公开(公告)号：EP2724464B1

公开(公告)日：2016-09-14

申请号：EP12730884.9

申请日：2012-06-20

Applicant: Microchip Technology Germany GmbH

Inventor： BURGER, Stefan

IPC: H03K17/955 ,  H05K1/00

CPC classification number: G01R1/0408 ,  H03K17/962 ,  H03K2017/9602 ,  H03K2217/960765 ,  H03K2217/960775 ,  H05K1/162 ,  H05K2201/0919 ,  H05K2201/09672 ,  H05K2201/10151

Abstract: A printed circuit board (P) has an evaluation device (E) and an electrode configuration of a capacitive sensor, wherein the electrode configuration has at least two electrodes, one arranged above the other and spaced apart from each other, which each are formed by portions of at least one electrically conductive layer of the printed circuit board (P), and wherein at least one electrode of the electrode configuration is coupled with the evaluation device (E) via a conductor path of the printed circuit board (P). Furthermore, an electric handheld device may have at least one such printed circuit board (P).

Abstract translation: 印刷电路板（P）具有评价装置（E）和电容式传感器的电极结构，其中，电极结构具有至少两个电极，一个彼此并排设置并彼此间隔开，每个电极由 所述印刷电路板（P）的至少一个导电层的部分，并且其中所述电极构造的至少一个电极经由所述印刷电路板（P）的导体路径与所述评估装置（E）耦合。 此外，电动手持装置可以具有至少一个这样的印刷电路板（P）。

公开(公告)号：EP2832192A2

公开(公告)日：2015-02-04

申请号：EP13716915.7

申请日：2013-03-28

Applicant: Keyssa, Inc.

Inventor： SOVERO, Emilio ,  MCCORMACK, Gray D.

IPC: H05K1/02 ,  H01Q7/00 ,  H01Q1/48 ,  H01P3/12 ,  H01P3/00 ,  H01Q1/24

CPC classification number: H01Q13/103 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01P3/006 ,  H01P3/121 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q7/00 ,  H05K1/0218 ,  H05K1/0274 ,  H05K2201/0191 ,  H05K2201/0919 ,  H05K2201/09618 ,  H05K2201/09845 ,  H05K2201/2036 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A system for transmitting or receiving signals may include a dielectric substrate having a major face, a communication circuit, and an electromagnetic-energy directing assembly. The circuit may include a transducer configured to convert between RF electrical and RF electromagnetic signals and supported in a position spaced from the major face of the substrate operatively coupled to the transducer. The directing assembly may be supported by the substrate in spaced relationship from the transducer and configured to direct EM energy in a region including the transducer and along a line extending away from the transducer and transverse to a plane of the major face.

Abstract translation: 用于发送或接收信号的系统可以包括具有主面的电介质基板，通信电路和电磁能指导组件。 电路可以包括被配置为在RF电和RF电磁信号之间转换并被支持在与可操作地耦合到换能器的衬底的主面间隔开的位置的换能器。 引导组件可以由与换能器间隔开的基板支撑，并且被构造成在包括换能器的区域中沿着远离换能器延伸并横向于主面平面的线引导EM能量。

公开(公告)号：EP2683225A1

公开(公告)日：2014-01-08

申请号：EP11860278.8

申请日：2011-12-12

Applicant: Olympus Corporation

Inventor： FUJIMORI Noriyuki

IPC: H05K1/11 ,  A61B1/04 ,  G03B17/02 ,  H04N5/225 ,  H05K3/46

CPC classification number: H05K1/181 ,  A61B1/0011 ,  A61B1/051 ,  H04N5/2251 ,  H05K1/18 ,  H05K1/186 ,  H05K3/0052 ,  H05K3/10 ,  H05K3/403 ,  H05K3/4602 ,  H05K2201/0919 ,  H05K2201/10121 ,  H05K2201/10356 ,  H05K2201/10416 ,  H05K2201/10446 ,  Y10T29/49162

Abstract: A wiring board 10 includes a plurality of wiring layers 22, a plurality of insulating layers 23, and an electrode member 20 made of a conductive material, the electrode member 20 being incorporated in the wiring board 10 in a state in which the electrode member 20 includes exposed sections 20S on side surfaces 13 and 14 that cross the plurality of wiring layers 22 and the plurality of insulating layers 23.

