Optical backplane
    3.
    发明公开
    Optical backplane 审中-公开
    光背板

    公开(公告)号:EP1363149A2

    公开(公告)日:2003-11-19

    申请号:EP03009851.1

    申请日:2003-05-13

    IPC分类号: G02B6/43

    摘要: An object of the present invention is to provide a semiconductor device using a cheap glass substrate, capable of corresponding to the increase of the amount of information and further, having a high performance and an integrated circuit capable of operating at a high rate. A variety of circuits configuring an integrated circuit are formed on a plurality of glass substrates, the transmission of a signal between the respective glass substrates is performed by what is called an optical interconnect using an optical signal. Concretely, alight emitting element is provided on the output side of a circuit disposed on the upper stage formed on one glass substrate, and a photo-detecting element is formed so as to oppose to the relevant light emitting element on the input side of a circuit disposed on the rear stage formed on another glass substrate. Then, an optical signal converted from an electrical signal outputted from a circuit disposed on the upper stage is outputted from the light emitting element, the relevant optical signal is converted into an electrical signal by a photo-detecting element and inputted into a circuit disposed on the rear stage.

    Optical backplane
    9.
    发明公开
    Optical backplane 审中-公开
    OptischeRückwandverdrahtung

    公开(公告)号:EP1363149A3

    公开(公告)日:2004-08-18

    申请号:EP03009851.1

    申请日:2003-05-13

    IPC分类号: G02B6/43 G06F3/14

    摘要: An object of the present invention is to provide a semiconductor device using a cheap glass substrate, capable of corresponding to the increase of the amount of information and further, having a high performance and an integrated circuit capable of operating at a high rate. A variety of circuits configuring an integrated circuit are formed on a plurality of glass substrates, the transmission of a signal between the respective glass substrates is performed by what is called an optical interconnect using an optical signal. Concretely, alight emitting element is provided on the output side of a circuit disposed on the upper stage formed on one glass substrate, and a photo-detecting element is formed so as to oppose to the relevant light emitting element on the input side of a circuit disposed on the rear stage formed on another glass substrate. Then, an optical signal converted from an electrical signal outputted from a circuit disposed on the upper stage is outputted from the light emitting element, the relevant optical signal is converted into an electrical signal by a photo-detecting element and inputted into a circuit disposed on the rear stage.

    摘要翻译: 本发明的目的是提供一种使用便宜的玻璃基板的半导体器件,其能够相应于信息量的增加,并且还具有高性能和能够以高速率运行的集成电路。 构成集成电路的各种电路形成在多个玻璃基板上,通过所谓的使用光信号的光互连来实现各玻璃基板之间的信号传输。 具体地说,在设置在一个玻璃基板上形成的上层的电路的输出侧设置发光元件,并且形成光电检测元件,以与电路输入侧的相关发光元件相对 设置在形成在另一玻璃基板上的后台上。 然后,从发光元件输出从设置在上层的电路输出的电信号转换的光信号,将相关光信号由光检测元件转换成电信号,并输入到设置在 后台。

    IC card and booking account system using the IC card
    10.
    发明公开
    IC card and booking account system using the IC card 有权
    Chipkarte und Buchhaltungssystem unter Verwendung der Chipkarte

    公开(公告)号:EP1437683A2

    公开(公告)日:2004-07-14

    申请号:EP03029021.7

    申请日:2003-12-16

    IPC分类号: G06K19/077

    摘要: It is an object of the present invention to provide a highly sophisticated functional card that can ensure security by preventing forgery such as changing a picture of a face, and display other images as well as the picture of a face. A card comprising a display device and a thin film integrated circuit; wherein driving of the display device is controlled by the thin film integrated circuit; a semiconductor element used for the thin film integrated circuit and the display device is formed by using a polycrystalline semiconductor film; the thin film integrated circuit and the display device are sealed with a resin between a first substrate and a second substrate of the card; and the first substrate and the second substrate are plastic substrates.

    摘要翻译: 该卡具有用于控制显示装置(105)的驱动的薄膜集成电路(IC)(106)。 天线线圈(103)使用电磁感应器从终端设备发送和接收数据,而不接触设备。 用于电路和器件的薄膜晶体管使用多晶半导体膜形成。 电路和器件用塑料基板之间的树脂密封。 采用LCD装置或数字微镜装置作为显示装置。 使用卡片的预订帐户系统也包含独立声明。