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公开(公告)号：EP0255557A3
公开(公告)日：1988-08-10
申请号：EP86112660
申请日：1986-09-12
Applicant: SHIPLEY COMPANY INC.
Inventor： Rodriquez, Stephen S. , Hawkins, Robert E.
CPC classification number: H05K3/061 , G03F7/00 , G03F7/164 , H05K1/117 , H05K3/108 , H05K3/243 , H05K2201/0355 , H05K2203/0582 , H05K2203/0723 , H05K2203/0783 , H05K2203/135
Abstract: A method for coating a conductive surface with an organic coating where one discrete area of the organic coating is coated onto the surface in an image pattern by conventional means and another discrete area of the organic coating is electrophoretically deposited onto the surface. The process is useful for diverse applications including the fabrication of printed circuit boards.
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公开(公告)号：EP0407951A2
公开(公告)日：1991-01-16
申请号：EP90113111.0
申请日：1990-07-10
Applicant: SHIPLEY COMPANY INC.
Inventor： D'Ottavio, Eugene D. , Hawkins, Robert E. , Rodriguez, Stephen S. , Rychwalski, James
IPC: G03F7/16
CPC classification number: H05K3/108 , G03F7/164 , H05K1/0284 , H05K3/062 , H05K3/064 , H05K2201/0347 , H05K2201/09118 , H05K2203/135
Abstract: A process for manufacturing a 3-dimensional circuit board by electrophoretic deposition whereby a) providing the board with a conductive surface and b) applying a photoresist by electrophoretic deposition.
Abstract translation: 一种用于由此a）提供所述板具有导电表面和b）通过电泳沉积施加光致抗蚀剂通过电泳沉积制造三维电路板的过程。
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公开(公告)号：EP0255557A2
公开(公告)日：1988-02-10
申请号：EP86112660.5
申请日：1986-09-12
Applicant: SHIPLEY COMPANY INC.
Inventor： Rodriquez, Stephen S. , Hawkins, Robert E.
CPC classification number: H05K3/061 , G03F7/00 , G03F7/164 , H05K1/117 , H05K3/108 , H05K3/243 , H05K2201/0355 , H05K2203/0582 , H05K2203/0723 , H05K2203/0783 , H05K2203/135
Abstract: A method for coating a conductive surface with an organic coating where one discrete area of the organic coating is coated onto the surface in an image pattern by conventional means and another discrete area of the organic coating is electrophoretically deposited onto the surface. The process is useful for diverse applications including the fabrication of printed circuit boards.
Abstract translation: 用有机涂层涂覆导电表面的方法，其中通过常规方法以有机涂层的一个离散区域以图像图案涂覆在表面上，并且有机涂层的另一离散区域电泳沉积到表面上。 该过程对于包括印刷电路板的制造在内的各种应用是有用的。
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公开(公告)号：EP0539714B1
公开(公告)日：1998-12-23
申请号：EP92116000.8
申请日：1992-09-18
Applicant: SHIPLEY COMPANY INC.
Inventor： Hawkins, Robert E. , Pai, Daniel Y.
CPC classification number: G03F7/164 , C09D5/44 , G03F7/032 , G03F7/038 , Y10S430/136
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Patent Agency Ranking
公开(公告)号：EP0539714A1
公开(公告)日：1993-05-05
申请号：EP92116000.8
申请日：1992-09-18
Applicant: SHIPLEY COMPANY INC.
Inventor： Hawkins, Robert E. , Pai, Daniel Y.
CPC classification number: G03F7/164 , C09D5/44 , G03F7/032 , G03F7/038 , Y10S430/136
Abstract: The invention provides radiation sensitive compositions that comprise an amphoteric polymer, the polymer comprising at least two distinct carrier groups so that the polymer is positively polarized or negatively polarized upon treatment with an acid or base, respectively, enabling the compositions to be electrodeposited either anaphoretically or cataphoretically. Employing this amphoteric polymer in a radiation sensitive composition also allows the use of either an acid or base solution to image and remove the deposited composition irrespective of whether the composition was applied cataphoretically or anaphoretically. The compositions of the invention are also suitably formulated as liquid coating compositions or used to form dry film resists.
Abstract translation: 本发明提供了包含两性聚合物的辐射敏感组合物，所述聚合物包含至少两个不同的载体基团，使得分别在用酸或碱处理时聚合物被正极化或负极化，使组合物可以通过阴离子或电沉积 cataphoretically。 在辐射敏感组合物中使用这种两性聚合物还允许使用酸或碱溶液来成像和除去沉积的组合物，而不管组合物是用阴离子或阴离子涂覆的。 本发明的组合物也适当地配制成液体涂料组合物或用于形成干膜抗蚀剂。
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公开(公告)号：EP0407951A3
公开(公告)日：1992-03-04
申请号：EP90113111.0
申请日：1990-07-10
Applicant: SHIPLEY COMPANY INC.
