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    LED MODULE AND DISPLAY
    1.
    发明公开
    LED MODULE AND DISPLAY 审中-公开
    LED模块和显示器

    公开(公告)号：EP3193081A1

    公开(公告)日：2017-07-19

    申请号：EP14901725.3

    申请日：2014-12-13

    Applicant: SHENZHEN TCL NEW TECHNOLOGY CO., LTD

    Inventor： LIN, Jie ,  QIANG, Kewen ,  ZHONG, Xiehe

    IPC: F21V29/70 ,  F21V29/80 ,  F21V23/00

    CPC classification number: F21V29/70 ,  F21V19/0025 ,  F21V23/00 ,  F21V29/80 ,  F21Y2115/10 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0085 ,  H05K1/0203 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10393 ,  H05K2201/10598 ,  H05K2201/10878

    Abstract: The present disclosure provides a LED module. The LED module includes a LED lamp, a heat radiator, and a PCB. The LED lamp includes a LED main body, and a heat conducting block and a pin configured on the main body. The heat conducting block is mounted on the bottom surface of the LED main body towards the PCB. The pin has a free end passing through the PCB, and electrically connecting a bonding pad of the PCB. The heat radiator is clamped between the heat conducting block and the PCB, and the heat conducting block resists against the heat radiator. A display device is also provided. The LED module has the heat radiator clamped between the heat conducting block of the LED lamp and the PCB, the heat conducting block is directly assembled on the heat radiator, the heat introduced by the LED lamp can directly dissipate from the heat conducting block to the heat radiator, thus enhancing the heat dissipation of the LED lamp.

    Abstract translation: 本公开提供了一种LED模块。 LED模块包括LED灯，散热器和PCB。 LED灯包括LED主体，导热块和设置在主体上的销。 导热块安装在LED主体的朝向PCB的底面上。 该引脚具有穿过PCB的自由端，并且电连接PCB的键合焊盘。 散热器夹在导热块与PCB之间，导热块抵抗散热器。 还提供显示装置。 LED模块将散热器夹在LED灯的导热块与PCB之间，导热块直接组装在散热器上，LED灯引入的热量可直接从导热块散发到 散热器，从而增强了LED灯的散热。

    LED socket assembly
    4.
    发明公开
    LED socket assembly 有权
    LED插座组件

    公开(公告)号：EP2623854A3

    公开(公告)日：2015-01-21

    申请号：EP13153448.9

    申请日：2013-01-31

    Applicant: Tyco Electronics Corporation

    Inventor： Daily, Christopher George ,  Mostoller, Matthew Edward ,  Weber, Ronald Martin

    IPC: F21V19/00 ,  F21Y101/02

    CPC classification number: F21V19/004 ,  F21V19/0055 ,  F21Y2115/10 ,  H05K3/0061 ,  H05K2201/10393

    Abstract: A socket assembly (14) includes a light emitting diode (LED) package (16) having an LED printed circuit board (PCB) (22) with an LED (24) mounted thereto. The socket assembly (14) also includes a clamp (18) for holding the LED package (16) to a support structure (12). The clamp (18) includes a base (34) that is configured to be mounted to the support structure (12) such that the base (34) engages the support structure (12). The clamp (18) also includes a spring finger (36) that extends from the base (34) such that the base (34) and the spring finger (36) define a unitary body (32) of the clamp (18). The spring finger (36) is configured to engage the LED PCB (22) of the LED package (16) and apply a clamping force to the LED PCB (22) that acts in a direction toward the support structure (12).

    Abstract translation: 插座组件（14）包括具有安装有LED（24）的LED印刷电路板（PCB）（22）的发光二极管（LED）封装（16）。 插座组件（14）还包括用于将LED封装（16）保持到支撑结构（12）的夹具（18）。 夹具（18）包括构造成安装到支撑结构（12）使得基座（34）接合支撑结构（12）的基座（34）。 夹具（18）还包括从基座（34）延伸的弹簧指（36），使得基座（34）和弹簧指（36）限定夹具（18）的整体主体（32）。 弹簧指状件（36）构造成接合LED封装（16）的LED PCB（22），并向朝着支撑结构（12）的方向起作用的LED PCB（22）施加夹紧力。

    ELECTRONIC DEVICE
    6.
    发明公开
    ELECTRONIC DEVICE 审中-公开
    电子设备

    公开(公告)号：EP2690936A1

    公开(公告)日：2014-01-29

    申请号：EP12866411.7

    申请日：2012-05-30

    Applicant: Sanyo Electric Co., Ltd.

