公开(公告)号：EP1416219A4

公开(公告)日：2009-06-17

申请号：EP02755890

申请日：2002-08-08

Applicant: PANASONIC CORP

Inventor： SHIMIZU MASANORI ,  YANO TADASHI ,  SETOMOTO TATSUMI ,  MATSUI NOBUYUKI ,  TAMURA TETSUSHI

IPC: F21K99/00 ,  F21V9/00 ,  H01L25/075 ,  H01L33/64 ,  H01R33/22 ,  F21S2/00 ,  F21V29/00 ,  F21Y101/02 ,  H01L33/00

CPC classification number: F21V29/70 ,  F21K9/23 ,  F21L4/00 ,  F21L4/005 ,  F21L4/027 ,  F21S2/00 ,  F21S6/00 ,  F21S6/003 ,  F21V7/0083 ,  F21V19/003 ,  F21V19/045 ,  F21V29/004 ,  F21Y2103/33 ,  F21Y2105/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/20 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/64 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01R12/714 ,  H01R33/225 ,  H05B33/0803 ,  H05B33/0821 ,  H05B33/0842 ,  H05B33/0863 ,  H05K1/05 ,  H05K1/112 ,  H05K1/117 ,  H05K2201/10106 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The present invention provides a LED illumination source, comprising a heat-dissipating substrate including a metal plate, an insulating layer provided on the metal plate, and a conductive line pattern provided on the insulating layer, and at least one LED bare chip mounted facedown and including a chip substrate and a light emitting portion disposed thereon, wherein the light emitting portion is closer to the heat-dissipating substrate than the chip substrate.

Abstract translation: 本发明提供一种LED照明源，包括：散热基板，包括金属板，设置在所述金属板上的绝缘层，以及设置在所述绝缘层上的导线图案;以及至少一个面向下安装的LED裸芯片， 包括芯片基板和设置在其上的发光部分，其中发光部分比芯片基板更靠近散热基板。

公开(公告)号：EP2479474A4

公开(公告)日：2013-06-19

申请号：EP10815162

申请日：2010-09-13

Applicant: PANASONIC CORP

Inventor： TANIMOTO NORIYASU ,  MATSUI NOBUYUKI

IPC: F21S2/00 ,  F21Y101/02

CPC classification number: F21K9/65 ,  F21K9/23 ,  F21K9/238 ,  F21V21/30 ,  F21V23/006 ,  F21Y2115/10

Abstract: A bulb-type lamp has a bsae 4 to be inserted into a socket by being rotated about a central axis X of the base, a first body 6 attached to the base 4 to be freely rotatable about the central axis X; a second body 8 attached to the first body 4 to be swingable about a swing axis Y1 that intersects the central axis X; a light-emitting module 10 mounted on the second body 8; and a lighting circuit unit 12 configured to light the light-emitting module 10. The lighting circuit unit 12 is housed in the first body 6.

公开(公告)号：EP2518385A4

公开(公告)日：2012-12-05

申请号：EP10838963

申请日：2010-12-22

Applicant: PANASONIC CORP

Inventor： TANIUCHI AKIRA ,  TAKAHASHI KENJI ,  MATSUI NOBUYUKI ,  TAMURA TETSUSHI ,  TOMIYOSHI YASUSHIGE ,  SETOMOTO TATSUMI

IPC: F21S2/00 ,  F21V14/02 ,  F21V19/00 ,  F21V19/02 ,  F21V23/00 ,  F21Y101/02

CPC classification number: F21V23/009 ,  F21K9/23 ,  F21K9/238 ,  F21K9/65 ,  F21S8/026 ,  F21V3/00 ,  F21V14/02 ,  F21V19/02 ,  F21V23/006 ,  F21Y2107/00 ,  F21Y2107/90 ,  F21Y2115/10

公开(公告)号：EP1592071A4

公开(公告)日：2009-04-08

申请号：EP03786260

申请日：2003-12-24

Applicant: PANASONIC CORP

Inventor： TAMURA TETSUSHI ,  SETOMOTO TATSUMI ,  MATSUI NOBUYUKI ,  SHIMIZU MASANORI ,  YAMASHITA YOSHIHISA

IPC: H01L21/60 ,  H05K1/11

CPC classification number: H01L33/20 ,  H01L33/38 ,  H01L2924/0002 ,  H05K1/111 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/10106 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: A wiring board for mounting an LED bare chip capable of firmly joining an LED bare chip and improving yield. A printed wiring board (2), wherein the interval D between oppositely-disposed wiring patterns (81, 85) in a relevant opposing region is the smallest at a portion close to the center (point G) of an LED chip (14) when it is disposed at a designed position and is gradually larger as it is increasingly separated from the point G, in addition, the pattern edges (83, 87) of the wiring patterns (81, 85) at a portion where the interval is larger are formed to be gradually separated from each other with respect to the electrode edges (148, 149) of the LED chip (14) in the direction of widening the interval as they are increasingly separated from the point G.