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公开(公告)号：EP3319121A1
公开(公告)日：2018-05-09
申请号：EP17190243.0
申请日：2017-09-08
申请人： Nexperia B.V.
发明人： Chow, Wai Wong , Chau, On Lok
IPC分类号： H01L23/485 , H01L21/60
CPC分类号： H01L24/14 , H01L23/3114 , H01L24/09 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/10145 , H01L2224/13011 , H01L2224/13015 , H01L2224/13017 , H01L2224/13019 , H01L2224/13023 , H01L2224/131 , H01L2224/14051 , H01L2224/141 , H01L2224/1601 , H01L2224/16238 , H01L2224/1701 , H01L2224/81193 , H01L2224/81815 , H01L2924/384 , H01L2924/3841 , H01L2924/014 , H01L2924/00014
摘要： A leadless package semiconductor device has a top surface, a bottom surface opposite to the top surface, and multiple sidewalls between the top and bottom surfaces. At least one connection pad is disposed on the bottom surface. The connection pad includes a connection portion and at least one protrusion portion that extends from the connection portion and away from the bottom surface such that the protrusion portion and the connection portion surround a space on the bottom surface.
摘要翻译： 无引线封装半导体器件具有顶面，与顶面相对的底面以及顶面和底面之间的多个侧壁。 至少一个连接垫设置在底面上。 连接垫包括连接部分和从连接部分延伸并远离底表面的至少一个突出部分，使得突出部分和连接部分围绕底表面上的空间。
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2.发明公开Cu CORE BALL, SOLDER PASTE, FORMED SOLDER, Cu CORE COLUMN, AND SOLDER JOINT 审中-公开KUGEL MIT CU-KERN，LÖTPASTE，GEFORMTES LOT，SÄULEMIT CU-KERN UND LOTVERBINDUNG
公开(公告)号：EP3067151A4
公开(公告)日：2017-07-19
申请号：EP14860167
申请日：2014-11-04
发明人： HATTORI TAKAHIRO , SOMA DAISUKE , ROPPONGI TAKAHIRO , SATO ISAMU
IPC分类号： B23K35/14 , B22F1/00 , B22F1/02 , B23K35/02 , B23K35/22 , B23K35/26 , B23K35/30 , C22C1/04 , C22C9/00 , C22C13/00 , C22F1/00 , C22F1/08 , C25D3/60 , C25D7/00 , H01L21/60 , H01L23/00 , H01L23/556 , H05K3/34
CPC分类号： B23K35/302 , B22F1/00 , B22F1/0048 , B22F1/025 , B23K35/0222 , B23K35/025 , B23K35/22 , B23K35/26 , B23K35/262 , C22C1/0483 , C22C9/00 , C22C13/00 , C25D3/60 , C25D7/00 , H01L23/556 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/05647 , H01L2224/11825 , H01L2224/13012 , H01L2224/13013 , H01L2224/13014 , H01L2224/13016 , H01L2224/13017 , H01L2224/13147 , H01L2224/13294 , H01L2224/13311 , H01L2224/13347 , H01L2224/13411 , H01L2224/13455 , H01L2224/13457 , H01L2224/13561 , H01L2224/13611 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/16227 , H01L2224/81024 , H01L2224/81048 , H01L2224/81075 , H01L2224/81211 , H01L2224/81395 , H01L2224/81444 , H01L2224/81447 , H01L2224/81815 , H01L2225/06513 , H01L2225/06517 , H01L2924/15311 , H01L2924/351 , H05K3/3463 , H05K2201/0218 , H01L2924/01029 , H01L2924/00014 , H01L2924/0105 , H01L2924/01051 , H01L2924/01083 , H01L2924/0103 , H01L2924/01026 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01048 , H01L2924/01028 , H01L2924/01082 , H01L2924/01044 , H01L2924/01015 , H01L2924/01016 , H01L2924/01092 , H01L2924/0109 , H01L2924/01203 , H01L2924/01204 , H01L2924/00012 , H01L2924/013
摘要： Provided are a Cu core ball and a cu core column, which achieve dropping strength and strength against heat cycle. The Cu core ball (1) contains a Cu ball (2) made of Cu or a Cu alloy and a solder layer (3) which is made of a solder alloy composed of Sn and Cu and covers the Cu ball (2). The solder layer (3) contains not less than 0.1 % through not more than 3.0 % of Cu and the remainder is composed of Sn and impurities.