Abstract translation: 布线基板10具有多个布线层22，多个绝缘层23和由导电材料制成的电极构件20，电极构件20在电极构件20的状态下配置在布线基板10中 包括穿过多个布线层22和多个绝缘层23的侧表面13和14上的暴露部分20S。

公开(公告)号：EP2451259A1

公开(公告)日：2012-05-09

申请号：EP10820151.8

申请日：2010-09-30

Applicant: Panasonic Corporation

Inventor： KASHIWAGI, Takafumi ,  SAKAI, Yukio ,  TADA, Nobuhiro ,  HIRUMA, Takayuki

IPC: H05K3/46 ,  H01L23/00 ,  H01L23/28

CPC classification number: H05K3/284 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/1531 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/0919 ,  H05K2201/09309 ,  H05K2203/1316 ,  Y10T29/4913 ,  H01L2224/81 ,  H01L2924/00012

Abstract: A module including a circuit board including an insulating layer and one or more layers of copper foil embedded in the insulating layer; an electronic component mounted on the circuit board; a sealing part sealing the electronic component on the circuit board; and a metal film covering side surfaces of the circuit board and surfaces of the sealing part. A part of the copper foil is exposed to the side surfaces of the circuit board, an exposed part of the copper foil has a width of less than 200 µm, and the copper foil and the metal film are electrically coupled to each other through the exposed part. Thus, occurrence of blushing, crack, or the like, can be prevented.

Abstract translation: 一种模块，包括：电路板，包括绝缘层和一层或多层嵌入绝缘层中的铜箔; 安装在电路板上的电子部件; 密封电路板上的电子部件的密封部; 以及覆盖电路板的侧面和密封部的表面的金属膜。 铜箔的一部分暴露于电路板的侧面，铜箔的露出部分的宽度小于200μm，铜箔和金属膜通过曝光 部分。 因此，可以防止发生白化，裂纹等。

公开(公告)号：EP1569501B1

公开(公告)日：2011-11-23

申请号：EP05101438.9

申请日：2005-02-25

Applicant: EUROTECH SpA

Inventor： Rossi, Mauro

IPC: H05K1/14 ,  H05K7/14 ,  H05K7/00

CPC classification number: H05K1/117 ,  H01R12/523 ,  H01R12/721 ,  H05K3/4611 ,  H05K2201/09127 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2203/061

公开(公告)号：EP2200411A1

公开(公告)日：2010-06-23

申请号：EP08172223.3

申请日：2008-12-19

Applicant: Siemens Aktiengesellschaft

Inventor： Chowaniec, Michael ,  Rohne, Klaus

IPC: H05K1/11 ,  H05K3/46

CPC classification number: H05K1/117 ,  H05K3/4611 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2203/1572

Abstract: Um bei einer Leiterplatte (20) umfassend einen aus einer Mehrzahl von Strukturschichten (1,...,9) ausgebildeten Lagenaufbau, eine Packungsdichte für ein Steckmittel zur Kontaktierung über Kontaktflächen, welche mit den Leiterbahnen (24) in Verbindung stehen, wird vorgeschlagen, dass die Strukturschichten (1,...,9) in einem Randbereich als ein treppenförmiges Profil zur Aufnahme des Steckmittels ausgebildet sind.

Abstract translation: 印刷电路板（20）包括由多个结构层（1,2,3,4,5,6,7,8,9）形成的层序列。 结构层以位移方式一起布置在边缘区域中，使得阶梯形轮廓支撑插塞装置（22）。 中间层布置在承载从最大点和从纵向轴线（L）的中心点出来的导电路径（24）的层上。

公开(公告)号：EP1413178B1

公开(公告)日：2010-01-06

申请号：EP02750400.0

申请日：2002-08-02

Applicant: SanDisk Corporation

Inventor： WALLACE, Robert, F.

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0256 ,  G06K19/077 ,  G06K19/07732 ,  G06K19/07735 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0259 ,  H05K1/0268 ,  H05K1/0298 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/242 ,  H05K2201/0919 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/0969 ,  H05K2203/175 ,  H01L2924/00014

Abstract: A card manufacturing technique and the resulting card are provided. The card has a ground and/or power layer (112) extending to the edges of a circuit board for electrostatic discharge protection but also has gaps (112a) at the edge of the ground and/or power layer (112) to avoid short circuiting with conductive segments (160) of another layer deformed when the card is trimmed during manufacture.

