公开(公告)号：EP2945189A1

公开(公告)日：2015-11-18

申请号：EP13870456.4

申请日：2013-01-09

申请人： Hitachi, Ltd.

发明人： TANIE, Hisashi ,  IKEDA, Osamu

IPC分类号： H01L21/52 ,  H01L21/60

CPC分类号： H01L24/09 ,  H01L21/563 ,  H01L21/78 ,  H01L23/5382 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/033 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/0383 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/0901 ,  H01L2224/0905 ,  H01L2224/091 ,  H01L2224/095 ,  H01L2224/1145 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1411 ,  H01L2224/14181 ,  H01L2224/17107 ,  H01L2224/2745 ,  H01L2224/29078 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/30181 ,  H01L2224/32245 ,  H01L2224/32501 ,  H01L2224/33181 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/75301 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/83121 ,  H01L2224/83203 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2224/94 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/00

摘要： In order to achieve both a reduction in thermal resistance and an improvement in thermal deformation absorbing property of a semiconductor device having a packaging structure in which a semiconductor chip 1 is electrically connected to conductive members 3a and 3b via bonding members 2a and 2b, the bonding members 2a and 2b each includes a stacked structure provided with, in the order from the side close to the semiconductor chip 1, a nanospring layer 4 configured from a plurality of springs having a nano-order size, a planar layer 5 supporting the plurality of springs, and a bonding layer 6. The thickness of the nanospring layer 4 is larger than the thickness of the bonding layer 6, and the thickness of the bonding layer 6 is larger than the thickness of the planar layer 5.

摘要翻译： 为了同时实现具有半导体芯片1经由接合构件2a和2b与导电构件3a和3b电连接的封装结构的半导体器件的热阻降低和热变形吸收性能的提高， 构件2a和2b各自包括从靠近半导体芯片1的一侧开始依次设置由多个具有纳米级尺寸的弹簧构成的纳米弹簧层4的层叠结构，支撑多个 弹簧和粘合层6.纳米弹簧层4的厚度大于粘合层6的厚度，并且粘合层6的厚度大于平面层5的厚度。

公开(公告)号：EP2922087A1

公开(公告)日：2015-09-23

申请号：EP13855530.5

申请日：2013-11-13

申请人： Nissan Motor Co., Ltd ,  Sanken Electric Co., Ltd. ,  Fuji Electric Co., Ltd.

发明人： TANIMOTO, Satoshi ,  SATO, Shinji ,  TANISAWA, Hidekazu ,  MATSUI, Kohei

IPC分类号： H01L21/52

CPC分类号： H01L23/49513 ,  H01L21/4853 ,  H01L23/3735 ,  H01L23/4827 ,  H01L23/488 ,  H01L23/492 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/0345 ,  H01L2224/04026 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05639 ,  H01L2224/2732 ,  H01L2224/291 ,  H01L2224/29144 ,  H01L2224/32059 ,  H01L2224/3207 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32505 ,  H01L2224/7501 ,  H01L2224/75102 ,  H01L2224/75251 ,  H01L2224/75756 ,  H01L2224/83011 ,  H01L2224/83022 ,  H01L2224/83048 ,  H01L2224/83075 ,  H01L2224/8309 ,  H01L2224/83101 ,  H01L2224/8321 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83457 ,  H01L2224/83815 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/35121 ,  H01L2924/3651 ,  H01L2924/01032 ,  H01L2924/01014 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01015 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device according to the present invention, having an Au-based solder layer (3) sandwiched between a semiconductor element (1) and a Cu substrate (2) made mainly of Cu, in which the semiconductor device includes: a dense metal film (23) which is arranged between the Cu substrate (2) and the Au-based solder layer (3), and has fine slits (24) patterned to have a predetermined shape in a plan view; and fine structures (4) with dumbbell-like cross section, which have Cu and Au as main elements, and are each buried in the Cu substrate (2), the Au-based solder layer (3), and the fine slits (24) of the dense metal film (23).