摘要翻译： 本发明提供了一种可降低热循环强度和强度的铜芯球和铜芯柱。 Cu芯球（1）包含由Cu或Cu合金制成的Cu球（2）和由Sn和Cu组成的焊料合金制成并覆盖Cu球（2）的焊料层（3）。 焊料层（3）含有0.1％以上且不超过3.0％的Cu，其余由Sn和杂质构成。
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公开(公告)号：EP2966680A4
公开(公告)日：2016-11-30
申请号：EP13877188
申请日：2013-03-07
发明人： MOTOYOSHI MAKOTO
IPC分类号： H01L25/065 , H01L21/60 , H01L25/07 , H01L25/18
CPC分类号： H01L24/14 , H01L23/147 , H01L23/49816 , H01L23/49827 , H01L23/544 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/17 , H01L24/81 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L2223/5442 , H01L2223/54426 , H01L2223/54473 , H01L2223/54486 , H01L2224/02126 , H01L2224/0215 , H01L2224/0346 , H01L2224/0347 , H01L2224/0401 , H01L2224/05155 , H01L2224/05568 , H01L2224/05582 , H01L2224/05644 , H01L2224/0603 , H01L2224/06051 , H01L2224/09517 , H01L2224/10135 , H01L2224/10165 , H01L2224/1134 , H01L2224/11444 , H01L2224/1147 , H01L2224/13013 , H01L2224/13014 , H01L2224/13017 , H01L2224/13023 , H01L2224/13144 , H01L2224/1403 , H01L2224/16148 , H01L2224/16238 , H01L2224/17051 , H01L2224/17517 , H01L2224/32225 , H01L2224/73204 , H01L2224/81002 , H01L2224/81007 , H01L2224/8109 , H01L2224/8114 , H01L2224/81141 , H01L2224/81143 , H01L2224/81191 , H01L2224/81203 , H01L2224/81986 , H01L2224/95146 , H01L2224/97 , H01L2225/06513 , H01L2225/06593 , H01L2924/01322 , H01L2924/15192 , H01L2924/00 , H01L2224/16225 , H01L2924/01013 , H01L2924/01032 , H01L2924/01051 , H01L2924/0105 , H01L2924/013 , H01L2924/00013 , H01L2924/00014 , H01L2924/0665 , H01L2224/81
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公开(公告)号：EP2950358A3
公开(公告)日：2016-01-20
申请号：EP15169338.9
申请日：2015-05-27
申请人： LG Innotek Co., Ltd
发明人： Oh, Sung Joo , Moon, Keal Doo , Lee, Dong Yong
CPC分类号： H01L33/62 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/81 , H01L33/38 , H01L33/486 , H01L33/647 , H01L2224/06102 , H01L2224/13017 , H01L2224/131 , H01L2224/13139 , H01L2224/13144 , H01L2224/13294 , H01L2224/133 , H01L2224/1403 , H01L2224/16058 , H01L2224/16227 , H01L2224/16245 , H01L2224/1703 , H01L2224/17051 , H01L2224/81193 , H01L2224/81439 , H01L2224/81815 , H01L2924/12041 , H01L2933/0066 , H01L2924/014 , H01L2924/00014
摘要： The disclosure provides a light emitting device package including a package body (210), a first lead frame (220a) and a second lead frame (220b) disposed on the package body, and a flip-chip type light emitting diode (240) electrically connected to the first lead frame and the second lead frame via respective conductive adhesives (310, 320). The conductive adhesives may be formed of a solder or of any other conductive materials. At least one of the conductive adhesives has its smallest width (W0) at a central region thereof.