公开(公告)号：EP2091309A2

公开(公告)日：2009-08-19

申请号：EP08172276.1

申请日：2008-12-19

Applicant: Nitto Denko Corporation

Inventor： Takemura, Keiji, Nitto Denko Corporation

IPC: H05K3/10

CPC classification number: H05K3/108 ,  H05K1/056 ,  H05K3/0082 ,  H05K3/28 ,  H05K3/44 ,  H05K2201/0919 ,  H05K2203/0156 ,  H05K2203/0597

Abstract: A producing method of a wired circuit board includes the steps of preparing a two-layer base material including a metal supporting layer and an insulating layer, covering an upper surface of the insulating layer and respective side end surfaces of the insulating layer and the metal supporting layer with a photoresist, placing a photomask so as to light-shield an end portion and a portion where a conductive layer is to be formed of the upper surface, exposing to light the photoresist covering the upper surface from above the photoresist via the photomask, exposing to light the photoresist covering the respective side end surfaces from below the photoresist, forming an exposed portion of the photoresist into a pattern by removing an unexposed portion thereof to form a plating resist, and forming an end-portion conductive layer and the conductive layer.

Abstract translation: 一种布线电路基板的制造方法，其特征在于，包括：准备由金属支承层和绝缘层构成的2层基材，覆盖所述绝缘层的上表面和所述绝缘层的各侧端面和所述金属支承体 将光掩模放置在光掩模上，以遮蔽上表面的端部和将要形成导电层的部分，使经光掩模从光致抗蚀剂上方覆盖光致抗蚀剂的光暴露， 使光致抗蚀剂从光致抗蚀剂的下方覆盖各侧端面，通过除去其未曝光部分而形成图案，从而形成图案的光致抗蚀剂的曝光部分，以形成电镀抗蚀剂，并且形成端部导电层和导电层 。

公开(公告)号：EP1523869A1

公开(公告)日：2005-04-20

申请号：EP03762159.6

申请日：2003-06-27

Applicant: PPG Industries Ohio, Inc.

Inventor： WANG, Alan E. ,  OLSON, Kevin C.

IPC: H05K3/44 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K3/44 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2201/0909 ,  H05K2201/0919 ,  H05K2201/09554 ,  H05K2203/135 ,  Y10T29/49126 ,  Y10T29/49156 ,  Y10T29/49167 ,  Y10T428/12361 ,  Y10T428/24322

Abstract: Provided is a process for creating vias for a circuit assembly including the steps of (a) applying a curable coating composition to a substrate, some or all of which is electrically conductive, to form an uncured coating thereon; (b) applying a resist over the uncured coating; (c) imaging the resist in predetermined locations; (d) developing the resist to expose predetermined areas of the uncured coating; (e) removing the exposed areas of the uncured coating; and (f) heating the coated substrate of step (e) to a temperature and for a time sufficient to cure the coating. Also disclosed is a process of fabricating a circuit assembly.

公开(公告)号：EP1415813A2

公开(公告)日：2004-05-06

申请号：EP03256804.0

申请日：2003-10-28

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Akhavin, Mohammad ,  Markwell, Stanley G. ,  Horvath, Janis ,  Scheffelin, Jospeh E.

IPC: B41J2/16 ,  H01L23/00

CPC classification number: H05K3/28 ,  B41J2/16 ,  B41J2/1623 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0298 ,  H05K1/0306 ,  H05K3/242 ,  H05K2201/0919 ,  H05K2203/1147 ,  H01L2924/00014

Abstract: Methods and systems of protecting substrates (200) that are intended for use in fluidic devices are described. In accordance with one embodiment, sealant material is applied over one or more edges (202) of at least one multichip module substrate (142) that is intended for use in a fluidic device. At least one edge (202) has an exposed electrical interconnect (108) and the sealant material is applied over less than an entirety of the substrate (142) and sufficiently to cover the exposed electrical interconnect. The sealant material is exposed to conditions effective to seal the one or more edges.

Abstract translation: 将诸如粘合片的密封剂施加到多层陶瓷基板（100）的边缘上，使得覆盖在基板的边缘处暴露的电镀连接杆等电互连。 然后将密封剂暴露于有效地密封基底的边缘的条件下。 还包括以下独立权利要求：（1）流体喷射装置; 和（2）流体喷射系统。