公开(公告)号：EP1551588B1

公开(公告)日：2013-02-27

申请号：EP03798870.6

申请日：2003-09-26

申请人： Rehm Thermal Systems GmbH

发明人： MEIER, Hartmut ,  MÜLLER, Bernd ,  WITTREICH, Ulrich

IPC分类号： B23K3/08 ,  B23K1/012

CPC分类号： B23K3/08 ,  B01D47/021 ,  B01D47/022 ,  B01D47/027 ,  B01D47/12 ,  B01D53/14 ,  B23K1/012

公开(公告)号：EP1715977B1

公开(公告)日：2009-10-14

申请号：EP05706673.0

申请日：2005-01-10

申请人： Rehm Thermal Systems GmbH

发明人： MÜLLER, Bernd ,  WITTREICH, Ulrich

IPC分类号： B23K1/018 ,  B23K3/08 ,  B23K3/06 ,  H05K13/04 ,  H01L21/60

CPC分类号： B23K1/018 ,  B23K3/00 ,  B23K3/029 ,  B23K3/0615 ,  B23K3/0653 ,  B23K3/082 ,  H01L24/98 ,  H01L2924/01004 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014

摘要： The invention relates to a repair soldering head (12) which can for example be used to replace structural elements (26). For unsoldering, the structural component (26) is heated by means of a heat transfer medium (16) until the soldered joints (27) between the structural component (26) and the substrate (29) are melted. The heat transfer medium is for example a liquid solder that is guided to the structural component (26) through a supply line (18) and flows back through return channels (19). The structural component is removed by means of a vacuum connection which allows sucking the structural component (26) on a receptacle (14). The repair soldering head (12) can also be used to remove remaining solder or for soldering a positioning point by means of a specifically provided soldering body and for soldering in structural components.