公开(公告)号：EP2571340A4

公开(公告)日：2014-01-08

申请号：EP12776691

申请日：2012-04-19

Applicant: PANASONIC CORP

Inventor： HIMORI TSUYOSHI ,  KATSUMATA MASAAKI ,  KONDOU TOSHIKAZU

IPC: H05K1/09 ,  B05C11/10 ,  H01B1/20 ,  H01B13/00 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01B1/02 ,  H01B1/12 ,  H05K1/092 ,  H05K3/4069 ,  H05K3/4084 ,  H05K3/4652 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

公开(公告)号：EP2571341A4

公开(公告)日：2013-12-11

申请号：EP12777429

申请日：2012-04-19

Applicant: PANASONIC CORP

Inventor： HIMORI TSUYOSHI ,  KONDOU TOSHIKAZU ,  KATSUMATA MASAAKI

IPC: H05K1/09 ,  B05C11/10 ,  H01B1/20 ,  H01B13/00 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01B1/02 ,  H01B1/12 ,  H05K1/092 ,  H05K3/4069 ,  H05K3/4084 ,  H05K3/4652 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

公开(公告)号：EP2590488A4

公开(公告)日：2013-10-23

申请号：EP12816628

申请日：2012-07-24

Applicant: PANASONIC CORP

Inventor： HIMORI TSUYOSHI ,  KATSUMATA MASAAKI ,  KONDOU TOSHIKAZU

IPC: H05K3/40 ,  B05C11/10 ,  H01B13/00 ,  H05K1/09 ,  H05K3/46

CPC classification number: H05K3/0094 ,  H01B1/20 ,  H01B1/22 ,  H05K1/092 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613

Abstract: A method of manufacturing a reuse paste includes preparing a fiber piece housing paste, producing a filtered recovery paste, and producing a reuse paste. In the preparing of the fiber piece housing paste, a conductive paste including a conductive particle, resin and a latent curing agent, and a fiber piece housing paste including a fiber piece dropping off from a prepreg used for manufacturing a circuit board are prepared. In the producing of the filtered recovery paste, the filtered recovery paste is produced by filtering the fiber piece housing paste, which remains in a paste state, by using a filter. In the production of the reuse paste, the reuse paste is produced by adding at least one of a solvent, resin, and a paste having a different composition from that of the filtered recovery paste into the filtered recovery paste.

公开(公告)号：EP2164311A4

公开(公告)日：2011-03-23

申请号：EP08763924

申请日：2008-05-28

Applicant: PANASONIC CORP

Inventor： KITA TAKAYUKI ,  KATSUMATA MASAAKI ,  NAKAMURA TADASHI ,  FUKASAWA KOTA ,  FURUGOORI KAZUHIRO

IPC: H05K3/40 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/183 ,  H01L21/481 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/19105 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T156/1062 ,  Y10T428/24273 ,  Y10T428/24893 ,  Y10T428/24917 ,  H01L2224/0401

Abstract: An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in through-holes, and a lower board forming a circuit on a surface layer are stacked up, heated and pressed. In particular, the connection sheet between boards is made of a material different from the upper board and the lower board. A multi-layer circuit board having a cavity structure, and a full-layer IVH structure with high interlayer connection reliability can be manufactured.

公开(公告)号：EP1365451A4

公开(公告)日：2010-06-23

申请号：EP02801549

申请日：2002-10-11

Applicant: PANASONIC CORP

Inventor： HAYAMA MASAAKI ,  HIGASHITANI HIROSHI ,  YASUHO TAKEO ,  KATSUMATA MASAAKI ,  HANDA HIROYUKI

IPC: H05K3/46 ,  G06K19/077 ,  H01F17/00 ,  H01F27/40 ,  H01L21/48 ,  H01L23/538 ,  H01L25/00 ,  H05K1/00 ,  H05K1/16 ,  H05K1/18 ,  H01L23/12

CPC classification number: H01L21/4857 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  H01F17/0013 ,  H01F27/40 ,  H01F2017/0026 ,  H01L23/5388 ,  H01L23/645 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/2402 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/0298 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/086 ,  H05K2201/10416 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/01005

公开(公告)号：EP1648028A4

公开(公告)日：2010-05-26

申请号：EP05737236

申请日：2005-04-28

Applicant: PANASONIC CORP

Inventor： TSUNEOKA MICHIAKI ,  SUGAYA YASUHIRO ,  KATSUMATA MASAAKI ,  FUJIWARA JOJI

IPC: H01L23/00 ,  H05K3/46 ,  H01L23/12 ,  H01L23/28 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K1/186 ,  H01L24/97 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/0263 ,  H05K1/167 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/4614 ,  H05K2201/0715 ,  H05K2203/061