摘要翻译： 根据本发明的半导体器件，其具有夹在半导体元件（1）和主要由Cu制成的Cu衬底（2）之间的Au系焊料层（3），其中半导体器件包括致密的金属膜 （23），其布置在所述Cu基板（2）和所述Au基焊料层（3）之间，并且具有图案化以在平面图中具有预定形状的细缝隙（24） 和具有哑铃状横截面的精细结构（4），其具有Cu和Au作为主要元素，并且各自埋入Cu基底（2），Au基焊料层（3）和细缝隙（24） ）的致密金属膜（23）。

公开(公告)号：EP2506295A3

公开(公告)日：2015-07-01

申请号：EP11250676.1

申请日：2011-07-27

申请人： Apic Yamada Corporation

发明人： Kobayashi, Kazuhiko, Apic Yamada Corporation

IPC分类号： H01L21/67 ,  H01L21/60

CPC分类号： H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75102 ,  H01L2224/75252 ,  H01L2224/753 ,  H01L2224/75313 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/7532 ,  H01L2224/755 ,  H01L2224/75502 ,  H01L2224/75704 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/75804 ,  H01L2224/7598 ,  H01L2224/75984 ,  H01L2224/81048 ,  H01L2224/8109 ,  H01L2224/81093 ,  H01L2224/83048 ,  H01L2224/8309 ,  H01L2224/83093 ,  H01L2224/83855 ,  H01L2224/9211 ,  H01L2224/95093 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/00

摘要： The bonding apparatus comprises: a substrate supporting section (5) for supporting a substrate (1), on which semiconductor devices (3) have been adhered, in a state where the substrate (1) is separated from a clamping face (6a, 17a) of a second die (6, 17); and a heating/pressing section (10, 28) for heating and pressing the substrate (1) supported by the substrate supporting section (5) onto a clamping face (10a, 28b) of a first die (8, 24). The heating/pressing section (10, 28) moves the substrate (1) toward the clamping face (10a, 28b) of the first die (8, 24) so as to preheat the substrate (1) and the semiconductor devices (3). The semiconductor devices (3) are pressed onto the clamping face (10a, 28b) so as to cure the non-conductive adhesive (2) and bond the bumps (3a) of the semiconductor devices (3) to terminal sections (1a) of the substrate (1).

摘要翻译： 接合装置包括：基板支撑部（5），用于在基板（1）与夹紧面（6a，17a）分离的状态下支撑已经粘附有半导体器件（3）的基板（1） ）第二模具（6,17）; 以及用于将由基板支撑部分（5）支撑的基板（1）加热并按压到第一模具（8,24）的夹紧面（10a，28b）上的加热/加压部分（10,28）。 加热/加压部分（10,28）将基板（1）朝向第一模具（8,24）的夹紧面（10a，28b）移动，以便预热基板（1）和半导体器件（3） 。 半导体器件（3）被压到夹持面（10a，28b）上，以固化非导电粘合剂（2）并将半导体器件（3）的凸块（3a）接合到半导体器件（3）的端子部分 基板（1）。

公开(公告)号：EP2945189A4

公开(公告)日：2016-11-16

申请号：EP13870456

申请日：2013-01-09

申请人： HITACHI LTD

发明人： TANIE HISASHI ,  IKEDA OSAMU

IPC分类号： H01L23/488 ,  H01L21/60 ,  H01L23/367

CPC分类号： H01L24/09 ,  H01L21/563 ,  H01L21/78 ,  H01L23/5382 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/033 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/0383 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/0901 ,  H01L2224/0905 ,  H01L2224/091 ,  H01L2224/095 ,  H01L2224/1145 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1411 ,  H01L2224/14181 ,  H01L2224/17107 ,  H01L2224/2745 ,  H01L2224/29078 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/30181 ,  H01L2224/32245 ,  H01L2224/32501 ,  H01L2224/33181 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/75301 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/83121 ,  H01L2224/83203 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2224/94 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/00

