摘要:
An improved semiconductor fabrication process is disclosed in accordance with which a semiconductor layer just formed by a plasma CVD method for example is subjected to light irradiation under conditions such as to encourage the development of dangling bonds in the surface microstructure of the semiconductor, and the dangling bonds thus formed are then neutralized by the formation of stable combinations between the dangling bonds and a neutralizing agent. The resulting semiconductor does not demonstrate the disadvantageous Staebler-Wronski effect and is advantageous in the fabrication of semiconductor photoelectric conversion devices.
摘要:
An improved liquid crystal device immune to contamination of the liquid crystal is shown. The liquid crystal (4) is isolated from ion sources such as glass substrates (1,1'), transparent electrodes (2,2') or so on by means of a nitride layer (3,3') positioned therebetween.
摘要:
An improved liquid crystal device immune to contamination of the liquid crystal is shown. The liquid crystal (4) is isolated from ion sources such as glass substrates (1,1'), transparent electrodes (2,2') or so on by means of a nitride layer (3,3') positioned therebetween.
摘要:
An improved semiconductor fabrication process is disclosed in accordance with which a semiconductor layer just formed by a plasma CVD method for example is subjected to light irradiation under conditions such as to encourage the development of dangling bonds in the surface microstructure of the semiconductor, and the dangling bonds thus formed are then neutralized by the formation of stable combinations between the dangling bonds and a neutralizing agent. The resulting semiconductor does not demonstrate the disadvantageous Staebler-Wronski effect and is advantageous in the fabrication of semiconductor photoelectric conversion devices.