公开(公告)号：EP3469861B1

公开(公告)日：2024-05-08

申请号：EP17733030.5

申请日：2017-06-09

IPC分类号： H05K1/11 ,  H01P5/02 ,  H01R12/72 ,  H01R13/11 ,  H05K1/02

CPC分类号： H01R13/112 ,  H01P5/028 ,  H05K1/025 ,  H05K2201/0938120130101 ,  H05K2201/0948120130101 ,  H05K2201/0961820130101 ,  H05K2201/0967220130101 ,  H05K2201/0972720130101 ,  H05K2201/097920130101 ,  H01R12/721 ,  H05K1/117

公开(公告)号：EP3300464A1

公开(公告)日：2018-03-28

申请号：EP17197530.3

申请日：2009-11-09

申请人： Nitto Denko Corporation

发明人： ISHII, Jun ,  NAITOU, Toshiki ,  HONJO, Mitsuru

IPC分类号： H05K1/02 ,  H05K3/46 ,  G11B5/48

CPC分类号： H05K3/4685 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/0265 ,  H05K1/056 ,  H05K3/06 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09627 ,  H05K2201/0979 ,  H05K2203/0323 ,  Y10T29/49155

摘要： An end of a first line and an end of a second line of a first write wiring pattern are arranged on both sides of a third line of a second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. In addition, through holes are formed in respective portions of a base insulating layer below the connection portions. Each connection portion comes in contact with a connecting region of a suspension body within the through hole.

摘要翻译： 第一写入布线图案的第一行的末端和第二行的末端布置在第二写入布线图案的第三行的两侧。 在第一行和第二行的末端提供圆形连接部分。 另外，在连接部分下方的基底绝缘层的各个部分中形成通孔。 每个连接部分与通孔内的悬挂体的连接区域接触。

公开(公告)号：EP3123620A4

公开(公告)日：2018-03-14

申请号：EP15770310

申请日：2015-03-23

申请人： SENTINEL CONNECTOR SYSTEMS INC

发明人： ROBINSON BRETT

IPC分类号： H04B3/46 ,  H01R13/6469 ,  H01R13/6474

CPC分类号： H01R31/065 ,  H01R13/6473 ,  H01R24/50 ,  H01R24/64 ,  H01R2201/20 ,  H05K1/025 ,  H05K1/0268 ,  H05K1/0366 ,  H05K2201/09027 ,  H05K2201/10189

摘要： A testing unit including a substrate, a plurality of vias located in the substrate, a plurality of pin traces having a height and a width and each extending from a respective via towards an edge of the substrate, a plurality of end traces having a height and a width with each end trace extending from an end of a respective pin trace towards the edge of the substrate, a plurality of branch traces having a height and a width and each extending from a side of a respective pin trace, a plurality of traces extending from the end of a respective end trace, branch trace or pin trace to the edge of the substrate, where each end trace is adjacent to a respective branch trace.

公开(公告)号：EP3123619A4

公开(公告)日：2018-03-14

申请号：EP15769455

申请日：2015-03-23

申请人： SENTINEL CONNECTOR SYSTEMS INC

发明人： ROBINSON BRETT

IPC分类号： H04B3/46 ,  H01R13/6469 ,  H01R13/6474

CPC分类号： H01R31/065 ,  H01R13/6473 ,  H01R24/50 ,  H01R24/64 ,  H01R2201/20 ,  H05K1/025 ,  H05K1/0268 ,  H05K1/0366 ,  H05K2201/09027 ,  H05K2201/10189

摘要： A testing unit including a substrate, a plurality of vias located in the substrate, a plurality of pin traces having a height and a width and each extending from a respective via towards an edge of the substrate and terminating at an end point, a plurality of termination points adjacent to the end points of the pin traces, a plurality of end traces having a height and a width with each end trace extending from an end point of a respective pin trace towards to a corresponding termination point near to the pin trace, a plurality of traces extending from the end of a respective end point or termination point to the edge of the substrate, where the end points of each pin trace are adjacent to each other.

公开(公告)号：EP2651199B1

公开(公告)日：2018-02-21

申请号：EP13162441.3

申请日：2013-04-05

申请人： Canon Kabushiki Kaisha

发明人： Murai, Yusuke ,  Hoshi, Sou ,  Yamashita, Nobuaki

IPC分类号： H05K1/02

CPC分类号： H05K1/025 ,  H01L2224/16225 ,  H05K1/0225 ,  H05K1/0243 ,  H05K1/181 ,  H05K2201/09263 ,  H05K2201/093 ,  H05K2201/09709

摘要： Provided is a printed circuit board 100 capable of increasing an inductance value of a power pattern and a ground pattern while keeping a low electric resistance value of the power pattern and the ground pattern. The printed circuit board includes a printed wiring board 101 including: a power layer 113 having a power pattern 131 formed therein; and a ground layer 112 having a ground pattern 121 formed therein. On the printed wiring board, an LSI 102 as a semiconductor device and an LSI 104 as a power supply member are mounted. The ground pattern has a first ground region R that overlaps the power pattern as viewed from the direction perpendicular to the surface of the printed wiring board. In the first ground region, at least one defect portion 122 is formed. In the first ground region, the defect portion forms a region 121a that is narrower than the power pattern.

