摘要:
A signal processing apparatus for reducing the quantisation noise by using two or more so-called noise shaping circuits (14a, 14b), is disclosed. The input signal may be audio or video signals. One of the noise shaping circuits (14a) is supplied with a signal which is the relative addition of the input signal and the dither while the other noise shaping circuit (14b) is supplied with a signal which is the relative subtraction of the input signal and the dither. The signal components of the outputs of the noise shaping circuits are effectively combined together to cancel the dither components to produce an output with an improved S/N ratio. A plurality of such signal processing apparatus may also be arranged in parallel (see figure 5), in which case different dithers are used in the respective signal processing apparatus and the outputs of the respective signal processing apparatus are combined to further improve the S/N ratio.
摘要:
A magnetic head position control apparatus for driving the magnetic head (2) of a disc recording apparatus toward or away from the recording surface of a magneto-optical disc (5) to effect position control of the magnetic head. Changes in the distance between the magnetic head and the magneto-optical disc are detected from changes in capacitance between a capacitance detection electrode (6) mounted on the magnetic head and a surface of the magneto-optical disc. An oscillator circuit (8) connected to the capacitance detection electrode varies its oscillation frequency in response to changes in capacitance and detects such frequency variations and controls the position of the magnetic head for maintaining it at a constant predetermined distance from the magneto-optical disc.
摘要:
An optical fiber (1) which transmits an optical signal is fixed to a plug (2) which connects to another apparatus by causing an expanded part created by melting the tip of the optical fiber (1) to flow into a fixing part (3) provided in the plug (2) and solidify.
摘要:
A sampling frequency converting apparatus according to present invention is such an apparatus in which, when a first digital signal of a sampling frequency Fsi is converted into a second digital signal of an arbitrary sampling frequency Fso by using a digital filter, the ratio between the sampling frequency Fsi and the sampling frequency Fso is obtained and this input/output sampling frequency ratio is utilized as a control amount for the sampling frequency conversion. The sampling frequency converting apparatus includes a buffer memory for temporarily storing the first digital signal, an operating means for performing an interpolation processing with respect to the input/output sampling frequency ratio at every regular time and a calculating means which calculates a read address of the buffer memory on the basis of the input/output sampling frequency ratio interpolated by the operating means.
摘要:
A sampling frequency converting apparatus according to present invention is such an apparatus in which, when a first digital signal of a sampling frequency Fsi is converted into a second digital signal of an arbitrary sampling frequency Fso by using a digital filter, the ratio between the sampling frequency Fsi and the sampling frequency Fso is obtained and this input/output sampling frequency ratio is utilized as a control amount for the sampling frequency conversion. The sampling frequency converting apparatus includes a buffer memory for temporarily storing the first digital signal, an operating means for performing an interpolation processing with respect to the input/output sampling frequency ratio at every regular time and a calculating means which calculates a read address of the buffer memory on the basis of the input/output sampling frequency ratio interpolated by the operating means.
摘要:
A multilayer wiring board and a method for manufacturing the same are disclosed. The wiring board comprises an insulating substrate (1) having a first (3) and second conductor layers (4) formed on major surfaces of the insulating substrate, a blind hole (6) formed through the first conductor layer (3) and the insulating substrate (1) to expose the second conductor layer (4) at the bottom of the blind hole (6), and a connecting conductor (7) provided to cover the exposed surface of the second conductor layer (4) wall portion of the blind hole and the first conductor layer (3). Since the connecting conductor (7) and the second conductor (4) are made in surface contact, connection reliability is very much improved. The blind hole (6) is made by blasting a fine abrasive powder beam to selectively remove the insulating substrate (1). The end of selective removal can be easily controlled by the difference of working speed against the insulating substrate and the conductor layer to successfully expose the second conductor layer at the bottom of the blind hole.