摘要:
It is an object of this invention to provide a piezoelectric film element which has structural characteristics capable of preventing the generation of cracks in the steps of manufacturing the piezoelectric film element and of increasing the thickness of a piezoelectric film. The piezoelectric film element of this invention comprises a dislocation layer in the piezoelectric film. This "dislocation layer" is the layer of which atoms in crystals are partly defective, which is caused by lattice defects. In the step of forming the piezoelectric film, when a sol which is a piezoelectric film precursor is turned into a gel by means of thermal treatment and when crystal grains of the sol grow, a lattice arrangement over the surfaces of the crystal grains is disturbed moderately. Accordingly, when the piezoelectric film is formed over the gel, the dislocation layer can be formed in the piezoelectric film. It is particularly desirable that the piezoelectric film have a plurality of dislocation layers in its film thickness direction and that the dislocation layers be formed in a manner such that the distances between the adjacent dislocation layers are the same or gradually become shorter from the lower electrode side to the upper electrode side. As stresses caused at the time of formation of the piezoelectric film strongly affect the surface of the piezoelectric film (on the upper electrode side), the above-described structure can effectively relax the stresses caused at the time of formation of the piezoelectric film. Therefore, it is possible to increase the thickness of the piezoelectric film.
摘要:
[Object] Providing a mechanism which can eliminate an influence of residual strain in a piezoelectric thin film, having excellent piezoelectric strain characteristics. [Means of Solution] No or few foreign substances exist or an abundance of foreign substances is low at grain boundaries, which are boundaries between crystal grains of the piezoelectric thin film, even after performing polarization processing (poling) on the piezoelectric thin film component. The width of the grain boundary is 5 nm or less. The crystal grain boundary is a discontinuous layer which does not continue the orientation of adjacent crystal grains.
摘要:
It is an object of this invention to provide a piezoelectric film element which has structural characteristics capable of preventing the generation of cracks in the steps of manufacturing the piezoelectric film element and of increasing the thickness of a piezoelectric film. The piezoelectric film element of this invention comprises a dislocation layer in the piezoelectric film. This "dislocation layer" is the layer of which atoms in crystals are partly defective, which is caused by lattice defects. In the step of forming the piezoelectric film, when a sol which is a piezoelectric film precursor is turned into a gel by means of thermal treatment and when crystal grains of the sol grow, a lattice arrangement over the surfaces of the crystal grains is disturbed moderately. Accordingly, when the piezoelectric film is formed over the gel, the dislocation layer can be formed in the piezoelectric film. It is particularly desirable that the piezoelectric film have a plurality of dislocation layers in its film thickness direction and that the dislocation layers be formed in a manner such that the distances between the adjacent dislocation layers are the same or gradually become shorter from the lower electrode side to the upper electrode side. As stresses caused at the time of formation of the piezoelectric film strongly affect the surface of the piezoelectric film (on the upper electrode side), the above-described structure can effectively relax the stresses caused at the time of formation of the piezoelectric film. Therefore, it is possible to increase the thickness of the piezoelectric film.
摘要:
A piezoelectric thin-film device includes: a substrate; and a piezoelectric thin film formed on the substrate, wherein a thickness of the piezoelectric thin film is 1 to 10 µm, a crystal grain size of the piezoelectric thin film is 0.05 to 1 µm, and a surface roughness (Rmax) of the piezoelectric thin film is no more than 1 µm.
摘要:
A piezoelectric thin-film device, a process for its manufacturing, and an ink-jet recording head comprising said thin-film device are provided, wherein the PZT seed crystals are produced by either physical vapor deposition, chemical vapor disposition, or spin-coating.
摘要:
A piezoelectric thin-film device, a process for its manufacturing, and an ink-jet recording head comprising said thin-film device are provided, wherein the PZT seed crystals are produced by either physical vapor deposition, chemical vapor disposition, or spin-coating.
摘要:
A piezoelectric thin film which has good properties, for example, a high dielectric constant and a high piezoelectric strain constant is disclosed. A method for producing a piezoelectric film, which causes no crack during annealing, is also disclosed. The piezoelectric thin film has a thickness in the range of from 0.5 to 20 µm, comprises crystal grains having an average grain diameter of 0.005 to 0.2 µm, and is free from any multilayer structure in its cross section. The process for producing a piezoelectric thin film comprises that steps of: coating a substrate with a sol composition comprising a sol, of a metal component for constituting a piezoelectric film, and a polymer compound and then drying the coating to form a film; pre-sintering the film to form a porous thin film of gel comprising an amorphous metal oxide; pre-annealing the porous thin film of gel to bring the film to a film formed of a crystalline metal oxide; repeating the above steps at least once to form a laminated film formed of a crystalline metal oxide; and annealing the laminated film to grow crystal grains of perovskite type in the film into a larger size.
摘要:
Providing a mechanism which can eliminate an influence of residual strain in a piezoelectric thin film, having excellent piezoelectric strain characteristics. A thin film piezoelectric component is provided having low residual strain at its grain boundary (14A) between the piezoelectric PZT film (15) and its platinum electrode (14), even after performing polarization processing (poling) on the piezoelectric thin film component. The width of the grain boundary is 5 nm or less. The crystal grain boundary is a discontinuous layer which does not continue the orientation of adjacent crystal grains.
摘要:
A method of forming an oxide-ceramics film capable of controlling the amount of oxygen in the film and with little oxygen deficiency. At least one or more of the steps among a step of forming an amorphous film, a step of heating the amorphous film for crystallization, and a step of these heat processings to be conducted thereafter include a step of processing under an atmosphere including moisture.