公开(公告)号：EP1038230A4

公开(公告)日：2003-03-26

申请号：EP98962112

申请日：1998-12-15

Applicant: STORAGE TECHNOLOGY CORP

Inventor： VAN KREVELEN CHRISTOPHER J ,  NELSON REED S ,  HODAPP DON J JR ,  HAMRE JOHN D

IPC: G06F15/177 ,  G06F13/36 ,  G06F13/362 ,  G06F13/40

CPC classification number: G06F13/36

Abstract: A method and system (10) for transmitting data among a plurality of cards (12a, 12b) in a crossbar interconnect network (30) having a plurality of cards (12a, 12b) each having source paths (16) and destination paths (14) utilizes a plurality of sources arbitrators (22) each associated with the cards. The source arbitrators generate connection request commands from the source paths requesting access to a desired destination of the destination paths and broadcasts the request for receipt by all of the destination arbitrators (24). The destination arbitrators (24) associated with the desired destination path captures the connection request command and processes the command based on whether or not the desired destination path is busy. If the desired destination path is not busy, the destination arbitrator (24) generates a connection command requesting a connection be made between the source path and the desired destination path. If the desired destination path is busy, the destination arbitrator (24) stores the connection request command in one of the plurality of buffers (20) until the desired destination path is available.

公开(公告)号：EP0914688A4

公开(公告)日：2000-01-05

申请号：EP97933340

申请日：1997-07-07

Applicant: STORAGE TECHNOLOGY CORP

Inventor： HAMRE JOHN D

IPC: H05K1/11 ,  H01P1/04 ,  H01P3/08 ,  H01P11/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H01P5/02

CPC classification number: H01P1/047 ,  H05K1/0219 ,  H05K3/361 ,  H05K2201/0715 ,  H05K2201/0919 ,  H05K2201/09354 ,  H05K2201/09618 ,  H05K2201/0979

Abstract: A ground plane interconnection is provided on first and second substrates (100, 112), the first and second substrates (100, 112) having respective first and second ground layers (110, 118) disposed on a first surface of each of the first and second substrates (100, 112). A ground conductor strip (120) is disposed on a second surface of the second substrate (112), wherein the ground conductor strip (120) includes a plurality of electrically conductive members (124) which pass through the second substrate (112) to electrically couple the ground conductor strip (120) and the second ground layer (118). The first substrate (100) is positioned with respect to the second substrate (112) such that when the first substrate (100) is placed proximate the second substrate (112), the ground conductor strip (120) electrically couples the first and second ground layers (110, 118) to form a continuous ground plane. A method of forming a reduced-inductance continuous ground plane is also provided.