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    RESIN COMPOSITION FOR SEALING ELECTRICAL ELECTRONIC COMPONENTS, METHOD OF PRODUCING ELECTRICAL ELECTRONIC COMPONENT, AND SEALED ELECTRICAL ELECTRONIC COMPONENT
    6.
    发明公开
    RESIN COMPOSITION FOR SEALING ELECTRICAL ELECTRONIC COMPONENTS, METHOD OF PRODUCING ELECTRICAL ELECTRONIC COMPONENT, AND SEALED ELECTRICAL ELECTRONIC COMPONENT 审中-公开
    树脂组合物密封电力电子组件，用于生产电力电子组件的方法和密封式电子元件

    公开(公告)号：EP2679651A1

    公开(公告)日：2014-01-01

    申请号：EP12749238.7

    申请日：2012-02-21

    申请人： Toyobo Co., Ltd.

    发明人： FUNAOKA, Daiki ,  SHIGA, Kenji

    IPC分类号： C09K3/10 ,  C08L23/00 ,  C08L61/06 ,  C08L61/18 ,  C08L67/00 ,  H01L23/29 ,  H01L23/31

    CPC分类号： C08L67/03 ,  C08L23/02 ,  C08L23/06 ,  C08L23/08 ,  C08L23/0815 ,  C08L65/04 ,  C08L67/00 ,  C08L71/08 ,  C09K3/10 ,  C09K2200/0617 ,  C09K2200/0655 ,  C09K2200/0672 ,  H01L23/293 ,  H01L2924/0002 ,  C08L61/18 ,  C08L61/06 ,  H01L2924/00

    摘要： It is provided that a resin composition for sealing electrical electronic components which is not susceptible to gelation even when stagnant under high temperature conditions, and which are excellent in initial bond strength to an aluminum material, and which exhibits superior durability under a cooling and heating cycle load and the like. It is also provided that a sealed electrical electronic component with the resin composition for sealing electrical electronic components. A resin composition for sealing electrical electronic components, containing a crystalline polyester-based elastomer (A), a phenol-modified xylene resin (B1) and/or a phenol resin (B2), and a polyolefin resin (C), and having a melt viscosity of 5 dPa·s or more and 3000 dPa·s or less when dried to a water content of 0.1% or less, heated to 220°C, subjected to a pressure of 1 MPa, and extruded through a die with a hole diameter of 1.0 mm and a thickness of 10 mm.

    摘要翻译： 它提供确实的树脂组合物，用于密封电气电子组件的所有这是不容易受到甚至凝胶化。当在高温条件下停滞，以及哪些是在铝材料具有优异的初始粘结强度，并且其下一个冷却和加热周期表现出优良的耐久性 负载等。 因此，它提供了做了与用于密封电气电子部件用树脂组合物密封的电气电子部件。 用于密封电气电子元件中，含有聚酯系结晶弹性体（A），苯酚改性二甲苯树脂（B1）和/或酚醛树脂（B2），和聚烯烃系树脂（C），以及具有一种树脂组合物 5 Pa·s以上和3000分帕·秒或孔的熔体粘度小于当干燥至0.1％或更低的水含量，加热至220℃，进行1兆帕的压力和挤出通过所述用 为1.0mm的直径和厚度为10mm。

    NOVEL THIO COMPOUNDS AND PREPARING METHOD OF THE SAME
    10.
    发明公开
    NOVEL THIO COMPOUNDS AND PREPARING METHOD OF THE SAME 有权
    新型含硫及其制备方法

    公开(公告)号：EP2475701A1

    公开(公告)日：2012-07-18

    申请号：EP10815576.3

    申请日：2010-08-31

    申请人： Korea Kumho Petrochemical Co., Ltd.

    发明人： LEE, Hyung Jae ,  SHIN, Chang Kyo ,  KIM, Jin Eok

    IPC分类号： C08G59/08

    CPC分类号： C08K5/375 ,  C07C323/16 ,  C07C2603/68 ,  C08G8/30 ,  C08L61/18 ,  C08L21/00

    摘要： Provided are novel thio compounds and a method for preparing the same. More particularly, there is provided a novel thio compound prepared by reacting an alkylation product of
    p -cresol and dicyclopentadiene with mercaptan and paraformaldehyde. Unlike existing antioxidants such as 2,6-di-
    t -butyl-4-methylphenol (BHT) being harmful to the human body due to the high volatility, the novel thio compounds of the present invention, which have the low volatility because of their high molecular weight, give no harm to the human body. Further, with excellent performances, they are suitable to replace the existing antioxidants.