利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

4 条记录 (耗时 0.008 秒)

    Multilayer wiring board and method for manufacturing the same
    3.
    发明公开
    Multilayer wiring board and method for manufacturing the same 失效
    Mehrschichtige gedruckte Leiterplatte und Verfahren zu ihrer Herstellung。

    公开(公告)号：EP0458293A1

    公开(公告)日：1991-11-27

    申请号：EP91108256.8

    申请日：1991-05-22

    申请人： SONY CORPORATION

    发明人： Yasuda, Nobuyuki ,  Tamura, Toshio ,  Toi, Hiroshi ,  Mishima, Akio

    IPC分类号： H05K3/46

    CPC分类号： H05K3/0044 ,  H05K1/115 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09809 ,  H05K2201/09845 ,  H05K2203/025 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A multilayer wiring board and a method for manufacturing the same are disclosed. The wiring board comprises an insulating substrate (1) having a first (3) and second conductor layers (4) formed on major surfaces of the insulating substrate, a blind hole (6) formed through the first conductor layer (3) and the insulating substrate (1) to expose the second conductor layer (4) at the bottom of the blind hole (6), and a connecting conductor (7) provided to cover the exposed surface of the second conductor layer (4) wall portion of the blind hole and the first conductor layer (3). Since the connecting conductor (7) and the second conductor (4) are made in surface contact, connection reliability is very much improved. The blind hole (6) is made by blasting a fine abrasive powder beam to selectively remove the insulating substrate (1). The end of selective removal can be easily controlled by the difference of working speed against the insulating substrate and the conductor layer to successfully expose the second conductor layer at the bottom of the blind hole.

    摘要翻译： 公开了一种多层布线板及其制造方法。 所述布线基板包括绝缘基板（1），所述绝缘基板（1）具有形成在所述绝缘基板的主表面上的第一导体层（3）和第二导体层（4），穿过所述第一导体层（3）形成的盲孔（6） 在所述盲孔（6）的底部露出所述第二导体层（4）的基板（1）和设置成覆盖所述盲孔的所述第二导体层（4）壁部的露出面的连接导体（7） 孔和第一导体层（3）。 由于连接导体（7）和第二导体（4）形成表面接触，所以连接可靠性得到非常大的改善。 盲孔（6）通过喷射细磨料粉末束以选择性地去除绝缘基板（1）而制成。 可以通过与绝缘基板和导体层的工作速度的差异容易地控制选择性去除的结束，以成功地暴露在盲孔底部的第二导体层。

    Multilayer printed circuit board and manufacturing method
    4.
    发明公开
    Multilayer printed circuit board and manufacturing method 失效
    Gedruckte Mehrschichtleiterplattte und Verfahren zu ihrer Herstellung。

    公开(公告)号：EP0481271A1

    公开(公告)日：1992-04-22

    申请号：EP91116590.0

    申请日：1991-09-27

    申请人： SONY CORPORATION

    发明人： Tamura, Toshio ,  Yasuda, Nobuyuki

    IPC分类号： H05K1/00 ,  H05K3/46

    CPC分类号： H05K3/4652 ,  H05K1/115 ,  H05K3/0044 ,  H05K3/429 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2203/025 ,  H05K2203/0554 ,  Y10T29/49126 ,  Y10T29/49165

    摘要： A multilayer wiring board is constructed of insulating substrates (2 1 to 2 3 ) and circuit patterns (3 0 to 3 3 ) formed thereon. The circuit patterns in different layers are electrically connected with each other by way of blind holes (61,52) and/or a through hole selectively extending through the circuit patterns and the insulating substrates. The blind holes and/or the through hole have different diameters depending on the depths of the blind holes and/or the through hole in such a manner that the larger the depth, the larger the diameter. A manufacturing method for such a multilayer wiring board includes the steps of forming a mask on one surface of the multilayer substrate, the mask having a plurality of apertures registered with the blind holes and/or the through hole to be formed later, the apertures having different diameters depending on the depths of the blind holes and/or the through hole in such a manner that the larger the depth, the larger the diameter; etching a portion of the multilayer substrate corresponding to the smallest aperture with use of an abrasive powder having a particle size smaller than the diameter of the smallest aperture; and gradually etching portions of the multilayer substrate corresponding to the other apertures with use of abrasive powders having particle sizes smaller than the diameters of the other apertures, respectively; whereby the blind holes having the respectively desired depths and/or the through hole are formed in the multilayer substrate.

    摘要翻译： 多层布线板由形成在其上的绝缘基板（21〜23）和电路图案（30〜33）构成。 不同层中的电路图案通过盲孔（51,52）和/或选择性延伸穿过电路图案和绝缘基板的通孔彼此电连接。 盲孔和/或通孔根据盲孔和/或通孔的深度具有不同的直径，使得深度越大，直径越大。 这种多层布线板的制造方法包括以下步骤：在多层基板的一个表面上形成掩模，所述掩模具有与稍后形成的盲孔和/或通孔对准的多个孔，所述孔具有 不同的直径取决于盲孔和/或通孔的深度，使得深度越大，直径越大; 使用具有小于最小孔径的粒径的磨料粉末蚀刻对应于最小孔径的多层衬底的一部分; 并分别使用粒径小于其它孔径的研磨粉末逐渐蚀刻对应于其它孔的多层基板的部分; 由此在多层基板中形成具有分别期望的深度和/或通孔的盲孔​​。