Abstract:
A method of forming a magnetic electrode of a magnetic tunnel junction comprises forming non-magnetic MgO-comprising material over conductive material of the magnetic electrode being formed. An amorphous metal is formed over the MgO-comprising material. Amorphous magnetic electrode material comprising Co and Fe is formed over the amorphous metal. The amorphous magnetic electrode material is devoid of B. Non-magnetic tunnel insulator material comprising MgO is formed directly against the amorphous magnetic electrode material. The tunnel insulator material is devoid of B. After forming the tunnel insulator material, the amorphous Co and Fe-comprising magnetic electrode material is annealed at a temperature of at least about 250° C. to form crystalline Co and Fe-comprising magnetic electrode material from an MgO-comprising surface of the tunnel insulator material. The crystalline Co and Fe-comprising magnetic electrode material is devoid of B. Other method and non-method embodiments are disclosed.
Abstract:
A method of forming a line of magnetic tunnel junctions includes forming magnetic recording material over a substrate, non-magnetic material over the recording material, and magnetic reference material over the non-magnetic material. The substrate has alternating outer regions of reactant source material and insulator material along at least one cross-section. The reference material is patterned into a longitudinally elongated line passing over the alternating outer regions. The recording material is subjected to a set of temperature and pressure conditions to react with the reactant of the reactant source material to form regions of the dielectric material which longitudinally alternate with the recording material along the line and to form magnetic tunnel junctions along the line which individually comprise the recording material, the non-magnetic material, and the reference material that are longitudinally between the dielectric material regions. Other methods, and lines of magnetic tunnel junctions independent of method, are disclosed.
Abstract:
Methods of forming magnetic memory cells are disclosed. Magnetic and non magnetic materials are formed into a primal precursor structure in an initial stress state of essentially no strain, compressive strain, or tensile strain. A stress compensating material, e.g ., a non sacrificial, conductive material, is formed to be disposed on the primal precursor structure to form a stress compensated precursor structure in a net beneficial stress state. Thereafter, the stress compensated precursor structure may be patterned to form a cell core of a memory cell. The net beneficial stress state of the stress compensated precursor structure lends to formation of one or more magnetic regions, in the cell core, exhibiting a vertical magnetic orientation without deteriorating a magnetic strength of the one or more magnetic regions. Also disclosed are memory cells, memory cell structures, semiconductor device structures, and spin torque transfer magnetic random access memory (STT MRAM) systems.
Abstract:
A memory device and method of making the memory device. The memory device comprises a storage transistor at a surface of a substrate. The storage transistor comprises a body portion between first and second source/drain regions, wherein the source/drain regions are regions of a first conductivity type. The storage transistor also comprises a gate structure that wraps at least partially around the body portion in at least two spatial planes. A bit line is connected to the first source/drain region and a word line is connected to the gate structure.
Abstract:
A switch comprising: a graphene structure (24) extending longitudinally between a pair of electrodes (16, 18) and being conductively connected to both electrodes of said pair; first and second electrically conductive structures (26, 28) laterally outward of the graphene structure and on opposing sides of the graphene structure from one another; and ferroelectric material (31) laterally between the graphene structure and at least one of the first and second electrically conductive structures, the first and second electrically conductive structures being configured to provide the switch into "on" and "off' states by application of an electric field (EF) across the graphene structure and the ferroelectric material.