专利检索 ap:("NISSAN MOTOR" OR "SANKEN ELECTRIC CO LTD" OR "FUJI ELECTRIC CO LTD") AND inv:"TANISAWA HIDEKAZU" 第 1 页

1.

发明公开
Au BASED SOLDER DIE ATTACHMENT SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME 审中-公开
标题翻译： AU-BASEDLÖTCHIPBEFESTIGUNGS半导体部件和方法及其生产

公开(公告)号：EP2922087A4

公开(公告)日：2016-03-23

申请号：EP13855530

申请日：2013-11-13

申请人： NISSAN MOTOR , SANKEN ELECTRIC CO LTD , FUJI ELECTRIC CO LTD

发明人： TANIMOTO SATOSHI , SATO SHINJI , TANISAWA HIDEKAZU , MATSUI KOHEI

IPC分类号： H01L23/373 , H01L21/60 , H01L23/488 , H01L23/495

CPC分类号： H01L23/49513 , H01L21/4853 , H01L23/3735 , H01L23/4827 , H01L23/488 , H01L23/492 , H01L23/49548 , H01L23/49562 , H01L23/49582 , H01L24/03 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L2224/0345 , H01L2224/04026 , H01L2224/05082 , H01L2224/05155 , H01L2224/05166 , H01L2224/05639 , H01L2224/2732 , H01L2224/291 , H01L2224/29144 , H01L2224/32059 , H01L2224/3207 , H01L2224/32225 , H01L2224/32245 , H01L2224/32505 , H01L2224/7501 , H01L2224/75102 , H01L2224/75251 , H01L2224/75756 , H01L2224/83011 , H01L2224/83022 , H01L2224/83048 , H01L2224/83075 , H01L2224/8309 , H01L2224/83101 , H01L2224/8321 , H01L2224/83385 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/83457 , H01L2224/83815 , H01L2924/01322 , H01L2924/12042 , H01L2924/15747 , H01L2924/15787 , H01L2924/35121 , H01L2924/3651 , H01L2924/01032 , H01L2924/01014 , H01L2924/0105 , H01L2924/014 , H01L2924/00014 , H01L2924/01027 , H01L2924/01015 , H01L2924/00012 , H01L2924/00