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公开(公告)号：EP3061789B1
公开(公告)日：2018-05-30
申请号：EP14856363.8
申请日：2014-10-20
CPC分类号： C08K5/315 , B32B15/08 , B32B27/20 , B32B27/42 , B32B2307/3065 , B32B2457/08 , C08G73/0655 , C08J5/24 , C08J2379/04 , C08J2463/00 , C08K3/013 , C08L63/00 , C08L65/00 , C08L79/04 , H05K1/0353 , H05K1/056 , C08L79/085
摘要： It is an object of the present invention to provide a resin composition which can realize a printed wired board having not only low water-absorbing property but also excellent heat resistance after moisture absorption, flame retardancy, and solvent solubility. It is another object of the present invention to provide a prepreg and a monolayer or laminate which use the resin composition, and a metal foil clad laminate and a printed wired board which use the prepreg. A resin composition of the present invention contains one or two or more cyanate ester compounds (A) represented by the following formula (1) and an epoxy resin (B): wherein R 1 , R 2 , R 3 , and R 4 represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and may be the same or different from each other; and n represents an integer of 1 to 50.
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2.发明公开
公开(公告)号：EP3012294A1
公开(公告)日：2016-04-27
申请号：EP14814473.6
申请日：2014-06-16
CPC分类号： H01B3/40 , B32B15/092 , B32B15/14 , B32B27/12 , B32B2260/021 , B32B2260/046 , B32B2457/08 , C08G10/04 , C08G14/12 , C08G73/0655 , C08J5/24 , C08J2363/00 , C08K3/36 , C08L61/18 , C08L61/34 , C08L63/00 , C08L79/04 , C09D161/18 , C09D161/34 , C09D163/00 , C09D179/04 , C09J161/34 , C09J179/04 , H01B3/307 , H01B3/36 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K2201/012
摘要： The resin composition of the present invention comprises a cyanate ester compound (A) obtained by cyanating a modified naphthalene formaldehyde resin, and an epoxy resin (B).
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公开(公告)号：EP3012294B1
公开(公告)日：2020-09-16
申请号：EP14814473.6
申请日：2014-06-16
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4.发明公开RESIN COMPOSITION, PREPREG, LAMINATED SHEET, AND METAL-FOIL-CLAD LAMINATED BOARD 有权树脂组合物，预浸料，叠层薄膜和带覆金属箔层压板
公开(公告)号：EP3061789A1
公开(公告)日：2016-08-31
申请号：EP14856363.8
申请日：2014-10-20
CPC分类号： C08K5/315 , B32B15/08 , B32B27/20 , B32B27/42 , B32B2307/3065 , B32B2457/08 , C08G73/0655 , C08J5/24 , C08J2379/04 , C08J2463/00 , C08K3/013 , C08L63/00 , C08L65/00 , C08L79/04 , H05K1/0353 , H05K1/056 , C08L79/085
摘要： It is an object of the present invention to provide a resin composition which can realize a printed wired board having not only low water-absorbing property but also excellent heat resistance after moisture absorption, flame retardancy, and solvent solubility. It is another object of the present invention to provide a prepreg and a monolayer or laminate which use the resin composition, and a metal foil clad laminate and a printed wired board which use the prepreg. A resin composition of the present invention contains one or two or more cyanate ester compounds (A) represented by the following formula (1) and an epoxy resin (B):
wherein R 1 , R 2 , R 3 , and R 4 represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and may be the same or different from each other; and n represents an integer of 1 to 50.
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