公开(公告)号：EP2843692A1

公开(公告)日：2015-03-04

申请号：EP13782144.3

申请日：2013-04-24

申请人： Nissan Motor Co., Ltd

发明人： TANIMOTO, Satoshi ,  ZUSHI, Yusuke ,  MURAKAMI, Yoshinori ,  MATSUI, Kohei ,  SATO, Shinji ,  FUKUSHIMA, Yu

IPC分类号： H01L21/52 ,  H05K13/04

CPC分类号： H01L24/83 ,  B23K37/0426 ,  H01L24/05 ,  H01L24/29 ,  H01L24/75 ,  H01L24/97 ,  H01L2224/04026 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05639 ,  H01L2224/2732 ,  H01L2224/291 ,  H01L2224/29118 ,  H01L2224/29144 ,  H01L2224/75101 ,  H01L2224/75305 ,  H01L2224/7531 ,  H01L2224/75314 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/7532 ,  H01L2224/75756 ,  H01L2224/7598 ,  H01L2224/75981 ,  H01L2224/83022 ,  H01L2224/83048 ,  H01L2224/83075 ,  H01L2224/83101 ,  H01L2224/832 ,  H01L2224/83211 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10254 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1037 ,  H01L2924/1067 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/3656 ,  H05K3/34 ,  H05K3/3431 ,  H05K13/0465 ,  H05K2203/0195 ,  H05K2203/0278 ,  H01L2924/00 ,  H01L2924/0542 ,  H01L2924/0103 ,  H01L2924/00014 ,  H01L2924/01042 ,  H01L2924/01032 ,  H01L2924/01014 ,  H01L2924/01013 ,  H01L2224/05655 ,  H01L2224/83 ,  H01L2924/00012

摘要： In a heat insulating load jig 11 of the present invention, a solder material 14 having a melting point or a solidus temperature in a range between a thermal resistance temperature of a semiconductor chip 13 and a temperature 100°C below the thermal resistance temperature is interposed between a circuit board 12 and the semiconductor chip 13; a heat insulating body 17 is placed on an upper side of the semiconductor chip 13 in this state; a metal weight 16 is disposed on the heat insulating body 17; and load is applied to the semiconductor chip 13 while the solder material 14 is melted and solidified.

摘要翻译： 在本发明中，具有在半导体芯片13的热电阻温度和温度100℃以下的热电阻温度之间的范围内的熔点或固相线温度的焊料材料14的热绝缘负荷夹具11夹 一电路板12和半导体芯片13之间; 隔热体17在这种状态下，半导体芯片13的上侧被置于; 金属重物16设置在绝热体17; 并且在焊接材料14被熔融固化负载被施加到半导体芯片13。

公开(公告)号：EP1983564A4

公开(公告)日：2012-07-04

申请号：EP07713933

申请日：2007-02-08

申请人： SONY CHEM & INF DEVICE CORP

发明人： MATSUMURA TAKASHI

IPC分类号： B30B15/02 ,  B30B5/02 ,  B30B15/06 ,  H01L21/603 ,  H05K3/30

CPC分类号： H05K3/303 ,  B30B5/02 ,  B30B15/024 ,  B30B15/065 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32157 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/753 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/75756 ,  H01L2224/7598 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/8323 ,  H01L2224/83855 ,  H01L2224/83868 ,  H01L2224/8388 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K2201/0133 ,  H05K2203/0191 ,  H05K2203/0278 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T156/1089 ,  H01L2924/0635 ,  H01L2924/069 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/0401

摘要： A compression bonding device capable of packaging electric components on both sides of a substrate is provided. A compression bonding device 1 includes first and second pressing rubbers 15, 25. Electric components 32, 33 can be simultaneously packaged on the front face and the rear face of a substrate 31 by sandwiching the substrate 31 between the first and second pressing rubbers 15, 25. The electric components 32, 33 are not subjected to a force for horizontally moving them because the first and second pressing rubbers 15, 25 are prevented from horizontal extension by a first dam member 16. Thus, the electric components 32, 33 are connected to the substrate 31 without misalignment, thereby obtaining a highly reliable electric device 30a.

