公开(公告)号：EP0407951A3

公开(公告)日：1992-03-04

申请号：EP90113111.0

申请日：1990-07-10

Applicant: SHIPLEY COMPANY INC.

Inventor： D'Ottavio, Eugene D. ,  Hawkins, Robert E. ,  Rodriguez, Stephen S. ,  Rychwalski, James

IPC: G03F7/16

CPC classification number: H05K3/108 ,  G03F7/164 ,  H05K1/0284 ,  H05K3/062 ,  H05K3/064 ,  H05K2201/0347 ,  H05K2201/09118 ,  H05K2203/135

Abstract: A process for manufacturing a 3-dimensional circuit board by electrophoretic deposition whereby a) providing the board with a conductive surface and b) applying a photoresist by electrophoretic deposition.

Abstract translation: 一种通过电泳沉积制造三维电路板的方法，其中a）为所述板提供导电表面，以及b）通过电泳沉积来施加光致抗蚀剂。

公开(公告)号：EP0421123A1

公开(公告)日：1991-04-10

申请号：EP90116660.3

申请日：1990-08-30

Applicant: SHIPLEY COMPANY INC.

Inventor： Rychwalski, James ,  Ciccolo, Paul J. ,  Couble, Edward C.

IPC: C23C18/26

CPC classification number: C23C26/00 ,  C23C18/26 ,  H05K1/0346 ,  H05K3/181 ,  H05K3/381 ,  Y10T428/31681

Abstract: A process for promoting the adhesion of metal to thermoplastic substrates such as polyimides. The improvement comprises conditioning the substrate by treating with a lactone and aqueous rinse prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of the cohesive integrity of the substrate throughout subsequent processing steps.

Abstract translation: 促进金属与热塑性基材如聚酰亚胺粘合的方法。 改进之处在于在蚀刻和沉积金属涂层之后的步骤之前，用内酯和含水漂洗液处理底物。 使用这种调理剂促进了基材和金属之间增加的粘合性，而在后续的加工步骤中不损失基材的内聚完整性。

公开(公告)号：EP0407951A2

公开(公告)日：1991-01-16

申请号：EP90113111.0

申请日：1990-07-10

Applicant: SHIPLEY COMPANY INC.

Inventor： D'Ottavio, Eugene D. ,  Hawkins, Robert E. ,  Rodriguez, Stephen S. ,  Rychwalski, James

IPC: G03F7/16

CPC classification number: H05K3/108 ,  G03F7/164 ,  H05K1/0284 ,  H05K3/062 ,  H05K3/064 ,  H05K2201/0347 ,  H05K2201/09118 ,  H05K2203/135

Abstract: A process for manufacturing a 3-dimensional circuit board by electrophoretic deposition whereby a) providing the board with a conductive surface and b) applying a photoresist by electrophoretic deposition.

Abstract translation: 一种用于由此a）提供所述板具有导电表面和b）通过电泳沉积施加光致抗蚀剂通过电泳沉积制造三维电路板的过程。