公开(公告)号：EP1145309A3

公开(公告)日：2001-12-12

申请号：EP00972400.6

申请日：2000-09-07

申请人： Philips Semiconductors Inc.

发明人： LAU, Daniel, Kwok ,  MARTIN, Robert, J., III ,  HAMZEHDOOST, Ahmad

IPC分类号： H01L23/495 ,  H01L23/498

公开(公告)号：EP1145309A2

公开(公告)日：2001-10-17

申请号：EP00972400.6

申请日：2000-09-07

申请人： Philips Semiconductors Inc.

发明人： LAU, Daniel, Kwok ,  MARTIN, Robert, J., III ,  HAMZEHDOOST, Ahmad

IPC分类号： H01L23/00

CPC分类号： H01L24/06 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/14 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00

摘要： An electronic part includes an integrated circuit that has bond pads. A wire bonded package contains the integrated circuit. The wire bonded package includes bond fingers. A second row of bond fingers is located between a first row of bond fingers and a third row of bond fingers. Each bond finger in the third row of bond fingers is electrically connected to a corresponding bond finger in the first row of bond fingers. Wire bonds connect bond pads to bond fingers from the first row of bond fingers, the second row of bond fingers and the third row of bond fingers.