Patent search ap:("NEC CORP") AND inv:"SATO JUNYA" Page 1

1.

发明公开
CIRCUIT BOARD DEVICE, METHOD FOR CONNECTING WIRING BOARDS, AND CIRCUIT SUBSTRATE MODULE DEVICE 有权
Title translation: 电路板装置，方法连接基板和电路基板模块装置

公开(公告)号：EP2034806A4

公开(公告)日：2011-03-30

申请号：EP07743266

申请日：2007-05-14

Applicant: NEC CORP

Inventor： SATO JUNYA , TAURA TORU , MIKAMI NOBUHIRO , WATANABE SHINJI , SAWADA ATSUMASA , NISHIMURA NOZOMU

IPC: H05K1/14 , H05K3/36 , H05K9/00

CPC classification number: H05K1/144 , H01R12/52 , H05K1/0218 , H05K3/325 , H05K2201/10378 , H05K2201/2018 , Y10T29/49126

2.

发明公开
SEMICONDUCTOR PACKAGE, ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE 有权
Title translation: 半导体封装，工艺制作，半导体器件和电子设备

公开(公告)号：EP2037497A4

公开(公告)日：2012-03-28

申请号：EP07744204

申请日：2007-05-28

Applicant: NEC CORP

Inventor： MIKAMI NOBUHIRO , WATANABE SHINJI , SATO JUNYA , SAWADA ATSUMASA

IPC: H01L23/12 , H01L23/538 , H01L25/10 , H01L25/11 , H01L25/18

CPC classification number: H01L23/4985 , H01L23/3107 , H01L23/5387 , H01L25/105 , H01L2224/16225 , H01L2224/32225 , H01L2224/73253 , H01L2225/1058

3.

发明公开
ELECTRONIC APPARATUS DISPLAY UNIT AND PORTABLE TERMINAL APPARATUS COMPRISING DISPLAY UNIT 审中-公开
Title translation: 显示单元，用于一种电子装置和移动终端与显示单元

公开(公告)号：EP2860577A4

公开(公告)日：2015-12-30

申请号：EP13800870

申请日：2013-06-03

Applicant: NEC CORP

Inventor： SATO JUNYA

IPC: G02F1/1333 , G02F1/133 , G02F1/1345 , G06F1/16 , G09F9/00

CPC classification number: G02F1/1333 , G02F1/13306 , G02F1/13338 , G02F1/13452 , G02F2202/28 , G06F1/1637

4.

发明公开
SEMICONDUCTOR PACKAGE, ELECTRONIC PARTS, AND ELECTRONIC DEVICE 审中-公开
Title translation: 半导体封装，电子部件和电子设备

公开(公告)号：EP1953819A4

公开(公告)日：2010-09-29

申请号：EP06832536

申请日：2006-11-13

Applicant: NEC CORP

Inventor： MIKAMI NOBUHIRO , WATANABE SHINJI , SATO JUNYA , SAWADA ATSUMASA

IPC: H01L23/498 , H01L23/12

CPC classification number: H01L23/4985 , H01L23/49816 , H01L24/50 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/3511

5.

发明公开
CIRCUIT BOARD DEVICE AND METHOD FOR BOARD-TO-BOARD CONNECTION 审中-公开
Title translation: 电路板装置和方法用于电路板之间的连接

公开(公告)号：EP1536672A4

公开(公告)日：2008-11-12

申请号：EP03760945

申请日：2003-06-24

Applicant: NEC CORP

Inventor： HASHIMOTO YOSHIYUKI , SATO JUNYA

IPC: H05K1/14 , H05K3/30 , H05K3/32 , H05K3/36 , H05K3/46

CPC classification number: H05K3/368 , H05K3/305 , H05K3/325 , H05K2201/0314 , H05K2201/09481 , H05K2201/10393 , Y10T29/49126

Abstract: A board connection structure that enables removal of a board while thinning an electronic apparatus in which circuit boards are mounted and by saving space. This structure comprises a first board (1) with a matrix arrangement of electrode terminals (10) on the surface layer, a second board (2) with a matrix arrangement of electrode terminals (20), opposed to the electrode terminals (10), on the surface layer, and an anisotropic conductive member (3) arranged between the first and second boards (1, 2) in the position facing the electrode terminals (10, 20). The first and second boards (1, 2) and the anisotropic conductive layer (3) are pressed with a pressing component (4) to electrically connect the electrode terminals (10, 20) via the anisotropic conductive member (3).

Patent Agency Ranking