, a substrate conductor heating unit, and a laser displacement meter as a height measuring device for monitoring the height of the head of the collet tool (which holds the semiconductor chip) with respect to a substrate conductor which is connected with the control unit 9.
The semiconductor chip has bumps which, when are compressed and subjected to ultrasonic vibration, enable formation of a connection between the semiconductor chip and a substrate conductor. The mounting apparatus is constructed so that the amount of compression of the bumps (sinking amounts of bumps) when a predetermined weight R and an ultrasonic vibration US are applied to the bumps for a predetermined time are monitored by the laser displacement meter, a judgment is made as to whether or not the sinking amounts respectively fall within desired ranges, and then a judgment is made as to whether the joint formed by the ultrasonic wave and thermocompression bonding connection utilizing the flip-chip bonding system is defective or non-defective.

Abstract translation: 提供一种电子部件到基板上的安装方法和安装装置，当通过超声波和热压接连接方法进行倒装芯片接合时，能够检查在电子部件和基板之间形成的接合。 诸如半导体芯片的电子部件的安装装置包括控制单元，连接到控制单元的超声波振动发生装置，安装在超声波振动发生装置上的喇叭，用于保持与半导体芯片连接的半导体芯片的夹头工具 控制单元，基板导体加热单元和作为高度测量装置的激光位移计，用于监测夹具（其保持半导体芯片）的头部相对于与控制器连接的基板导体的高度 单元9.半导体芯片具有凸起，当被压缩并进行超声波振动时，能够形成半导体芯片和基板导体之间的连接。 安装装置被构造成使得当预定重量R和超声波振动US施加到凸起预定时间时，凸起的压缩量（凹凸量）被激光位移计监视，判断是 关于下沉量是否分别落在期望范围内，然后判断由超声波形成的接合和利用倒装芯片接合系统的热压接连接是否有缺陷或无缺陷。