    Inventor： SAITO, Takao ,  OSHIMA, Makoto ,  OHASHI, Masaaki

    IPC: H05K1/18

    CPC classification number: H01R12/58 ,  H05K3/303 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/4015 ,  H05K2201/09063 ,  H05K2201/09854 ,  H05K2201/10295 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10863 ,  H05K2201/10871 ,  H05K2203/0455

    Abstract: The electronic device of the present invention is an electronic device configured by soldering a terminal member to a printed circuit board, the terminal member comprising a top surface into which a screw is threaded and a side surface at the end connected to the top surface, the side surface having convex parts fitted into through-holes in the printed circuit board; wherein the terminal member has at least two convex parts in the end edge on the printed circuit board side of the side surface, an electro conductive pattern is provided on the printed circuit board facing the end edge between the convex parts, solder is filled into a gap between the end edge and the electro conductive pattern, when the two convex parts are inserted into the through-holes provided to the electro conductive pattern, and electrical continuity is established between the end edge and the electro conductive pattern.

    Abstract translation: 本发明的电子设备是通过将端子构件焊接到印刷电路板而构成的电子设备，该端子构件包括螺钉被拧入的顶面和连接到顶面的端部的侧面， 具有装配在印刷电路板上的通孔中的凸起部分的侧表面; 其中，所述端子构件在所述侧面的所述印刷电路板侧的所述端缘中具有至少两个凸起部分，在所述印刷电路板上面向所述凸起部分之间的端缘设置有导电图案，焊料填充到 当两个凸部插入到设置于导电图案的通孔中时，端部边缘与导电图案之间的间隙，并且在端部边缘与导电图案之间建立电连续性。

    A SHOCK DAMPING AND THERMAL ISOLATION SYSTEM FOR A SURFACE MOUNTED VIBRATION SENSITIVE DEVICE
    8.
    发明公开
    A SHOCK DAMPING AND THERMAL ISOLATION SYSTEM FOR A SURFACE MOUNTED VIBRATION SENSITIVE DEVICE 审中-公开
    吸震及保温系统表面安装振动非常敏感器件

    公开(公告)号：EP2499889A1

    公开(公告)日：2012-09-19

    申请号：EP10829400.0

    申请日：2010-11-12

    Applicant: Novatel, Inc.

    Inventor： BECZE, Karoly ,  LANNEVILLE, Pee-Jay

    IPC: H05K7/12 ,  F16F1/371 ,  H05K1/18 ,  H05K13/04

    CPC classification number: H05K3/325 ,  H05K2201/0314 ,  H05K2201/10075 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/2045 ,  Y10T29/4913

    Abstract: The inventive shock damping system for vibration sensitive surface mounted devices consists of an elastomeric material having conductive fiber material disposed between a printed circuit board (PCB) and a surface mounted device. Once disposed between PCB and surface mounted device, the elastomeric material, the PCB and the surface mounted device are compressed together with a component restraining system, to provide a secure electrical connection between one or more interconnect pads conductively attached to surface mounted device and the PCB. The elastomeric material allows signals and current to flow between surface mounted device and PCB without the use of any attached wires or leads while at the same time providing a system for damping any shocks or vibrations that may be transferred to surface mounted device through the PCB or through the protective component restraining system that encloses the device and the elastomeric material.

    A protection circuit module for a secondary battery
    10.
    发明公开
    A protection circuit module for a secondary battery 有权
    SchutzschaltungsmodulfüreineSekundärbatterie

    公开(公告)号：EP2328210A1

    公开(公告)日：2011-06-01

    申请号：EP10166101.5

    申请日：2010-06-16

    Applicant: Samsung SDI Co., Ltd.

    Inventor： Jang, Young-Cheol

    IPC: H01M2/34 ,  H01M6/50 ,  H01M10/42 ,  H05K3/30

    CPC classification number: H01M10/42 ,  H01M2/34 ,  H01M10/425 ,  H01M2200/00 ,  H05K3/32 ,  H05K2201/10037 ,  H05K2201/10393 ,  H05K2201/10962

    Abstract: A protection circuit module (50) for a secondary battery pack (100) provided with electrode tabs (134,135) is disclosed. It comprises a substrate (10) and a tab connecting member (20) mounted on the substrate. The tab connecting member includes spaced first and second layers (21,22) to receive the tab of a battery pack therebetween to connect the bare cell to the protection circuit module.

    Abstract translation: 公开了一种用于具有电极接头（134,135）的二次电池组（100）的保护电路模块（50）。 它包括衬底（10）和安装在衬底上的突片连接构件（20）。 突片连接构件包括间隔开的第一和第二层（21,22），以在其间接收电池组的突片，以将裸电池连接到保护电路模块。

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