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公开(公告)号：EP2775511A4
公开(公告)日：2015-09-09
申请号：EP11875240
申请日：2011-10-31
申请人： HITACHI LTD
发明人： TANIE HISASHI , SHINTANI HIROSHI , TANAKA NAOTAKA
IPC分类号： H01L23/373 , H01L21/60 , H01L23/482
CPC分类号： H01L23/562 , H01L21/52 , H01L23/36 , H01L23/3736 , H01L23/488 , H01L23/49811 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/83 , H01L2224/03444 , H01L2224/0346 , H01L2224/0401 , H01L2224/04026 , H01L2224/05005 , H01L2224/05011 , H01L2224/05016 , H01L2224/05023 , H01L2224/05082 , H01L2224/05147 , H01L2224/05155 , H01L2224/05564 , H01L2224/05568 , H01L2224/05573 , H01L2224/05655 , H01L2224/0603 , H01L2224/06051 , H01L2224/11444 , H01L2224/1146 , H01L2224/13005 , H01L2224/13011 , H01L2224/13017 , H01L2224/13078 , H01L2224/1308 , H01L2224/131 , H01L2224/13147 , H01L2224/13155 , H01L2224/16225 , H01L2224/16227 , H01L2224/27444 , H01L2224/2745 , H01L2224/2746 , H01L2224/29005 , H01L2224/29011 , H01L2224/29017 , H01L2224/29078 , H01L2224/2908 , H01L2224/30181 , H01L2224/32105 , H01L2224/32227 , H01L2224/32245 , H01L2224/33181 , H01L2224/3701 , H01L2224/37147 , H01L2224/38 , H01L2224/40095 , H01L2224/40106 , H01L2224/40229 , H01L2224/4103 , H01L2224/41176 , H01L2224/73204 , H01L2224/8309 , H01L2224/83101 , H01L2224/8321 , H01L2224/83801 , H01L2224/83815 , H01L2224/84801 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/15787 , H01L2924/351 , H01L2224/29155 , H01L2224/29147 , H01L2924/00012 , H01L2224/291 , H01L2924/014 , H01L2924/00 , H01L2224/05552
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6.发明公开Flip chip interconnection with etched posts on a microelectronic element joined to etched posts on a substrate by a fusible metal and corresponding manufacturing method 审中-公开通过蚀刻的支柱的基板上通过的微电子器件上通过熔化蚀刻列所形成的金属和相应的制造方法太形成倒装芯片连接相关联
公开(公告)号：EP2637202A2
公开(公告)日：2013-09-11
申请号：EP13164353.8
申请日：2008-09-26
申请人： Tessera, Inc.
发明人： Kwon, Jinsu
IPC分类号： H01L21/60 , H01L23/485 , H01L21/48 , H01L23/498 , H01L21/56
CPC分类号： H01L24/14 , H01L21/4853 , H01L21/563 , H01L23/3178 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/0558 , H01L2224/05624 , H01L2224/05644 , H01L2224/1147 , H01L2224/13015 , H01L2224/13016 , H01L2224/13017 , H01L2224/13019 , H01L2224/13023 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1412 , H01L2224/16 , H01L2224/16058 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/73204 , H01L2224/81001 , H01L2224/81011 , H01L2224/81136 , H01L2224/81193 , H01L2224/81203 , H01L2224/81815 , H01L2224/8183 , H01L2224/81894 , H01L2224/831 , H01L2225/06517 , H01L2225/0652 , H01L2225/1023 , H01L2225/1058 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/1532 , H01L2924/19041 , H01L2924/2064 , H01L2924/3841 , H01L2924/00014 , H01L2224/13099 , H01L2224/29099
摘要： A packaged microelectronic assembly includes a microelectronic element (104) joined to a substrate (102, 402). The microelectronic element (104) has a front surface (122) and a plurality of first solid metal posts (110) extending away from the front surface (122). Each of the first posts (110) has a width (W2) in a direction of the front surface (122) and a height (H2) extending from the front surface (122), wherein the height (H2) is at least half of the width (W2). The substrate (102, 402) has a top surface (101, 401) and a plurality of second solid metal posts (108) extending from the top surface (101, 401) and joined to the first solid metal posts (110) by a fusible metal (130), each second post (108) having a second width (W1) in a direction along the top surface (101, 401) and each projecting to a second height (H1) above the top surface (101, 401). The substrate (402) also has conductive interconnects (407) extending through the substrate (402) and electrically connecting terminals at a bottom surface (403) opposite the top surface (401) with the second solid metal posts (108). The plurality of first solid metal posts (110) and the plurality of second solid metal posts (108) are etched metal posts. The posts (110, 108) may have a frustoconical shape defined by the etching process.
