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公开(公告)号：EP1760716A4
公开(公告)日：2012-02-22
申请号：EP05751185
申请日：2005-06-15
Applicant: PANASONIC CORP
Inventor： NAKAMURA TADASHI
CPC classification number: G11B20/1217 , G11B20/1883 , G11B27/3027 , G11B27/329 , G11B2020/1222 , G11B2020/1285 , G11B2020/1873 , G11B2020/1893 , G11B2220/20 , G11B2220/218 , G11B2220/2541
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公开(公告)号：EP2164311A4
公开(公告)日：2011-03-23
申请号：EP08763924
申请日：2008-05-28
Applicant: PANASONIC CORP
Inventor： KITA TAKAYUKI , KATSUMATA MASAAKI , NAKAMURA TADASHI , FUKASAWA KOTA , FURUGOORI KAZUHIRO
CPC classification number: H05K1/183 , H01L21/481 , H01L21/4857 , H01L23/13 , H01L23/49822 , H01L2224/16 , H01L2224/16235 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/19105 , H05K3/4614 , H05K3/4697 , H05K2201/10378 , H05K2203/061 , H05K2203/063 , Y10T29/49126 , Y10T29/49144 , Y10T29/49165 , Y10T156/1062 , Y10T428/24273 , Y10T428/24893 , Y10T428/24917 , H01L2224/0401
Abstract: An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in through-holes, and a lower board forming a circuit on a surface layer are stacked up, heated and pressed. In particular, the connection sheet between boards is made of a material different from the upper board and the lower board. A multi-layer circuit board having a cavity structure, and a full-layer IVH structure with high interlayer connection reliability can be manufactured.
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公开(公告)号：EP1758115A4
公开(公告)日：2013-03-13
申请号：EP05750984
申请日：2005-06-14
Applicant: PANASONIC CORP
Inventor： NAKAMURA TADASHI
CPC classification number: G11B20/1883 , G11B20/1217 , G11B2020/10907 , G11B2020/1893 , G11B2220/20 , G11B2220/218
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公开(公告)号：EP1890524A4
公开(公告)日：2009-07-01
申请号：EP07740830
申请日：2007-04-02
Applicant: PANASONIC CORP
Inventor： ECHIGO FUMIO , HIRAI SHOGO , NAKAMURA TADASHI
CPC classification number: H05K3/4069 , H05K1/0366 , H05K3/4614 , H05K3/4632 , H05K3/4652 , H05K2201/0129 , H05K2201/0278 , H05K2201/0355 , H05K2201/068 , H05K2203/1461 , Y10T29/49124
Abstract: A multilayer printed wiring board is characterized in that a thermal expansion coefficient in the thickness direction of an interlayer connecting material formed in a via hole is lower than that in the thickness direction of an electric insulating base material composed of an insulating material, an interlayer connection forming temperature is higher than a use environment temperature and a dimension in the thickness direction of the interlayer connecting material at a room temperature is more than that of the interlayer connecting material in the same wiring layer. As a result, since a material thermal expansion difference is generated in the thickness direction of the printed wiring board under the use environment, internal stress due to compression constantly operates to the interlayer connecting section. Therefore, the interlayer connecting section is compressed, and the multilayer printed wiring board having high connection reliability is obtained.
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Patent Agency Ranking
公开(公告)号：EP1760715A4
公开(公告)日：2013-03-13
申请号：EP05750872
申请日：2005-06-14
Applicant: PANASONIC CORP
Inventor： NAKAMURA TADASHI
CPC classification number: G11B20/1883 , G11B20/1217 , G11B2020/10907 , G11B2020/1893 , G11B2220/20 , G11B2220/218
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公开(公告)号：EP2056655A4
公开(公告)日：2011-03-02
申请号：EP08776850
申请日：2008-07-15
Applicant: PANASONIC CORP
Inventor： NAKAMURA TADASHI , KITA TAKAYUKI , FUKASAWA KOTA
IPC: H05K1/14
CPC classification number: H05K1/141 , H05K3/368 , H05K3/4069 , H05K2201/0133 , H05K2201/0187 , H05K2201/0209 , H05K2201/10378
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公开(公告)号：EP1494232A4
公开(公告)日：2009-07-01
申请号：EP03745889
申请日：2003-04-03
Applicant: PANASONIC CORP
Inventor： KUROSAWA YASUYUKI , NAKAMURA TADASHI , ITO MASANORI , SHIMOTASHIRO MASAFUMI
IPC: G11B20/12 , G11B27/10 , G11B27/32 , G11B27/34 , H04N5/765 , H04N5/77 , H04N5/781 , H04N5/85 , H04N5/907 , H04N9/79 , H04N9/804 , H04N9/806 , H04N9/82 , G11B27/00 , H04N5/91
CPC classification number: G11B20/1258 , G11B27/105 , G11B27/329 , G11B27/34 , G11B2020/10916 , G11B2020/1295 , G11B2220/216 , G11B2220/2562 , G11B2220/2575 , H04N5/765 , H04N5/772 , H04N5/781 , H04N5/85 , H04N5/907 , H04N9/7921 , H04N9/8042 , H04N9/8063 , H04N9/8205 , H04N9/8227
Abstract: Extended information capable of defining a reproduction order of still images is provided in the program control information defining a reproduction order of moving pictures recorded on an information recording medium, thereby realizing a program containing a moving picture and a still image. It is possible to realize recording of a program consisting of only still images and a user-defined program containing still images mixed in which the reproduction order is defined by a user. When a still image is recorded, a section marker is arranged in the program control information for describing a still image display period and a still image file name. When a still image is recorded, a still image identical to a still picture is MPEG-encoded and recorded in the same way as moving picture data, and a section marker is arranged in the program control information for describing a still image display period and a still image file name.
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公开(公告)号：EP1768126A4
公开(公告)日：2013-03-13
申请号：EP05751181
申请日：2005-06-15
Applicant: PANASONIC CORP
Inventor： NAKAMURA TADASHI
CPC classification number: G11B20/1217 , G11B20/1883 , G11B27/3027 , G11B27/329 , G11B2020/1222 , G11B2020/1285 , G11B2020/1873 , G11B2020/1893 , G11B2220/20 , G11B2220/218 , G11B2220/2541
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公开(公告)号：EP1760714A4
公开(公告)日：2012-02-22
申请号：EP05750837
申请日：2005-06-14
Applicant: PANASONIC CORP
Inventor： NAKAMURA TADASHI
CPC classification number: G06F3/064 , G06F3/0619 , G06F3/0677 , G11B20/1217 , G11B20/1883 , G11B27/329 , G11B2020/1873 , G11B2020/1893 , G11B2220/20 , G11B2220/218 , G11B2220/2541
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