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    Metal foil laminated plate and method of manufacturing the same
    1.
    发明公开
    Metal foil laminated plate and method of manufacturing the same 审中-公开
    Laminierte Platte mit Metallfolie und Verfahren zu deren Herstellung

    公开(公告)号：EP1261244A2

    公开(公告)日：2002-11-27

    申请号：EP02010950.0

    申请日：2002-05-16

    申请人： Nitto Denko Corporation

    发明人： Ikeda, Kenichi, c/o Nitto Denko Corporation ,  Kawashima, Toshiyuki, c/o Nitto Denko Corporation ,  Tahara, Nobuharu, c/o Nitto Denko Corporation

    IPC分类号： H05K3/46

    CPC分类号： H05K3/4614 ,  H05K3/423 ,  H05K3/4626 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0369 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1147 ,  Y10T428/24917

    摘要： The present invention provides a method of manufacturing a metal foil laminated plate comprising the step of forming and attaching a resin porous layer onto a metal foil by a wet coagulating method, wherein a metal foil including a conductive bump having an almost equal height on a film forming side surface is used. The present invention provides a metal foil laminated plate comprising a metal foil including a conductive bump having an almost equal height and a resin porous layer laminated integrally, the conductive bump being exposed. The present invention provides another metal foil laminated plate comprising a metal foil including a conductive bump having an almost equal height, a resin porous layer laminated integrally, and a thermosetting resin impregnated in a hole of the resin porous layer, in which the conductive bump is exposed from the resin porous layer.

    摘要翻译： 本发明提供一种金属箔层叠板的制造方法，其特征在于，包括以下步骤：通过湿式凝固法将树脂多孔层（5）形成并附着在金属箔（1）上，其中，包含导电性的金属箔 使用在成膜侧面上具有几乎相同高度的凸起（2a）。 本发明提供一种金属箔叠层板，其包括金属箔（1），该金属箔包括具有几乎相同高度的导电凸块（2a）和一体层压的树脂多孔层（5），所述导电凸块（2a）被暴露。 本发明提供另一种金属箔叠层板，它包括金属箔（1），该金属箔包括具有几乎相同高度的导电凸块（2a），一个层压的树脂多孔层（5）和浸渍在树脂孔中的热固性树脂 多孔层（5），其中导电凸块（2a）从树脂多孔层（5）露出。

    Wiring board and method of manufacturing the same
    2.
    发明公开
    Wiring board and method of manufacturing the same 审中-公开
    Leiterplatte und Verfahren zu deren Herstellung

    公开(公告)号：EP1255428A2

    公开(公告)日：2002-11-06

    申请号：EP02009791.1

    申请日：2002-04-30

    申请人： Nitto Denko Corporation

    发明人： Kawashima, Toshiyuki, c/o Nitto Denko Corporation ,  Tahara, Nobuharu, c/o Nitto Denko Corporation ,  Ikeda, Kenichi, c/o Nitto Denko Corporation

    IPC分类号： H05K3/40 ,  H05K3/46

    CPC分类号： H05K3/4069 ,  H05K3/4652 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2203/0191 ,  H05K2203/0425 ,  H05K2203/1461 ,  Y10S156/922 ,  Y10T156/11 ,  Y10T428/24917

    摘要： The present invention provides a method of manufacturing a wiring board, including the steps of forming a through hole on a prepreg having a releasing resin film on at least one of its surfaces, the prepreg being obtained by impregnating a porous film having a thickness of 5 to 90µm and a porosity of 30 to 98% with a half cured thermosetting resin, filling the through hole with a conductive paste containing a conductive filler, peeling the resin film, laminating a metal foil on a surface from which the resin film is peeled, and heating and pressurizing the laminated product. Moreover, the present invention provides a wiring board including an insulating layer obtained by impregnating a porous film having a thickness of 5 to 90µm and a porosity of 30 to 98% with a thermosetting resin and curing them, and a conductive connection structure between wiring layers in which a through hole provided on the insulating layer is filled with a conductive paste, wherein the conductive connection structure has the conductive filler at only a boundary surface with the porous film and in an inner part thereof.

    摘要翻译： 本发明提供一种制造布线板的方法，包括以下步骤：在其至少一个表面上具有释放树脂膜（3,4）的预浸料（10）上形成通孔（5），预浸料（ 10）通过用半固化的热固性树脂浸渍厚度为5至90μm的多孔膜和30至98％的孔隙率而获得，用包含导电性的导电浆料（6）填充该通孔（5） 填充剂，剥离树脂膜（3,4），在剥离树脂膜（3,4）的表面上层叠金属箔（11,12），对叠层体进行加热加压。 此外，本发明提供了一种布线基板，其包括通过用热固性树脂浸渍厚度为5-90μm，孔隙率为30-98％的多孔膜并固化而获得的绝缘层（10） 其中设置在绝缘层上的通孔（5）填充有导电浆料（6）的布线层之间的连接结构，其中导电连接结构仅在与多孔膜的边界面处具有导电填料，并且在内部 部分。