A METHOD OF FABRICATING A FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE
    6.
    发明公开
    A METHOD OF FABRICATING A FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE 审中-公开
    用于生产FIN场效应晶体管或 的FinFET COMPONENT

    公开(公告)号:EP2353178A1

    公开(公告)日:2011-08-10

    申请号:EP09749294.6

    申请日:2009-11-06

    IPC分类号: H01L21/336 H01L29/78

    CPC分类号: H01L29/66795 H01L29/785

    摘要: A method of fabricating a semiconductor using a fin field effect transistor (FINFET) is disclosed. In a particular embodiment, a method includes depositing, on a silicon substrate, a first dummy structure having a first sidewall and a second sidewall separated by a first width. The method also includes depositing, on the silicon substrate, a second dummy structure concurrently with depositing the first dummy structure. The second dummy structure has a third sidewall and a fourth sidewall that are separated by a second width. The second width is substantially greater than the first width. The first dummy structure is used to form a first pair of fins separated by approximately the first width. The second dummy structure is used to form a second pair of fins separated by approximately the second width.

    MEMORY DEVICE FOR RESISTANCE-BASED MEMORY APPLICATIONS
    7.
    发明公开
    MEMORY DEVICE FOR RESISTANCE-BASED MEMORY APPLICATIONS 有权
    存储设备电阻式存储器应用

    公开(公告)号:EP2332142A1

    公开(公告)日:2011-06-15

    申请号:EP09792136.5

    申请日:2009-09-01

    CPC分类号: G11C11/1673

    摘要: In a particular embodiment, a memory device (100) is disclosed that includes a memory cell (226) including a resistance based memory element (228) coupled to an access transistor (230). The access transistor has a first oxide thickness to enable operation of the memory cell at an operating voltage. The memory device also includes a first amplifier (202) configured to couple the memory cell to a supply voltage (Vamp) that is greater than a voltage limit to generate a data signal based on a current through the memory cell. The first amplifier includes a clamp transistor (216) that has a second oxide thickness that is greater than the first oxide thickness. The clamp transistor is configured to prevent the operating voltage at the memory cell from exceeding the voltage limit.