公开(公告)号：EP3245853A2

公开(公告)日：2017-11-22

申请号：EP16704956.8

申请日：2016-01-11

申请人： Qualcomm Incorporated

发明人： SUBRAMANIAN, Yokesh

IPC分类号： H05K1/02 ,  G11C5/02

CPC分类号： H05K1/0213 ,  G11C5/025 ,  H05K1/0243 ,  H05K1/0246 ,  H05K1/0248 ,  H05K1/025 ,  H05K1/18 ,  H05K2201/09227 ,  H05K2201/09254

摘要： A method for propagating a signal from an output driver on a PCB to a number of chips on the PCB. The signal is propagated from a first transmission line connected to the output driver, to a second transmission line connected to the first transmission line and a first chip, and to a third transmission line connected to the first transmission line and a second chip. The second transmission line has a length greater than or equal to 10 times the length of the first transmission line, and the third transmission line has a length greater than or equal to 10 times the length of the first transmission line. The lengths of the first transmission line, the second transmission line, and the third transmission line cause a reduction in reflections of the signal due to a change in impedance at a junction of the first, second, and third transmission lines.

公开(公告)号：EP2515623A3

公开(公告)日：2017-11-22

申请号：EP12164866.1

申请日：2012-04-20

申请人： Oclaro Japan, Inc.

发明人： Kagaya, Osamu

IPC分类号： H05K1/02 ,  H01P3/02 ,  H05K1/16

CPC分类号： H04B10/801 ,  H01P3/026 ,  H05K1/0218 ,  H05K1/0245 ,  H05K1/0246 ,  H05K1/025 ,  H05K1/162 ,  H05K2201/09727 ,  H05K2201/10121

摘要： A differential transmission circuit includes a grounded conductive layer 110, a pair of transmission line conductors 101, 102, a conductive film 103 and a via hole 104 which connects the grounded conductive layer 110 to the conductive film 103. The differential transmission circuit further includes a straight-line region SL1, SL2 which is present in the differential transmission circuit through which a differential transmission signal output by a driving circuit is transmitted and in which the pair of transmission line conductors 101, 102 extends parallel so as to have a first width W0, and a band rejection filter region FL in which the pair of transmission line conductors 101, 102 planarly overlaps the conductive film 103 and extends parallel so as to have a second width WF narrower than the first width W0 and a common mode of the differential transmission signal is attenuated at one of the frequencies which are natural number multiples of a frequency corresponding to the predetermined bit rate.

摘要翻译： 差动传输电路包括接地导电层110，一对传输线导体101,102，导电膜103和将接地导电层110连接到导电膜103的通孔104.差分传输电路还包括 存在于差分传输电路中的直线区域SL1，SL2，通过所述差分传输电路传输由驱动电路输出的差分传输信号，并且其中一对传输线路导体101,102平行延伸以具有第一宽度W0 ，以及一对传输线路导体101,102与导电膜103平面重叠并平行延伸以具有比第一宽度W0窄的第二宽度WF的带阻滤波器区域FL，以及差分传输的共模 信号在与预定相对应的频率的自然数倍的频率之一处被衰减 d比特率。

公开(公告)号：EP2654387A3

公开(公告)日：2017-07-19

申请号：EP13162056.9

申请日：2013-04-03

申请人： Canon Kabushiki Kaisha

发明人： Isono, Hiroshi

IPC分类号： H05K1/02

CPC分类号： H05K1/181 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2924/15174 ,  H05K1/0228 ,  H05K1/0231 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/0298 ,  H05K1/115 ,  H05K2201/09654 ,  H05K2201/10545 ,  H05K2201/10734

摘要： A printed circuit board includes a first semiconductor package (1) on a first surface layer (102) of a printed wiring board (101) and a second semiconductor package (2) on a second surface layer (103) where a bus signal is transmitted from the first to the second semiconductor package. A first bus wiring path (17) from a signal terminal (12) on an inner circumference side of the first semiconductor package via a via hole (16) and the second surface layer to a signal terminal (14) on an outer circumference side of the second semiconductor package and a second bus wiring path (18) from a signal terminal (13) on an outer circumference side of the first semiconductor package via the second surface layer and a via hole (19) to a signal terminal (15) on an inner circumference side of the second semiconductor package are provided, thus securing a return current path and realizing a high density wiring while suppressing radiation noise.

