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公开(公告)号：EP2916629A1
公开(公告)日：2015-09-09
申请号：EP14854898.5
申请日：2014-01-14
CPC分类号： H05K1/028 , H05K1/024 , H05K1/025 , H05K1/0278 , H05K1/0281 , H05K3/0044 , H05K3/282 , H05K3/4652 , H05K3/4691 , H05K2201/0187 , H05K2201/0191 , H05K2203/0207 , H05K2203/0228
摘要： A printed wiring board (10) includes: an inner layer structure body (20) containing at least an inner layer insulative base material (31) composed of a glass cloth (31a) and resin (31b) which covers the glass cloth (31a) and not containing a resin insulative base material composed only of resin; outer layer wiring (21) formed on a first face (20a) of the inner layer structure body (20); and a solder resist layer (23) formed on a surface of the outer layer wiring (21), wherein in the inner layer structure body (20), an opening part (11) is formed, and the solder resist layer (23) is composed of a first ink part (23a) covering at least the outer layer wiring (21) that is formed on a partial region of the first face (20a) which corresponds to the opening part (11) and a second ink part (23b) interposing both ends of the first ink part (23a) and being lower in flexibility than the first ink part (23a).
摘要翻译： 印刷电路板（10）具有至少包含由玻璃布（31a）构成的内层绝缘基材（31）和覆盖该玻璃布（31a）的树脂（31b）的内层结构体（20） 并且不包含仅由树脂构成的树脂绝缘基材; 形成在所述内层结构体（20）的第一面（20a）上的外层布线（21）; 和形成在所述外层布线（21）的表面上的阻焊层（23），其中在所述内层结构体（20）中形成开口部分（11），并且所述阻焊层（23）是 由至少覆盖形成在所述第一面（20a）的与所述开口部（11）对应的部分区域上的所述外层布线（21）的第一墨水部分（23a）和第二墨水部分（23b）构成， 介于第一墨水部分（23a）的两端并且柔性比第一墨水部分（23a）低。
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公开(公告)号：EP2916629B1
公开(公告)日：2018-06-06
申请号：EP14854898.5
申请日：2014-01-14
CPC分类号： H05K1/028 , H05K1/024 , H05K1/025 , H05K1/0278 , H05K1/0281 , H05K3/0044 , H05K3/282 , H05K3/4652 , H05K3/4691 , H05K2201/0187 , H05K2201/0191 , H05K2203/0207 , H05K2203/0228
摘要： A printed wiring board (10) includes: an inner layer structure body (20) containing at least an inner layer insulative base material (31) composed of a glass cloth (31a) and resin (31b) which covers the glass cloth (31a) and not containing a resin insulative base material composed only of resin; outer layer wiring (21) formed on a first face (20a) of the inner layer structure body (20); and a solder resist layer (23) formed on a surface of the outer layer wiring (21), wherein in the inner layer structure body (20), an opening part (11) is formed, and the solder resist layer (23) is composed of a first ink part (23a) covering at least the outer layer wiring (21) that is formed on a partial region of the first face (20a) which corresponds to the opening part (11) and a second ink part (23b) interposing both ends of the first ink part (23a) and being lower in flexibility than the first ink part (23a).
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