公开(公告)号：EP1511075B1

公开(公告)日：2018-10-10

申请号：EP04020299.6

申请日：2004-08-26

申请人： DOWA METALTECH CO., LTD.

发明人： Osanai, Hideyo

IPC分类号： H01L25/07 ,  H01L21/48 ,  H01L23/373 ,  H01L21/60

CPC分类号： H01L23/3735 ,  H01L21/4871 ,  H01L24/45 ,  H01L24/48 ,  H01L24/75 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/08225 ,  H01L2224/32238 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/7598 ,  H01L2224/83104 ,  H01L2224/83801 ,  H01L2224/83886 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10272 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K1/053 ,  H05K3/101 ,  H05K2203/128 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/83205

摘要： In a method for producing an electronic part mounting substrate wherein a heat sinking metal base plate 12 is bonded to one side of a ceramic substrate 10, and one side of a circuit forming metal plate 14 is bonded to the other side thereof, an electronic part 16 being mounted on the other side of the circuit forming metal plate 14, the ceramic substrate 10 and the electronic part 16 are arranged in a mold so that the ceramic substrate 10 is spaced from the electronic part 16, and then, a molten metal is injected into the mold so that the molten metal contacts both sides of the ceramic substrate 10 and the electronic part 16. Then, the mold is cooled to solidify the molten metal, to form a heat sinking metal base plate on one side of the ceramic substrate 10 so that the heat sinking metal base plate is bonded directly to the one side of the ceramic substrate 10, and to form a circuit forming metal plate on the other side of the ceramic substrate 10 so that one side of the circuit forming metal plate is bonded directly to the other side of the ceramic substrate 10. When the circuit forming metal plate is formed, the electronic part is bonded directly to the other side of the circuit forming metal plate.

公开(公告)号：EP2239131A1

公开(公告)日：2010-10-13

申请号：EP10168917.2

申请日：2007-02-08

申请人： Sony Chemical & Information Device Corporation

发明人： Matsumura, Takashi

IPC分类号： B30B5/02 ,  B30B15/06 ,  H01L21/60 ,  H05K3/32

CPC分类号： H05K3/303 ,  B30B5/02 ,  B30B15/024 ,  B30B15/065 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32157 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/753 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/75756 ,  H01L2224/7598 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/8323 ,  H01L2224/83855 ,  H01L2224/83868 ,  H01L2224/8388 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K2201/0133 ,  H05K2203/0191 ,  H05K2203/0278 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T156/1089 ,  H01L2924/0635 ,  H01L2924/069 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/0401

摘要： A compression bonding device capable of packaging electric components on both sides of a substrate is provided. A compression bonding device includes pressing rubbers (85,95). Electric components can be simultaneously packaged on the front face and the rear face of a substrate by sandwiching the substrate between the pressing rubbers (85,95). The electric components are not subjected to a force for horizontally moving them because the pressing rubbers (85,95) are prevented from horizontal extension by a dam member (86). Thus, the electric components are connected to the substrate without misalignment, thereby obtaining a highly reliable electric device.

摘要翻译： 提供一种能够在基板的两侧封装电气部件的压接装置。 压接装置包括按压橡胶（85,95）。 通过将基板夹在压制橡胶（85,95）之间，电子部件可以同时包装在基板的正面和背面上。 电动部件不会受到水平移动的作用力，因为阻止构件（86）阻止按压橡胶（85,95）的水平延伸。 因此，电气部件与基板连接而没有对准，从而获得高度可靠的电气装置。

公开(公告)号：EP1511075A2

公开(公告)日：2005-03-02

申请号：EP04020299.6

申请日：2004-08-26

申请人： Dowa Mining Co., Ltd.