摘要翻译： 一种封装的微电子组件包括一微电子元件（104）接合到衬底（102，402）。 所述微电子元件（104）具有前表面（122）和第一固体金属柱从所述前表面（122）延伸远离有多个（110）。 每个第一柱（110）的在所述前表面（122）和高度（H2）的方向上的宽度（W2）从所述前表面（122）worin的高度（H2）延伸的是至少一半 的宽度（W2）。 衬底（102，402）具有顶部表面（101，401）和第二固体金属柱从所述顶表面延伸的多个（108）（101，401），并通过一个连接到所述第一固体金属柱（110） 易熔金属（130），在沿着顶面（101，401）的方向上具有第二宽度（W1），每个第二柱（108），并且每个投射到顶部表面上方的第二高度（H1）（101，401） ， 如此的基板（402）具有导电互连（407）通过所述基板（402）和电连接端子在一个底表面（403）的顶面（401）相对地延伸与所述第二固体金属柱（108）。 第一固体金属柱（110）和第二固体金属柱（108）的分别设置于多个被蚀刻金属柱。 柱（110，108）可具有由蚀刻工艺所限定的截头圆锥形状。
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公开(公告)号：EP2206145A4
公开(公告)日：2012-03-28
申请号：EP08835829
申请日：2008-09-26
申请人： TESSERA INC
发明人： KWON JINSU
IPC分类号： H01L21/60 , H01L23/485
CPC分类号： H01L24/14 , H01L21/4853 , H01L21/563 , H01L23/3178 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/0558 , H01L2224/05624 , H01L2224/05644 , H01L2224/1147 , H01L2224/13015 , H01L2224/13016 , H01L2224/13017 , H01L2224/13019 , H01L2224/13023 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1412 , H01L2224/16 , H01L2224/16058 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/73204 , H01L2224/81001 , H01L2224/81011 , H01L2224/81136 , H01L2224/81193 , H01L2224/81203 , H01L2224/81815 , H01L2224/8183 , H01L2224/81894 , H01L2224/831 , H01L2225/06517 , H01L2225/0652 , H01L2225/1023 , H01L2225/1058 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/1532 , H01L2924/19041 , H01L2924/2064 , H01L2924/3841 , H01L2924/00014 , H01L2224/13099 , H01L2224/29099
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公开(公告)号：EP0997939A1
公开(公告)日：2000-05-03
申请号：EP99308579.4
申请日：1999-10-29
发明人： Higashi, Mitsutoshi, Shinko Electric Ind. Co. Ltd. , Sakaguchi, Hideaki, Shinko Electric Ind. Co. Ltd. , Imai, Kazunari, Shinko Electric Ind. Co. Ltd. , Kyozuka, Masahiro, Shinko Electric Ind. Co. Ltd. , Shimizu, Mitsuharu, Shinko Electric Ind. Co. Ltd.
CPC分类号： H01L24/12 , H01L21/563 , H01L23/3171 , H01L24/05 , H01L24/11 , H01L24/45 , H01L2224/0231 , H01L2224/0401 , H01L2224/05599 , H01L2224/1134 , H01L2224/11822 , H01L2224/13017 , H01L2224/13022 , H01L2224/13099 , H01L2224/13144 , H01L2224/13582 , H01L2224/13655 , H01L2224/13664 , H01L2224/45144 , H01L2224/73203 , H01L2224/81011 , H01L2224/85148 , H01L2224/85399 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/351 , H01L2224/29099 , H01L2224/48 , H01L2924/00
摘要： A semiconductor device includes a semiconductor element (10) having an electrode formation surface on which an electrode terminal (14) and a re-wiring portion (18) are formed. The re-wiring portion (18) is electrically connected to the electrode terminal (14). An external terminal (12) made of wire has a base end connected to the re-wiring portion (18) and a distal end extending therefrom. An electrically insulating resin (30) covers the electrode formation surface in such a manner that at least the distal end of the external terminal (12) is exposed outside the insulating resin. During a fabricating process, the electrode formation surface is coated with an electrically insulating resin (30) and then a part of the electrically insulating resin is removed from the distal end (12a) of the external connecting terminal (12) to expose the same outside the insulating resin.