摘要翻译： 印刷电路板包括在印刷线路板（101）的第一表面层（102）上的第一半导体封装件（1）和在其中传输总线信号的第二表面层（103）上的第二半导体封装件（2） 从第一半导体封装到第二半导体封装。 从第一半导体封装的内周侧上的信号端子（12）经由通孔（16）和第二表面层到第一半导体封装的外周侧上的信号端子（14）的第一总线布线路径（17） 所述第二半导体封装和第二总线布线路径从所述第一半导体封装的外周侧上的信号端子经由所述第二表面层和过孔从所述第二半导体封装的第一总线布线路径延伸到所述第一半导体封装上的信号端子; 设置第二半导体封装的内周侧，由此确保返回电流路径并实现高密度布线同时抑制辐射噪声。

公开(公告)号：EP3123620A1

公开(公告)日：2017-02-01

申请号：EP15770310.9

申请日：2015-03-23

申请人： Sentinel Connector Systems Inc.

发明人： ROBINSON, Brett

IPC分类号： H04B3/46 ,  H01R13/6474 ,  H01R13/6469

CPC分类号： H01R31/065 ,  H01R13/6473 ,  H01R24/50 ,  H01R24/64 ,  H01R2201/20 ,  H05K1/025 ,  H05K1/0268 ,  H05K1/0366 ,  H05K2201/09027 ,  H05K2201/10189

摘要： A testing unit including a substrate, a plurality of vias located in the substrate, a plurality of pin traces having a height and a width and each extending from a respective via towards an edge of the substrate, a plurality of end traces having a height and a width with each end trace extending from an end of a respective pin trace towards the edge of the substrate, a plurality of branch traces having a height and a width and each extending from a side of a respective pin trace, a plurality of traces extending from the end of a respective end trace, branch trace or pin trace to the edge of the substrate, where each end trace is adjacent to a respective branch trace.

摘要翻译： 一种测试单元，包括基板，位于基板中的多个通孔，具有高度和宽度的多个引脚迹线，并且各自从相应的通孔延伸到基板的边缘，多个端部迹线具有高度和 每个端部迹线的宽度从相应的引脚迹线的端部延伸到衬底的边缘;多个分支迹线，具有高度和宽度，并且各自从相应的引脚迹线的一侧延伸，多个迹线延伸 从相应末端迹线的末端，分支迹线或引脚迹线到基板的边缘，其中每个末端迹线与相应的分支迹线相邻。

公开(公告)号：EP3102010A1

公开(公告)日：2016-12-07

申请号：EP15170230.5

申请日：2015-06-02

申请人： Tyco Electronics Svenska Holdings AB

发明人： Kaikkonen, Andrei ,  Svenson, Lars-Goete ,  Lundqvist, Lennart Per Olof ,  Chacinski, Marek Grzegorz ,  Chitica, Nicolae Pantazi

IPC分类号： H05K1/00 ,  H05K1/03

CPC分类号： H05K1/025 ,  G06F1/189 ,  H05K2201/0792 ,  H05K2201/1006

摘要： The present invention relates to a power delivery network for providing electric current from a power supply to a radio frequency device mounted on a printed circuit board. The power delivery network comprises: the printed circuit board; the power supply; a radio frequency device adapted to draw an electric current from the power supply, varying in time, with frequencies in a predetermined frequency range; a connection line for providing the electric current from the power supply to the radio frequency device, wherein the connection line is connected to the power supply at one end thereof and to the radio frequency device at an other end thereof, and the connection line shows a parasitic impedance in the predetermined frequency range; a first capacitor coupled between the one end of the connection line and ground of the printed circuit board; a second capacitor coupled between the other end of the connection line and ground of the printed circuit board, wherein the connection line and the first capacitor form the first branch of a parallel circuit, the second capacitor forms the second branch of the parallel circuit, the first capacitor is configured such that in the predetermined frequency range, the resonance frequency of the parallel circuit is only determined by the parasitic inductance of the connection line and the capacitance of the second capacitor, and the second branch of the parallel circuit is configured to decrease the quality factor of the parallel circuit in such a way that the impedance seen by the radio frequency device towards the power supply is lower than a predetermined impedance in the predetermined frequency range.

摘要翻译： 本发明涉及到电力输送网络，用于从电源向安装在印刷电路板的射频装置提供电流。 电力输送网络包括：印刷电路板; 电源; 一个射频设备angepasst上绘制从电源电流，在时间上变化，与在预定的频率范围内的频率; 用于从所述电源到所述射频设备提供的电流，worin连接线的连接线被连接到电源的一端，并在其另一端的射频设备，和连接线示出了 在预定的频率范围的寄生阻抗; 耦合在印刷电路板的连接线和地线的一端之间的第一电容器; 一第二电容，耦接所述印刷电路板的连接线和接地的另一端之间，worin的连接线与所述第一电容器形成并联电路的第一分支，所述第二电容器形成并联电路的第二分支，所述 第一电容器被配置搜索的确在预定的频率范围，所述并联电路的谐振频率是只确定由连接线和所述第二电容器的电容，并且该并联电路的第二分支的寄生电感开采被配置为减少 该并联电路的在寻求一种方式的品质因数确实通过朝向电源的射频设备看到的阻抗比在预定的频率范围内的预定阻抗。