公开(公告)号：EP2164311A4

公开(公告)日：2011-03-23

申请号：EP08763924

申请日：2008-05-28

Applicant: PANASONIC CORP

Inventor： KITA TAKAYUKI ,  KATSUMATA MASAAKI ,  NAKAMURA TADASHI ,  FUKASAWA KOTA ,  FURUGOORI KAZUHIRO

IPC: H05K3/40 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/183 ,  H01L21/481 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/19105 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T156/1062 ,  Y10T428/24273 ,  Y10T428/24893 ,  Y10T428/24917 ,  H01L2224/0401

Abstract: An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in through-holes, and a lower board forming a circuit on a surface layer are stacked up, heated and pressed. In particular, the connection sheet between boards is made of a material different from the upper board and the lower board. A multi-layer circuit board having a cavity structure, and a full-layer IVH structure with high interlayer connection reliability can be manufactured.

公开(公告)号：EP2056655A4

公开(公告)日：2011-03-02

申请号：EP08776850

申请日：2008-07-15

Applicant: PANASONIC CORP

Inventor： NAKAMURA TADASHI ,  KITA TAKAYUKI ,  FUKASAWA KOTA

IPC: H05K1/14

CPC classification number: H05K1/141 ,  H05K3/368 ,  H05K3/4069 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/10378