摘要翻译： 半导体器件包括具有形成有电极端子（14）和再布线部（18）的电极形成面的半导体元件（10）。 再布线部分（18）电连接到电极端子（14）。 由导线制成的外部端子（12）具有连接到再布线部分（18）的基端和从其延伸的远端。 绝缘树脂（30）以至少外部端子（12）的远端暴露在绝缘树脂外部的方式覆盖电极形成表面。 在制造过程中，电极形成表面涂覆有电绝缘树脂（30），然后从外部连接端子（12）的远端（12a）去除一部分电绝缘树脂，以将其暴露在外部 绝缘树脂。
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公开(公告)号：EP0834919A3
公开(公告)日：2000-02-09
申请号：EP97116886.9
申请日：1997-09-29
发明人： Higashi, Kazushi , Tsukahara, Norihito , Yonezawa, Takahiro , Yagi, Yoshihiko , Kitayama, Yoshifumi , Otani, Hiroyuki
IPC分类号： H01L23/485 , H01L21/60
CPC分类号： H01L24/78 , H01L24/11 , H01L24/13 , H01L2224/11003 , H01L2224/1134 , H01L2224/11822 , H01L2224/13017 , H01L2224/13018 , H01L2224/13019 , H01L2224/13082 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1329 , H01L2224/133 , H01L2224/16225 , H01L2224/45015 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/78303 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , Y10T29/49179 , Y10T29/49181 , H01L2224/13099 , H01L2224/48 , H01L2924/00 , H01L2924/20752 , H01L2924/00015 , H01L2924/00012 , H01L2224/05599 , H01L2224/85399
摘要： A method of forming a bump electrode on an IC electrode (104) includes the steps of forming a ball bond (115) on an IC electrode by a wire bonding apparatus, moving up a bonding capillary (113), moving the bonding capillary sideway and then downward, bonding an Au wire (101) to the ball bond portion, and cutting the Au wire, the Au wire being prevented from coming in contact with the periphery of the ball bond portion except for the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.
摘要翻译： 在电极上形成突起电极（300）的方法包括以下步骤：通过引线接合装置在IC电极上形成球接合，向上移动接合毛细管，使接合毛细管侧向移动，然后向下移动，将Au线 到球接合部分，并切割Au线。 突起电极（300）具有特定形式，凸起部分（40）具有在电极上方的第一高度处的顶点（7）和从凸起部分（300）延伸并具有顶点的尾部（50） （52）在与凸起部分（40）的顶点大致相同的高度处。 两个顶点都具有平坦的表面（31a）。
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公开(公告)号：EP0834919A2
公开(公告)日：1998-04-08
申请号：EP97116886.9
申请日：1997-09-29
发明人： Higashi, Kazushi , Tsukahara, Norihito , Yonezawa, Takahiro , Yagi, Yoshihiko , Kitayama, Yoshifumi , Otani, Hiroyuki
IPC分类号： H01L23/485 , H01L21/60
CPC分类号： H01L24/78 , H01L24/11 , H01L24/13 , H01L2224/11003 , H01L2224/1134 , H01L2224/11822 , H01L2224/13017 , H01L2224/13018 , H01L2224/13019 , H01L2224/13082 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1329 , H01L2224/133 , H01L2224/16225 , H01L2224/45015 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/78303 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , Y10T29/49179 , Y10T29/49181 , H01L2224/13099 , H01L2224/48 , H01L2924/00 , H01L2924/20752 , H01L2924/00015 , H01L2924/00012 , H01L2224/05599 , H01L2224/85399
摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving up a bonding capillary, moving the bonding capillary sideway and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire, the Au wire being prevented from coming in contact with the periphery of the ball bond portion except for the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.
摘要翻译： 在IC电极上形成突起电极的方法包括以下步骤：通过引线接合装置在IC电极上形成球接合，向上移动接合毛细管，使接合毛细管侧向移动，然后向下移动，将Au线接合到 球接合部分，并且切割Au线，通过将接合毛细管的下降位置预设为高于位置的位置，防止Au线与球接合部分之外的球接合部分的周围接触 形成球形接合。
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