发明人： Osanai, Hideyo

IPC分类号： H01L21/48

CPC分类号： H01L23/3735 ,  H01L21/4871 ,  H01L24/45 ,  H01L24/48 ,  H01L24/75 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/08225 ,  H01L2224/32238 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/7598 ,  H01L2224/83104 ,  H01L2224/83801 ,  H01L2224/83886 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10272 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K1/053 ,  H05K3/101 ,  H05K2203/128 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/83205

摘要： In a method for producing an electronic part mounting substrate wherein a heat sinking metal base plate 12 is bonded to one side of a ceramic substrate 10, and one side of a circuit forming metal plate 14 is bonded to the other side thereof, an electronic part 16 being mounted on the other side of the circuit forming metal plate 14, the ceramic substrate 10 and the electronic part 16 are arranged in a mold so that the ceramic substrate 10 is spaced from the electronic part 16, and then, a molten metal is injected into the mold so that the molten metal contacts both sides of the ceramic substrate 10 and the electronic part 16. Then, the mold is cooled to solidify the molten metal, to form a heat sinking metal base plate on one side of the ceramic substrate 10 so that the heat sinking metal base plate is bonded directly to the one side of the ceramic substrate 10, and to form a circuit forming metal plate on the other side of the ceramic substrate 10 so that one side of the circuit forming metal plate is bonded directly to the other side of the ceramic substrate 10. When the circuit forming metal plate is formed, the electronic part is bonded directly to the other side of the circuit forming metal plate.

摘要翻译： 在制造电子部件安装基板的方法中，散热金属基板12接合在陶瓷基板10的一侧，电路形成用金属板14的一侧与其另一侧接合，电子部件 16安装在电路形成金属板14的另一侧上，陶瓷基板10和电子部件16布置在模具中，使得陶瓷基板10与电子部件16间隔开，然后熔融金属 注入到模具中，使得熔融金属接触陶瓷基板10和电子部件16的两侧。然后，将模具冷却以固化熔融金属，以在陶瓷基板的一侧上形成散热金属基板 10，使得散热金属基板直接接合到陶瓷基板10的一侧，并且在陶瓷基板10的另一侧上形成电路形成金属板，使得电路的一侧 金属板直接接合到陶瓷基板10的另一侧。当形成电路形成金属板时，电子部件直接接合到电路形成金属板的另一侧。

公开(公告)号：EP0252115A1

公开(公告)日：1988-01-13

申请号：EP87900397.0

申请日：1986-11-24

申请人： Hughes Aircraft Company

发明人： PATRAW, Nils, E.

IPC分类号： H01L23 ,  H01L21 ,  H05K3

CPC分类号： H01L24/81 ,  H01L21/4846 ,  H01L24/72 ,  H01L24/75 ,  H01L2224/45124 ,  H01L2224/75 ,  H01L2224/753 ,  H01L2224/75756 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K3/325 ,  H05K3/4007 ,  H05K3/4092 ,  H01L2924/00 ,  H01L2224/48

摘要： L'appareil ci-décrit permet de réaliser des interconnexions microélectroniques intra-puces et puce-puce dans une configuration de circuit intégré ultra-dense. Des socles de compression (20) sont utilisés pour former des interconnexions mécaniques et électriques sous l'action d'un ressort avec des bornes conductrices sur un assemblage (28) de puces et d'interfaces de puces mésa afin d'obtenir un vaste réseau multipuces (23) sur un substrat d'interconnexions (24). Des procédés sont également décrits pour fabriquer les socles de compression (20).

摘要翻译： 这里描述的设备使得可以以超密集成电路配置来执行微电子卡内和芯片 - 芯片互连。 压缩基座（20）用于在芯片和台面芯片接口的组件（28）上与导电端子形成弹簧加载的机械和电气互连，以提供大型网络。 在互连衬底（24）上的多芯片（23）。 还公开了制造压缩基座（20）的方法。