Inventor： D'Ottavio, Eugene D. , Hawkins, Robert E. , Rodriguez, Stephen S. , Rychwalski, James
IPC: G03F7/16
CPC classification number: H05K3/108 , G03F7/164 , H05K1/0284 , H05K3/062 , H05K3/064 , H05K2201/0347 , H05K2201/09118 , H05K2203/135
Abstract: A process for manufacturing a 3-dimensional circuit board by electrophoretic deposition whereby a) providing the board with a conductive surface and b) applying a photoresist by electrophoretic deposition.
Abstract translation: 一种通过电泳沉积制造三维电路板的方法，其中a）为所述板提供导电表面，以及b）通过电泳沉积来施加光致抗蚀剂。
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7.发明公开Method of controlling photoresist film thickness and stability of an electrodeposition bath 失效一种用于控制电沉积浴的光致抗蚀剂膜厚度和稳定性的方法。
公开(公告)号：EP0449022A2
公开(公告)日：1991-10-02
申请号：EP91103687.9
申请日：1991-03-11
Applicant: SHIPLEY COMPANY INC.
Inventor： Hawkins, Robert E. , Rodriguez, Stephen S.
IPC: G03F7/16
CPC classification number: G03F7/164 , H05K1/0266 , H05K3/0076 , H05K3/064 , H05K2203/122 , H05K2203/135
Abstract: It has been discovered that both water soluble or partially water soluble and water insoluble agents lower the operating temperature of electrodepositable photoresist compositions and substantially increase both lifetime stability and temperature stability of the bath.
These additives, because of their low volatility and their partition coefficients, essentially remain in the emulsion system and are removed upon codeposition with the photoresist where they act to improve film quality and control thickness.Abstract translation: 已经发现没有这两个水溶性或部分水溶性和不溶于水的药物降低电沉积光致抗蚀剂能够组合物的工作温度和大幅提高使用寿命都稳定性和浴的温度稳定性。 这些添加剂，因为它们的挥发性低，它们的分配系数的，本质上保持在乳液体系并且在与光致抗蚀剂在那里它们起作用以提高膜质量和厚度的控制码位置被除去。
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8.发明公开Electrodialysis cell for removal of excess electrolytes formed during electrodeposition of photoresist coatings 失效电渗析池，以除去过剩的电解质，这是在光致抗蚀剂涂层的电涂层形成。
公开(公告)号：EP0493644A1
公开(公告)日：1992-07-08
申请号：EP91100125.3
申请日：1991-01-03
Applicant: SHIPLEY COMPANY INC.
Inventor： Hawkins, Robert E. , Harrison, Richard L.
IPC: G03F7/16
CPC classification number: G03F7/164 , C25D13/24 , H05K3/0091 , Y10S204/13
Abstract: This invention provides a means of controlling the composition of electrodepositable photoresists emulsion. The system removes contaminants from the bath which may adversely effect the quality of the deposited coatings and allows for continuous monitoring of the conductivity of the system.
Abstract translation: 本发明提供一种控制电沉积光致抗蚀剂能乳化的组合物的方法。 该系统中移除从可能沉积的涂层的质量有不利影响，并允许连续监测系统的导电性的浴污染物。
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9.发明公开Method of controlling photoresist film thickness and stability of an electrodeposition bath 失效控制光电薄膜厚度和电沉积温度稳定性的方法
公开(公告)号：EP0449022A3
公开(公告)日：1992-03-11
申请号：EP91103687.9
申请日：1991-03-11
Applicant: SHIPLEY COMPANY INC.
Inventor： Hawkins, Robert E. , Rodriguez, Stephen S.
IPC: G03F7/16
CPC classification number: G03F7/164 , H05K1/0266 , H05K3/0076 , H05K3/064 , H05K2203/122 , H05K2203/135
Abstract: It has been discovered that both water soluble or partially water soluble and water insoluble agents lower the operating temperature of electrodepositable photoresist compositions and substantially increase both lifetime stability and temperature stability of the bath. These additives, because of their low volatility and their partition coefficients, essentially remain in the emulsion system and are removed upon codeposition with the photoresist where they act to improve film quality and control thickness.
Abstract translation: 已经发现水溶性或部分水溶性和水不溶性试剂都降低了可电沉积光致抗蚀剂组合物的操作温度，并且基本上提高了浴的寿命稳定性和温度稳定性。 这些添加剂由于它们的低挥发性和分配系数而基本上保留在乳液体系中，并且在与光致抗蚀剂共沉积时除去，其中它们用于提高膜质量和控制厚度。
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