专利检索 ap:("OLYMPUS CORP") AND inv:"TADAKI YOSHITAKA" 第 1 页

1.

发明公开
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICEIMAGE PICKUP DEVICE, AND IMAGING DEVICE 审中-公开
标题翻译：半导体衬底，HALBLEITERBAUELEMEN，记录装置及摄像装置

公开(公告)号：EP2958136A4

公开(公告)日：2016-09-07

申请号：EP14751278

申请日：2014-01-16

申请人： OLYMPUS CORP

发明人： SAITO HARUHISA , TADAKI YOSHITAKA , MIGITA CHIHIRO

IPC分类号： H01L27/14 , H01L21/60 , H01L23/485

CPC分类号： H01L24/13 , H01L21/563 , H01L24/05 , H01L24/11 , H01L24/16 , H01L24/32 , H01L24/81 , H01L27/14636 , H01L2224/0346 , H01L2224/0401 , H01L2224/05096 , H01L2224/05098 , H01L2224/05124 , H01L2224/05166 , H01L2224/05568 , H01L2224/05571 , H01L2224/05576 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05666 , H01L2224/1145 , H01L2224/1146 , H01L2224/11622 , H01L2224/11826 , H01L2224/11849 , H01L2224/119 , H01L2224/13013 , H01L2224/13016 , H01L2224/13017 , H01L2224/13082 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13551 , H01L2224/13552 , H01L2224/1356 , H01L2224/13562 , H01L2224/13565 , H01L2224/13566 , H01L2224/1357 , H01L2224/13582 , H01L2224/13624 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13666 , H01L2224/13669 , H01L2224/13684 , H01L2224/16058 , H01L2224/16059 , H01L2224/16238 , H01L2224/32225 , H01L2224/73204 , H01L2224/81009 , H01L2224/8109 , H01L2224/81092 , H01L2224/81191 , H01L2224/81203 , H01L2224/8138 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81466 , H01L2224/81469 , H01L2224/81484 , H01L2224/81903 , H01L2224/831 , H01L2224/92225 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/381 , H01L2924/00014 , H01L2924/00012 , H01L2924/01074 , H01L2224/11825 , H01L2924/014