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公开(公告)号：EP0148209A1
公开(公告)日：1985-07-17
申请号：EP84902283.0
申请日：1984-05-21
摘要： Procédé de déposition de métal sans apport de courant électrique sur un substrat non conducteur, comportant le traitement d'un substrat avant la déposition sans apport de courant électrique au moyen d'une composition catalytique contenant un catalyseur d'étain et de palladium mélangés. On améliore la déposition du métal en mettant le substrat traité en contact avec un bain accélérateur contenant un agent oxydant l'étain.
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公开(公告)号：EP0148209B1
公开(公告)日：1988-11-02
申请号：EP84902283.5
申请日：1984-05-21
IPC分类号： C23C18/28
摘要： A method of electroless deposition of metal on a non-conductive substrate is disclosed and comprises treating a substrate prior to electroless deposition with a catalyst composition containing a mixed tin-palladium catalyst. An improvement in metal deposition is obtained by contacting the treated substrate with an accelerator bath containing an agent which oxidizes the tin.
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3.发明公开
公开(公告)号：EP1360720A2
公开(公告)日：2003-11-12
申请号：EP02702009.8
申请日：2002-01-15
CPC分类号： H01C17/24 , H01C17/242 , H05K1/167 , H05K3/027 , H05K3/064 , H05K3/184 , H05K2201/0344 , H05K2203/0315 , H05K2203/107 , H05K2203/1105 , H05K2203/1453 , H05K2203/171
摘要： A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
摘要翻译： 通过将电阻器电镀到绝缘衬底上，可以看出电阻器可以与印刷电路板一体制造的过程。 作为改善镀敷电阻器的均匀性和一致性的技术，讨论了通过蚀刻和电镀电阻器的氧化来使绝缘基板均匀化。 修剪和烘烤也被公开为调整和稳定电镀电阻器的电阻的方法。
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公开(公告)号：EP2001603B1
公开(公告)日：2012-09-26
申请号：EP07751838.9
申请日：2007-02-27
CPC分类号： H05K3/061 , B41M5/0047 , B41M5/0058 , C23F1/18 , H05K3/383 , H05K2203/013 , H05K2203/1173
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公开(公告)号：EP2001603A2
公开(公告)日：2008-12-17
申请号：EP07751838.9
申请日：2007-02-27
IPC分类号： B05D7/14
CPC分类号： H05K3/061 , B41M5/0047 , B41M5/0058 , C23F1/18 , H05K3/383 , H05K2203/013 , H05K2203/1173
摘要： A process for printing inks or organic resists using a droplet discharge printing mechanism onto a copper or copper alloy surface with increased resolution is described. The increased resolution is achieved by first preferably microetching the surface and then treating the copper surface with an organic substance which is capable of lowering the surface energy of the copper surface or capable of making the copper surface more hydrophobic prior to printing thereon. The process is useful in the manufacture of electronic circuits.
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6.发明公开METHOD FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS WITH INTEGRAL PLATED RESISTORS 审中-公开用于生产印制电路板具有整体复合电阻器
公开(公告)号：EP1552729A2
公开(公告)日：2005-07-13
申请号：EP03808947.0
申请日：2003-08-06
发明人： KUKANSKIS, Peter , DURSO, Frank , SAWOSKA, David
CPC分类号： H01C17/06 , C23C18/1605 , C23C18/1651 , C23C18/32 , C23C18/42 , H05K1/167 , H05K3/184 , H05K3/244 , H05K3/28 , H05K2203/0565 , H05K2203/1453
摘要： The present invention is a process for manufacturing resistors integral with the printed circuit board by plating the resistors onto the insulative substrate. The invention uses a mask during the activation step so as to selectively activate only selected portions of the surface thus enabling smaller areas to be plated on the printed circuit board because no plating mask is used. The process of the instant invention produced printed circuit boards having greater uniformity and reliability as compared to the prior art.
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