摘要:
An object of the invention is to provide a soldering apparatus that moves the soldering apparatus at a rapid speed while ensuring that molten solder does not spill to the outside of a jet nozzle. A semiconductor device disclosed in the present description includes a solder tank that stores the molten solder, a jetting mechanism that has the jet nozzle, which extends upwards from the solder tank toward a holding surface, and a pump, which pumps the molten solder stored in the solder tank, and that jets the molten solder from the jet nozzle toward the holding surface by the pump being driven, an XY-direction moving mechanism that moves the solder tank in an X-direction and a Y-direction, which are parallel to the holding surface, and a control device that controls the acceleration and deceleration of the solder tank according to the height of the molten solder protruding upwards from a tip of the jet nozzle or the height of the molten solder protruding upwards from the tip of the jet nozzle according to the acceleration and deceleration of the solder tank such that the molten solder does not spill to the outside of the jet nozzle, when the XY-direction moving mechanism is driven to move the solder tank in the X-direction and/or the Y-direction.
摘要:
To provide an attaching device that can convey a component, such as a nut, to a welding area without using an air cylinder. [Solution] The present invention provides an attaching device (100) that attaches a nut (240) to a bracket (230). The attaching device (100) has a component feeding part (10) that stores the nut therein, a welding part (40) that welds the nut to the bracket by using electrodes (41, 42), a conveying part (20) that conveys the nut stored in the component feeding part to a position where the nut is to be attached to the bracket, and a feeding head (30) that is temporarily positioned between the electrodes (41, 42) and that disposes the nut conveyed from the conveying part on the lower electrode of the pair of electrodes.
摘要:
It is a task of the present application to provide a butt position detecting method for a weld joint and a butt position detecting device for a weld joint that can detect a position of a butt portion between both members with high accuracy while reducing costs, and a manufacturing a weld joint that carries out the butt position detecting method. Thus, according to one aspect of the invention, in a butt position detecting method for a weld joint, when an arrangement direction of a first member and a second member is defined as a first direction, and a direction that is perpendicular to the first direction is defined as a second direction, the first member has a corner portion and a chamfer portion, and a two-dimensional displacement sensor is arranged at a position offset from the butt portion toward the first member side in the first direction, and such that an angle θs at which the second direction and an optical axis direction of irradiation light of the two-dimensional displacement sensor intersect with each other and an angle θa at which the second direction and a formation direction of the chamfer portion of the first member intersect with each other satisfy a condition expression: 0°
摘要:
It is a task of the present application to provide a butt position detecting method for a weld joint and a butt position detecting device for a weld joint that can detect a position of a butt portion between both members with high accuracy while reducing costs, and a manufacturing a weld joint that carries out the butt position detecting method. Thus, according to one aspect of the invention, in a butt position detecting method for a weld joint, when an arrangement direction of a first member and a second member is defined as a first direction, and a direction that is perpendicular to the first direction is defined as a second direction, the first member has a corner portion and a chamfer portion, and a two-dimensional displacement sensor is arranged at a position offset from the butt portion toward the first member side in the first direction, and such that an angle ¸s at which the second direction and an optical axis direction of irradiation light of the two-dimensional displacement sensor intersect with each other and an angle ¸a at which the second direction and a formation direction of the chamfer portion of the first member intersect with each other satisfy a condition expression: 0°
摘要:
The invention relates to a repair soldering head (12) which can for example be used to replace structural elements (26). For unsoldering, the structural component (26) is heated by means of a heat transfer medium (16) until the soldered joints (27) between the structural component (26) and the substrate (29) are melted. The heat transfer medium is for example a liquid solder that is guided to the structural component (26) through a supply line (18) and flows back through return channels (19). The structural component is removed by means of a vacuum connection which allows sucking the structural component (26) on a receptacle (14). The repair soldering head (12) can also be used to remove remaining solder or for soldering a positioning point by means of a specifically provided soldering body and for soldering in structural components.
摘要:
La machine comprend deux tambours (3-4) qui par pression mettent en place les mailles des deux brins constitutifs de la chaîne (1), et une pince (5) qui assure l'avancement et la mise en rotation de celle-ci qui est ainsi amenée au porte de soudage (6) où les anneaux qui forment les brins élémentaires subissent une opération de soudage par points. Après cela les âmes (8) en fil métallique sont extraites des brins de la chaîne qui a l'état fini est recueillie sur une bobine tournante (9).
摘要:
An automatic soldering apparatus, in which a base portion of a holder (23) extending a free end portion (soldering nozzle) (30) of a feed tube (10), which is used to guide a wire solder (22), toward a free end of a trowel tip (9) and supporting the free end portion (30) in the vicinity of the tip (9) is held on base plates (24, 54), which can be lowered and positioned with respect to this tip (9), via a spring, and tilted longitudinally, laterally and diagonally with respect to the tip (9) depending or how far a plurality of adjusting screws provided on the base plates (24, 54) project, whereby the wire solder (22) can be supplied to the trowel tip (9) in the desired positional relation therewith irrespective of the degree of wear of the trowel tip (9) in continuous use.