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4 条记录 (耗时 0.008 秒)

    Fresh water generator and fresh water generating method
    1.
    发明公开
    Fresh water generator and fresh water generating method 审中-公开
    淡水发生器和淡水生成方法

    公开(公告)号：EP0995482A2

    公开(公告)日：2000-04-26

    申请号：EP99308235.3

    申请日：1999-10-19

    申请人： NITTO DENKO CORPORATION

    发明人： Kawashima, Toshiyuki, c/o Nitto Denko Corporation ,  Kawada, Ichirou, c/o Nitto Denko Corporation

    IPC分类号： B01D61/08 ,  B01D65/02 ,  C02F1/44

    CPC分类号： B01D61/022 ,  B01D61/08 ,  B01D61/12 ,  B01D65/02 ,  B01D2321/02 ,  B01D2321/04 ,  C02F1/283 ,  C02F1/441 ,  Y02A20/131

    摘要： A wash water pipe having a flushing valve inserted therein is connected with a concentrated water outlet pipe connected to a concentrated water outlet of a fresh water generating cartridge. A timer controls opening and closing of the flushing valve. The flushing valve is periodically opened during interruption of fresh water generation work with the fresh water generating cartridge or during fresh water generation work, or opened simultaneously with interruption of fresh water generation work or when restarting fresh water generation work, for performing flushing. Thus, the linear velocity on the surface of a reverse osmosis membrane of the fresh water generating cartridge is increased and impurities remaining on the membrane surface are discharged from the fresh water generating cartridge.

    摘要翻译： 其中插入冲洗阀的洗涤水管与连接到净水筒的浓缩水出口的浓缩水出口管连接。 定时器控制冲洗阀的打开和关闭。 在清水生成筒的新鲜水生成工作中断期间或者在清水生成工作期间，或者在中断清水生成工作或者重新开始清水生成工作时，冲洗阀被定期打开以进行冲洗。 因此，净水筒反渗透膜表面的线速度增加，残留在膜表面的杂质从净水筒排出。

    Metal foil laminated plate and method of manufacturing the same
    2.
    发明公开
    Metal foil laminated plate and method of manufacturing the same 审中-公开
    Laminierte Platte mit Metallfolie und Verfahren zu deren Herstellung

    公开(公告)号：EP1261244A2

    公开(公告)日：2002-11-27

    申请号：EP02010950.0

    申请日：2002-05-16

    申请人： Nitto Denko Corporation

    发明人： Ikeda, Kenichi, c/o Nitto Denko Corporation ,  Kawashima, Toshiyuki, c/o Nitto Denko Corporation ,  Tahara, Nobuharu, c/o Nitto Denko Corporation

    IPC分类号： H05K3/46

    CPC分类号： H05K3/4614 ,  H05K3/423 ,  H05K3/4626 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0369 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1147 ,  Y10T428/24917

    摘要： The present invention provides a method of manufacturing a metal foil laminated plate comprising the step of forming and attaching a resin porous layer onto a metal foil by a wet coagulating method, wherein a metal foil including a conductive bump having an almost equal height on a film forming side surface is used. The present invention provides a metal foil laminated plate comprising a metal foil including a conductive bump having an almost equal height and a resin porous layer laminated integrally, the conductive bump being exposed. The present invention provides another metal foil laminated plate comprising a metal foil including a conductive bump having an almost equal height, a resin porous layer laminated integrally, and a thermosetting resin impregnated in a hole of the resin porous layer, in which the conductive bump is exposed from the resin porous layer.

    摘要翻译： 本发明提供一种金属箔层叠板的制造方法，其特征在于，包括以下步骤：通过湿式凝固法将树脂多孔层（5）形成并附着在金属箔（1）上，其中，包含导电性的金属箔 使用在成膜侧面上具有几乎相同高度的凸起（2a）。 本发明提供一种金属箔叠层板，其包括金属箔（1），该金属箔包括具有几乎相同高度的导电凸块（2a）和一体层压的树脂多孔层（5），所述导电凸块（2a）被暴露。 本发明提供另一种金属箔叠层板，它包括金属箔（1），该金属箔包括具有几乎相同高度的导电凸块（2a），一个层压的树脂多孔层（5）和浸渍在树脂孔中的热固性树脂 多孔层（5），其中导电凸块（2a）从树脂多孔层（5）露出。

    Wiring board and method of manufacturing the same
    3.
    发明公开
    Wiring board and method of manufacturing the same 审中-公开
    Leiterplatte und Verfahren zu deren Herstellung

    公开(公告)号：EP1255428A2

    公开(公告)日：2002-11-06

    申请号：EP02009791.1

    申请日：2002-04-30

    申请人： Nitto Denko Corporation

    发明人： Kawashima, Toshiyuki, c/o Nitto Denko Corporation ,  Tahara, Nobuharu, c/o Nitto Denko Corporation ,  Ikeda, Kenichi, c/o Nitto Denko Corporation

    IPC分类号： H05K3/40 ,  H05K3/46

    CPC分类号： H05K3/4069 ,  H05K3/4652 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2203/0191 ,  H05K2203/0425 ,  H05K2203/1461 ,  Y10S156/922 ,  Y10T156/11 ,  Y10T428/24917

    摘要： The present invention provides a method of manufacturing a wiring board, including the steps of forming a through hole on a prepreg having a releasing resin film on at least one of its surfaces, the prepreg being obtained by impregnating a porous film having a thickness of 5 to 90µm and a porosity of 30 to 98% with a half cured thermosetting resin, filling the through hole with a conductive paste containing a conductive filler, peeling the resin film, laminating a metal foil on a surface from which the resin film is peeled, and heating and pressurizing the laminated product. Moreover, the present invention provides a wiring board including an insulating layer obtained by impregnating a porous film having a thickness of 5 to 90µm and a porosity of 30 to 98% with a thermosetting resin and curing them, and a conductive connection structure between wiring layers in which a through hole provided on the insulating layer is filled with a conductive paste, wherein the conductive connection structure has the conductive filler at only a boundary surface with the porous film and in an inner part thereof.

    摘要翻译： 本发明提供一种制造布线板的方法，包括以下步骤：在其至少一个表面上具有释放树脂膜（3,4）的预浸料（10）上形成通孔（5），预浸料（ 10）通过用半固化的热固性树脂浸渍厚度为5至90μm的多孔膜和30至98％的孔隙率而获得，用包含导电性的导电浆料（6）填充该通孔（5） 填充剂，剥离树脂膜（3,4），在剥离树脂膜（3,4）的表面上层叠金属箔（11,12），对叠层体进行加热加压。 此外，本发明提供了一种布线基板，其包括通过用热固性树脂浸渍厚度为5-90μm，孔隙率为30-98％的多孔膜并固化而获得的绝缘层（10） 其中设置在绝缘层上的通孔（5）填充有导电浆料（6）的布线层之间的连接结构，其中导电连接结构仅在与多孔膜的边界面处具有导电填料，并且在内部 部分。